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US4994300A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of making a cover tape for sealing chip-holding parts of carrier tape

Assignee: Lintec Corp
•
Filing: 1989-12-07
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Granted: 1991-02-19
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Expires: 2009-12-07
📄 Original PDF 🌐 Google Patents

Abstract

Abstract A cover tape for sealing chips in chip-holding parts of a carrier tape having said parts provided intermittently and longitudinally of said carrier tape, which cover is constituted by a base tape, an adhesive layer formed on one surface of said base tape and a non-adhesive coat formed on said adhesive along the longitudinal direction of said base tape so that said non-adhesive coat has a width greater than that of the chips and less than that of said adhesive layer. When the cover tape is used in combination with the carrier tape, the chip-holding parts are sealed by the cover tape having the non-adhesive coat and in consequence the chips held in the chip-holding parts do not come in contact with the adhesive layer although they might come in contact with the non-adhesive coat. Accordingly, the chips are not stained by the adhesive in the adhesive layer.

Inventors

  • 👤 Kazumi Itou
  • 👤 Kazuyoshi Ebe
  • 👤 Toshio Minagawa

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-07 23:22
CPC Classifications
H; H05; H05K; H05K13/00; H05K13/003; B; B65; B65D; B65D73/00; B65D73/02; B65D75/00; B65D75/28; B65D75/30; B65D75/32; B65D75/325; B65D75/327; B65D75/34; B65D2575/00; B65D2575/28; B65D2575/30; B65D2575/32; B65D2575/3209; B65D2575/3218; B65D2575/3245; Y; Y10; Y10T; Y10T428/00; Y10T428/28; Y10T428/2813; Y10T428/2817; Y10T428/2839; Y10T428/2848

Claims Analysis

Total Claims: 10
Claim 1
Independent Claim 88 words
A process for the preparation of a cover tape for sealing chips in chip-holding parts of a carrier tape having said parts provided intermittently and longitudinally of said carrier tape, which process comprises: forming an adhesive layer on only one surface of a base tape; and pattern-printing a non-adhesive layer containing oxidation-curable ink on said adhesive layer centrally along the longitudinal direction of said base tape so that said non-adhesive layer has a width greater than that of the chips and less than that of said adhesive layer.
Claim 2
Dependent Claim 88 words
A process for the preparation of a cover tape for sealing chips in chip-holding parts of a carrier tape having said parts provided intermittently and longitudinally of said carrier tape, which process comprises: forming an adhesive layer on only one surface of a base tape; and pattern-printing a non-adhesive layer containing oxidation-curable ink on said adhesive layer centrally along the longitudinal direction of said base tape so that said non-adhesive layer has a width greater than that of the chips and less than that of said adhesive layer.
Claim 3
Dependent Claim 14 words
The process according to claim 1 wherein said adhesive layer comprises a pressure-sensitive adhesive.
Claim 4
Dependent Claim 14 words
The process according to claim 1 wherein said adhesive layer comprises a heat-sensitive adhesive.
Claim 5
Dependent Claim 88 words
A process for the preparation of a cover tape for sealing chips in chip-holding parts of a carrier tape having said parts provided intermittently and longitudinally of said carrier tape, said process comprising the steps of: forming an adhesive layer on only one surface of a base tape; and pattern-printing a non-adhesive layer containing antistatic agent on said adhesive layer centrally along the longitudinal direction thereof so that said non-adhesive layer has a width greater than that of the chips and less than that of said adhesive layer.
Claim 6
Dependent Claim 88 words
A process for the preparation of a cover tape for sealing chips in chip-holding parts of a carrier tape having said parts provided intermittently and longitudinally of said carrier tape, said process comprising the steps of: forming an adhesive layer on only one surface of a base tape; and pattern-printing a non-adhesive layer containing antistatic agent on said adhesive layer centrally along the longitudinal direction thereof so that said non-adhesive layer has a width greater than that of the chips and less than that of said adhesive layer.
Claim 7
Dependent Claim 104 words
A process for the preparation of a cover tape for sealing chips in chip-holding parts of a carrier tape having said parts provided intermittently and longitudinally of said carrier tape, said process comprising the steps of: forming an adhesive layer on only one surface of a base tape; pattern-printing a layer of a radiation-curable ink on said adhesive layer centrally along the longitudinal direction thereof so that said non-adhesive layer has a width greater than that of the chips and less than that of said adhesive layer; and irradiating the printed layer so as to cure the ink and render the printed layer non-adhesive.
Claim 8
Dependent Claim 104 words
A process for the preparation of a cover tape for sealing chips in chip-holding parts of a carrier tape having said parts provided intermittently and longitudinally of said carrier tape, said process comprising the steps of: forming an adhesive layer on only one surface of a base tape; pattern-printing a layer of a radiation-curable ink on said adhesive layer centrally along the longitudinal direction thereof so that said non-adhesive layer has a width greater than that of the chips and less than that of said adhesive layer; and irradiating the printed layer so as to cure the ink and render the printed layer non-adhesive.
Claim 9
Dependent Claim 16 words
The process according to claim 4 or 5 wherein said adhesive layer comprises a pressure-sensitive adhesive.
Claim 10
Dependent Claim 16 words
The process according to claim 4 or 5 wherein said adhesive layer comprises a heat-sensitive adhesive.

References Cited (Backward Citations)

US2307406A Cited
US2565509A Cited
US2829073A Cited
US3608711A Cited
US3780856A Cited
DE2439679A1 Cited
US4211329A Cited
FR2455273A2 Cited
EP0066339A2 Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1994-02-18 1994-08-20 1995-02-19 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1998-02-18 1998-08-20 1999-02-19 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2002-02-18 2002-08-20 2003-02-19 $7700.00 Window Closed / Lapsed

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