Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
88 words
A process for the preparation of a cover tape for sealing chips in chip-holding parts of a carrier tape having said parts provided intermittently and longitudinally of said carrier tape, which process comprises: forming an adhesive layer on only one surface of a base tape; and pattern-printing a non-adhesive layer containing oxidation-curable ink on said adhesive layer centrally along the longitudinal direction of said base tape so that said non-adhesive layer has a width greater than that of the chips and less than that of said adhesive layer.
Claim 2
Dependent Claim
88 words
A process for the preparation of a cover tape for sealing chips in chip-holding parts of a carrier tape having said parts provided intermittently and longitudinally of said carrier tape, which process comprises: forming an adhesive layer on only one surface of a base tape; and pattern-printing a non-adhesive layer containing oxidation-curable ink on said adhesive layer centrally along the longitudinal direction of said base tape so that said non-adhesive layer has a width greater than that of the chips and less than that of said adhesive layer.
Claim 3
Dependent Claim
14 words
The process according to claim 1 wherein said adhesive layer comprises a pressure-sensitive adhesive.
Claim 4
Dependent Claim
14 words
The process according to claim 1 wherein said adhesive layer comprises a heat-sensitive adhesive.
Claim 5
Dependent Claim
88 words
A process for the preparation of a cover tape for sealing chips in chip-holding parts of a carrier tape having said parts provided intermittently and longitudinally of said carrier tape, said process comprising the steps of: forming an adhesive layer on only one surface of a base tape; and pattern-printing a non-adhesive layer containing antistatic agent on said adhesive layer centrally along the longitudinal direction thereof so that said non-adhesive layer has a width greater than that of the chips and less than that of said adhesive layer.
Claim 6
Dependent Claim
88 words
A process for the preparation of a cover tape for sealing chips in chip-holding parts of a carrier tape having said parts provided intermittently and longitudinally of said carrier tape, said process comprising the steps of: forming an adhesive layer on only one surface of a base tape; and pattern-printing a non-adhesive layer containing antistatic agent on said adhesive layer centrally along the longitudinal direction thereof so that said non-adhesive layer has a width greater than that of the chips and less than that of said adhesive layer.
Claim 7
Dependent Claim
104 words
A process for the preparation of a cover tape for sealing chips in chip-holding parts of a carrier tape having said parts provided intermittently and longitudinally of said carrier tape, said process comprising the steps of: forming an adhesive layer on only one surface of a base tape; pattern-printing a layer of a radiation-curable ink on said adhesive layer centrally along the longitudinal direction thereof so that said non-adhesive layer has a width greater than that of the chips and less than that of said adhesive layer; and irradiating the printed layer so as to cure the ink and render the printed layer non-adhesive.
Claim 8
Dependent Claim
104 words
A process for the preparation of a cover tape for sealing chips in chip-holding parts of a carrier tape having said parts provided intermittently and longitudinally of said carrier tape, said process comprising the steps of: forming an adhesive layer on only one surface of a base tape; pattern-printing a layer of a radiation-curable ink on said adhesive layer centrally along the longitudinal direction thereof so that said non-adhesive layer has a width greater than that of the chips and less than that of said adhesive layer; and irradiating the printed layer so as to cure the ink and render the printed layer non-adhesive.
Claim 9
Dependent Claim
16 words
The process according to claim 4 or 5 wherein said adhesive layer comprises a pressure-sensitive adhesive.
Claim 10
Dependent Claim
16 words
The process according to claim 4 or 5 wherein said adhesive layer comprises a heat-sensitive adhesive.