US4996136A
Expired / Lapsed
US
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Radiation sensitive materials and devices made therewith
Assignee: Agere Systems LLC
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Filing: 1989-02-24
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Granted: 1991-02-26
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Expires: 2009-02-24
Abstract
Abstract Sensitive deep ultraviolet resists are formed utilizing a material that undergoes decomposition to form an acid together with a polymer including a chain scission inducing monomer such as sulfonyl units and substituent that undergoes reaction to form an acidic moiety when subjected to the photogenerated species. An exemplary composition includes poly(t-butoxycarbonyloxystyrenesulfone) and 2,6-dinitrobenzyl-p-toluene sulfonate. The sulfonate decomposes to form sulfonic acid upon irradiation. This acid reacts with the polymer group to form an acid functionality while the sulfone moiety of the polymer induces scission. As a result, the irradiated portions of the resist material are soluble in ionic solvents while the unirradiated portions are not.
Inventors
- 👤 Francis M. Houlihan
- 👤 Elsa Reichmanis
- 👤 Larry F. Thompson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 02:48
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/004; G03F7/039; Y; Y10; Y10S; Y10S430/00; Y10S430/146
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
184 words
A process for fabricating a device comprising the steps of forming a radiation sensitive region on a substrate, exposing said region to said radiation to form a pattern, developing said pattern, and employing said pattern to define areas of said device, characterized in that said radiation sensitive region comprises a material including (1) a polymer composition represented by the formula: ##STR6## where R 1 is chosen from the group consisting of H, lower alkyl ad lower alkyl derivatives, where D comprises a backbone scission inducing moiety located in said backbone, where R 3 is chosen from the group consisting of H, Cl, Br, lower alkyl, and lower alkyl derivatives, where R 2 is chosen such that the O--R 2 bond cleaves in the presence of acid to form a carbonium ion that is sufficiently stable to eliminate an available α-hydrogen, and where x and y indicate the relative proportions of said scission moiety to chain moiety without implying ordering of moieties in the chain, and (2) a composition that results in generation of an acidic moiety as a result of irradiation with said radiation.
Claim 2
Dependent Claim
184 words
A process for fabricating a device comprising the steps of forming a radiation sensitive region on a substrate, exposing said region to said radiation to form a pattern, developing said pattern, and employing said pattern to define areas of said device, characterized in that said radiation sensitive region comprises a material including (1) a polymer composition represented by the formula: ##STR6## where R 1 is chosen from the group consisting of H, lower alkyl ad lower alkyl derivatives, where D comprises a backbone scission inducing moiety located in said backbone, where R 3 is chosen from the group consisting of H, Cl, Br, lower alkyl, and lower alkyl derivatives, where R 2 is chosen such that the O--R 2 bond cleaves in the presence of acid to form a carbonium ion that is sufficiently stable to eliminate an available α-hydrogen, and where x and y indicate the relative proportions of said scission moiety to chain moiety without implying ordering of moieties in the chain, and (2) a composition that results in generation of an acidic moiety as a result of irradiation with said radiation.
Claim 3
Dependent Claim
63 words
The process of claim 1 wherein said acid generator comprises a material represented by the formula ##STR7## where R is not acidic, R' comprises a member of the group consisting of H and CH 3 and Y comprises a member of the group consisting of ##STR8## where R 6 comprises a member chosen from the group consisting of H and CH 3 .
Claim 4
Dependent Claim
12 words
The process of claim 2 wherein said radiation comprises deep ultraviolet radiation.
Claim 5
Dependent Claim
15 words
The process of claim 3 wherein the sources of said radiation comprises an excimer laser.
Claim 6
Dependent Claim
19 words
The process of claim 2 wherein the ratio of x to y is in the range 1:1 to 1:10.
Claim 7
Dependent Claim
26 words
The process of claim 5 wherein the relative concentration between said acid generator and said polymer composition is in the range 0.5 to 50 weight percent.
Claim 8
Dependent Claim
14 words
The process of claim 2 wherein said radiation sensitive region is formed by spinning.
Claim 9
Dependent Claim
16 words
The process of claim 2 wherein said step of employing said pattern comprises etching or metallization.
Claim 10
Dependent Claim
12 words
The process of claim 1 wherein said radiation comprises deep ultraviolet radiation.
Claim 11
Dependent Claim
15 words
The process of claim 9 wherein the source of said radiation comprises an excimer laser.
Claim 12
Dependent Claim
19 words
The process of claim 9 wherein the ratio of x to y is in the range 1:1 to 1:10.
Claim 13
Dependent Claim
26 words
The process of claim 11 wherein the relative concentration between said acid generator and said polymer composition is in the range 0.5 to 50 weight percent.
Claim 14
Dependent Claim
14 words
The process of claim 1 wherein said radiation sensitive material is formed by spinning.
Claim 15
Dependent Claim
16 words
The process of claim 1 wherein said step of employing said pattern comprises etching or metallization.
Claim 16
Dependent Claim
20 words
The process of claim 1 wherein R 2 is chosen from the group consisting of t-butyl, t-butoxycarbonyl, t-amyloxycarbonyl, and 2-methyl-3-trimethylsilyl-2-propanyloxycarbonyl.
Claim 17
Dependent Claim
60 words
The process of claim 1 wherein said acid generator comprises a material represented by the formula ##STR9## where R is not acidic R' comprises a member of the group consisting of Hand CH 3 and Y is chosen so that it requires a temperature of at least 75° C. to cause its removal from the remainder of said acid generator.
Claim 18
Dependent Claim
38 words
The process of claim 16 wherein Y is chosen from the group consisting of ##STR10## where R 6 comprises a member of the group consisting of lower alkoxy, fluorine, chlorine, NO 2 , nitrile, acetoxy and lower alkyl.
Claim 19
Dependent Claim
122 words
A process for fabricating a device comprising the steps of forming a radiation sensitive region on a substrate, exposing said region to said radiation to form a pattern, developing said pattern, and employing said pattern to define areas of said device, characterized in that said radiation sensitive region comprises a material including (1) a material that undergoes a reaction in response to an acidic moiety and (2) an acid generating material represented by the formula ##STR11## where R is not acidic, R' comprises a member of the group consisting of H and CH 3 and Y comprises a member of the group consisting of ##STR12## where R 6 comprises a member chosen from the group consisting of H and CH 3 .
Claim 20
Dependent Claim
122 words
A process for fabricating a device comprising the steps of forming a radiation sensitive region on a substrate, exposing said region to said radiation to form a pattern, developing said pattern, and employing said pattern to define areas of said device, characterized in that said radiation sensitive region comprises a material including (1) a material that undergoes a reaction in response to an acidic moiety and (2) an acid generating material represented by the formula ##STR11## where R is not acidic, R' comprises a member of the group consisting of H and CH 3 and Y comprises a member of the group consisting of ##STR12## where R 6 comprises a member chosen from the group consisting of H and CH 3 .
Claim 21
Dependent Claim
15 words
The process of claim 18 wherein said step employing said pattern comprises etching or metallization.
Claim 22
Dependent Claim
120 words
A process for fabricating a device comprising the steps of forming a radiation sensitive region on a substrate, exposing said region to said radiation to form a pattern, developing said pattern, and employing said pattern to define areas of said device, characterized in that said radiation sensitive region comprises a material including (1) a material that undergoes a reaction in response to an acidic moiety and (2) an acid generating material represented by the formula ##STR13## where R is not acidic, R' comprises a member of the group existing of H and CH 3 and Y is chosen such that it requires a temperature of at least 75° C. to cause its removal from the remainder of said acid generator.
Claim 23
Dependent Claim
120 words
A process for fabricating a device comprising the steps of forming a radiation sensitive region on a substrate, exposing said region to said radiation to form a pattern, developing said pattern, and employing said pattern to define areas of said device, characterized in that said radiation sensitive region comprises a material including (1) a material that undergoes a reaction in response to an acidic moiety and (2) an acid generating material represented by the formula ##STR13## where R is not acidic, R' comprises a member of the group existing of H and CH 3 and Y is chosen such that it requires a temperature of at least 75° C. to cause its removal from the remainder of said acid generator.
Claim 24
Dependent Claim
38 words
The process of claim 20 wherein Y is chosen from the group consisting of ##STR14## where R 6 comprises a member of the group consisting of lower alkoxy, fluorine, chlorine, NO 2 , nitrile, acetoxy, and lower alkyl.
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