US4997606A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Methods and apparatus for fabricating a high purity thermally-conductive polymer layer
Assignee: Varian Semiconductor Equipment Associates Inc
•
Filing: 1989-10-10
•
Granted: 1991-03-05
•
Expires: 2009-10-10
Abstract
Abstract Thermal transfer between a semiconductor wafer and a platen during vacuum processing is provided through a soft, thermally-conductive polymer layer having a thin, hard surface film. The soft polymer layer, which is preferably silicon rubber containing thermally-conductive particles, conforms to surface irregularities on the wafer and has low thermal resistance. The surface film is preferably silicon dioxide in the form of a multiplicity of flat plates integrally formed on the silicone rubber. Adherence of the wafer and of foreign matter to the polymer layer is prevented by the surface film. In addition, the underlying polymer layer is protected by the surface film. A high purity polymer layer is fabricated by evacuating the mold cavity and the resin container prior to injection of resin. The mold for the polymer layer utilizes a hard, smooth mold release surface and a resilient gasket between the platen and the mold release surface. The gasket establishes the dimensions of the polymer layer and seals the mold cavity. The surface film is formed by oxygen plasma treatment of the silicone rubber layer.
Inventors
- 👤 Eric L. Mears
- 👤 Keith D. Pierce
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:53
CPC Classifications
B; B29; B29C; B29C39/00; B29C39/22; B29C39/42; B29C39/24; Y; Y10; Y10S; Y10S264/00; Y10S264/78
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
196 words
A method for fabricating apparatus for thermal transfer with a semiconductor wafer, comprising the steps of: providing a thermally-conductive platen including a heat transfer surface; forming a mold on said heat transfer surface, said mold defining a mold cavity for a thermally-conductive polymer layer, said mold cavity being defined in part by a portion of said heat transfer surface; coupling a container for resin for said polymer layer and said mold cavity together with a tube; evacuating said container and thereby evacuating said mold cavity via said tube; subsequently immersing one end of said tube in said resin for said polymer layer; then injecting resin for said polymer layer into said mold cavity by pressurizing a space in said container above said resin for said polymer layer so as to force said resin through said tube into said evacuated mold cavity; and allowing the resin for said polymer layer to cure in said mold cavity while in contact with a mold surface remote from said heat transfer surface, said mold surface causing the formation on said portion of said heat transfer surface of a polymer layer having an optically flat surface for contacting a semiconductor wafer.
Claim 2
Independent Claim
196 words
A method for fabricating apparatus for thermal transfer with a semiconductor wafer, comprising the steps of: providing a thermally-conductive platen including a heat transfer surface; forming a mold on said heat transfer surface, said mold defining a mold cavity for a thermally-conductive polymer layer, said mold cavity being defined in part by a portion of said heat transfer surface; coupling a container for resin for said polymer layer and said mold cavity together with a tube; evacuating said container and thereby evacuating said mold cavity via said tube; subsequently immersing one end of said tube in said resin for said polymer layer; then injecting resin for said polymer layer into said mold cavity by pressurizing a space in said container above said resin for said polymer layer so as to force said resin through said tube into said evacuated mold cavity; and allowing the resin for said polymer layer to cure in said mold cavity while in contact with a mold surface remote from said heat transfer surface, said mold surface causing the formation on said portion of said heat transfer surface of a polymer layer having an optically flat surface for contacting a semiconductor wafer.
Claim 3
Dependent Claim
23 words
A method as defined in claim 1 wherein said step of injecting comprises injecting said resin through said platen into said mold cavity.
Claim 4
Dependent Claim
27 words
A method as defined in claim 1 further including the step of resiliently sealing said portion of said heat transfer surface to a portion of said mold.
Claim 5
Dependent Claim
38 words
A method as defined in claim 1 further including the step of introducing thermally conductive particles into said resin prior to curing, said mold surface preventing said thermally-conductive particles from protruding above the surface of said polymer layer.
Claim 6
Independent Claim
113 words
A method for fabricating a polymer layer comprising the steps of: forming a mold that defines a mold cavity for forming said polymer layer; placing resin for said polymer layer in an enclosed container; coupling said container and said mold cavity with a tube; evacuating said enclosed container and thereby evacuating said mold cavity via said tube; causing relative movement between one end of said tube and said container so that said one end is immersed in said resin; and then pressurizing a space in said container above the resin for said polymer layer so as to force the resin through said tube into said evacuated mold cavity and form said polymer layer.
Claim 7
Independent Claim
113 words
A method for fabricating a polymer layer comprising the steps of: forming a mold that defines a mold cavity for forming said polymer layer; placing resin for said polymer layer in an enclosed container; coupling said container and said mold cavity with a tube; evacuating said enclosed container and thereby evacuating said mold cavity via said tube; causing relative movement between one end of said tube and said container so that said one end is immersed in said resin; and then pressurizing a space in said container above the resin for said polymer layer so as to force the resin through said tube into said evacuated mold cavity and form said polymer layer.
References Cited (Backward Citations)
US3526694A
Cited
US3818982A
Cited
US4072738A
Cited
GB1443215A
Cited
JPS50109596A
Cited
US4139051A
Cited
WO1979000510A1
Cited
US4282924A
Cited
US4580619A
Cited
US4682566A
Cited
GB2071673A
Cited
US4311661A
Cited
US4460525A
Cited
JPS5862017A
Cited
US4457359A
Cited
US4535835A
Cited
US4724325A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-03-04 | 1994-09-03 | 1995-03-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-03-04 | 1998-09-03 | 1999-03-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-03-04 | 2002-09-03 | 2003-03-05 | $7700.00 | Window Closed / Lapsed |