Integrated-circuit chip interconnection system

Claim 2

An integrated-circuit (IC) chip packaging construction, comprising: an integrated circuit chip having a plurality of contact areas; a rigid insulating board having a plurality of openings therethrough, with at least some of the openings at positions corresponding to the IC chip contact areas; a circuit board having contact areas at positions corresponding to some of the openings in the insulating board; a plurality of conductive connector elements disposed in selected ones of the openings in the insulating board, each of said connector elements including a wadded strand of conductive wire that is deformed when compressed and makes multiple electrical contacts with the IC chip and circuit board contact areas; and means for compressing the IC chip toward the circuit board, thereby compressing the connector elements and making electrical contact between the IC chip contact areas and the circuit board contact areas.

Claim 3

A packaging construction as set forth in claim 1, wherein the circuit board is a multilayer printed circuit board.

Claim 4

A packaging construction as set forth in claim 1, wherein the circuit board is a layer-replaceable multilayer circuit board.

Claim 5

A packaging construction as set forth in claim 3, wherein the layer-replaceable multilayer circuit board includes: a plurality of two-sided circuit boards, each circuit board having a plurality of contact areas on both sides of the circuit board and selected connections between the contact areas; an insulating board with openings therethrough located between adjacent two-sided circuit boards, with at least some of the openings at positions corresponding to the two-sided circuit board contact areas; and a plurality of conductive connector elements disposed in selected ones of the openings in the insulating board to make electrical contact between the two-sided circuit board contact areas.

Claim 6

A packaging construction as set forth in claim 4, wherein: of the connector elements includes a wadded strand of conductive wire that is deformed when compressed between the two-sided circuit board contact areas and makes multiple electrical contacts between the contact areas.

Claim 7

A packaging construction as set forth in claim 1, and further including a housing having a recessed area for the IC chip, the housing serving as both a heat sink and a hermetic seal for the IC chip.

Claim 8

A packaging construction as set forth in claim 1, wherein the means for compressing includes a clamp mechanism.

Claim 9

A packaging construction as set forth in claim 1, wherein the insulating board is fabricated from a glass ceramic.

Claim 10

A packaging construction as set forth in claim 1, wherein each wadded strand of wire has a density of approximately 20 to 30 percent.

Claim 11

A packaging construction as set forth in claim 1, wherein each wadded strand of wire extends slightly above and below the insulating board.

Claim 12

A packaging construction as set forth in claim 1, wherein each wadded strand of wire extends approximately 0.001 inches above and below the insulating board.

Claim 13

A packaging construction as set forth in claim 1, wherein each wadded strand of wire is a nickel wire having a diameter of approximately 0.0003 to 0.0005 inches.

Claim 14

A packaging construction as set forth in claim 1, wherein each wadded strand of wire is an alloy wire having a diameter of approximately 0.0003 to 0.0005 inches, wherein the alloy is selected from the group consisting of beryllium and copper, silver and copper, and phosphorous and bronze.

Claim 15

An integrated-circuit (IC) chip packaging construction, comprising: an integrated circuit chip package having a plurality of contact areas; an integrated circuit chip mounted in the IC chip package; a rigid insulating board having a plurality of openings therethrough, with at least some of the openings at positions corresponding to the IC chip package contact areas; a circuit board having contact areas at positions corresponding to some of the openings in the insulating board; a plurality of conductive connector elements disposed in selected ones of the openings in the insulating board, each of said connector elements including a wadded strand of conductive wire that is deformed when compressed and makes multiple electrical contacts with the IC chip package and circuit board contact areas; and means for compressing the IC chip package toward the circuit board, thereby compressing the connector elements and making electrical contact between the IC chip package contact areas and the circuit board contact areas; wherein the circuit board is a multilayer printed circuit board.

Claim 16

An integrated-circuit (IC) chip packaging construction, comprising: an integrated circuit chip package having a plurality of contact areas; an integrated circuit chip mounted in the IC chip package; a rigid insulating board having a plurality of openings therethrough, with at least some of the openings at positions corresponding to the IC chip package contact areas; a circuit board having contact areas at positions corresponding to some of the openings in the insulating board; a plurality of conductive connector elements disposed in selected ones of the openings in the insulating board, each of said connector elements including a wadded strand of conductive wire that is deformed when compressed and makes multiple electrical contacts with the IC chip package and circuit board contact areas; and means for compressing the IC chip package toward the circuit board, thereby compressing the connector elements and making electrical contact between the IC chip package contact areas and the circuit board contact areas; wherein the circuit board is a multilayer printed circuit board.

Claim 17

A packaging construction as set forth in claim 14, wherein the circuit board is a layer-replaceable multilayer circuit board.

Claim 18

A packaging construction as set forth in claim 15, wherein the layer-replaceable multilayer circuit board includes: a plurality of two-sided circuit boards, each circuit board having a plurality of contact areas on both sides of the circuit board and selected connections between the contact areas; an insulating board with openings therethrough located between adjacent two-sided circuit boards, with at least some of the openings at positions corresponding to the two-sided circuit board contact areas; and a plurality of conductive connector elements disposed in selected ones of the openings in the insulating board to make electrical contact between the two-sided circuit board contact areas.

Claim 19

A packaging construction as set forth in claim 16, wherein: of the connector elements includes a wadded strand of conductive wire that is deformed when compressed between the two-sided circuit board contact areas and makes multiple electrical contacts between the contact areas.

Claim 20

A packaging construction as set forth in claim 14, and further including a housing having a recessed area for the IC chip package, the housing serving as a heat sink for the IC chip package.

Claim 21

A one-dimensional integrated-circuit (IC) chip packaging construction, comprising: an IC chip having a plurality of contact areas; IC chip mounting and interconnection means having face and edge contact areas and selected connections between the face and edge contact areas, the IC chip and the IC chip mounting and interconnecting means forming an IC chip package; at least one additional IC chip package of similar construction to the first IC chip package arrayed in a parallel relationship with the first IC chip package; and means for interconnecting selected ones of the edge contact areas of different chip packages; wherein the IC chip mounting and interconnection means includes: an insulating board having a plurality of openings therethrough, with at least some of the openings at positions corresponding to the IC chip contact areas; a circuit board having face and edge contact areas and selected connections between the face and edge contact areas, with at least some of the face contact areas at positions corresponding to the openings in the insulating board; a plurality of conductive connector elements disposed in selected ones of the openings in the insulating board to make electrical contact between the IC chip contact areas and the circuit board face-contact areas; and means for applying compressive forces to the IC chip, the insulating board and the circuit board, to force the connector elements into contact with the IC chip contact areas and the circuit board face-contact areas.

Claim 22

A one-dimensional integrated-circuit (IC) chip packaging construction, comprising: an IC chip having a plurality of contact areas; IC chip mounting and interconnection means having face and edge contact areas and selected connections between the face and edge contact areas, the IC chip and the IC chip mounting and interconnecting means forming an IC chip package; at least one additional IC chip package of similar construction to the first IC chip package arrayed in a parallel relationship with the first IC chip package; and means for interconnecting selected ones of the edge contact areas of different chip packages; wherein the IC chip mounting and interconnection means includes: an insulating board having a plurality of openings therethrough, with at least some of the openings at positions corresponding to the IC chip contact areas; a circuit board having face and edge contact areas and selected connections between the face and edge contact areas, with at least some of the face contact areas at positions corresponding to the openings in the insulating board; a plurality of conductive connector elements disposed in selected ones of the openings in the insulating board to make electrical contact between the IC chip contact areas and the circuit board face-contact areas; and means for applying compressive forces to the IC chip, the insulating board and the circuit board, to force the connector elements into contact with the IC chip contact areas and the circuit board face-contact areas.

Claim 23

A packaging construction as set forth in claim 19, wherein: each of the connector elements includes a wadded strand of conductive wire that is deformed when compressed between the contact areas and makes multiple electrical contacts between the contact areas.

Claim 24

A packaging construction as set forth in claim 19, wherein the circuit board is a multilayer printed circuit board.

Claim 25

A one-dimensional integrated circuit (IC) chip packaging construction, comprising: an IC chip having a plurality of contact areas; IC chip mounting and interconnection means having face and edge contact areas and selected connections between the face and edge contact areas, the IC chip and the IC chip mounting and interconnecting means forming an IC chip package, the IC chip mounting and interconnection means including: an insulating board having a plurality of openings therethrough, with at least some of the openings at positions corresponding to the IC chip contact areas; a multilayer printed circuit board having face and edge contact areas and selected connections between the face and edge contact areas, with at least some of the face contact areas at positions corresponding to the openings in the insulating board, the multilayer printed circuit board including: a plurality of two-sided circuit boards, each circuit board having a plurality of contact areas on both sides of the circuit board and selected connections between the contact areas; one or more insulating boards with openings therethrough, with at least some of the openings at positions corresponding to the two-sided circuit board contact areas; and a plurality of conductive connector elements disposed in selected ones of the openings in the insulating boards to make electrical contact between the two-sided circuit board contact areas; wherein the two-sided circuit boards are alternated with the insulating boards to effect a layer-replaceable multilayer circuit board; a plurality of conductive connector elements disposed in selected ones of the openings in the insulating board to make electrical contact between the IC chip contact areas and the circuit board face-contact areas; and means for applying compressive force to the IC chip, the insulating board and the circuit board, to force the connector elements into contact with the IC chip contact areas and the circuit board face-contact areas; at least one additional IC chip package of similar construction to the first IC chip package arrayed in a parallel relationship with the first IC chip package; and means for interconnecting selected ones of the edge contact areas of different chip packages.

Claim 26

A one-dimensional integrated circuit (IC) chip packaging construction, comprising: an IC chip having a plurality of contact areas; IC chip mounting and interconnection means having face and edge contact areas and selected connections between the face and edge contact areas, the IC chip and the IC chip mounting and interconnecting means forming an IC chip package, the IC chip mounting and interconnection means including: an insulating board having a plurality of openings therethrough, with at least some of the openings at positions corresponding to the IC chip contact areas; a multilayer printed circuit board having face and edge contact areas and selected connections between the face and edge contact areas, with at least some of the face contact areas at positions corresponding to the openings in the insulating board, the multilayer printed circuit board including: a plurality of two-sided circuit boards, each circuit board having a plurality of contact areas on both sides of the circuit board and selected connections between the contact areas; one or more insulating boards with openings therethrough, with at least some of the openings at positions corresponding to the two-sided circuit board contact areas; and a plurality of conductive connector elements disposed in selected ones of the openings in the insulating boards to make electrical contact between the two-sided circuit board contact areas; wherein the two-sided circuit boards are alternated with the insulating boards to effect a layer-replaceable multilayer circuit board; a plurality of conductive connector elements disposed in selected ones of the openings in the insulating board to make electrical contact between the IC chip contact areas and the circuit board face-contact areas; and means for applying compressive force to the IC chip, the insulating board and the circuit board, to force the connector elements into contact with the IC chip contact areas and the circuit board face-contact areas; at least one additional IC chip package of similar construction to the first IC chip package arrayed in a parallel relationship with the first IC chip package; and means for interconnecting selected ones of the edge contact areas of different chip packages.

Claim 27

A packaging construction as set forth in claim 22, wherein: each of the connector elements includes a wadded strand of conductive wire that is deformed when compressed between the contact areas and makes multiple electrical contacts between the contact areas.

Claim 28

A one-dimensional integrated-circuit (IC) chip packaging construction, comprising: an IC chip having a plurality of contact areas; IC chip mounting and interconnection means having face and edge contact areas and selected connections between the face and edge contact areas, the IC chip and the IC chip mounting and interconnecting means forming an IC chip package; at least one additional IC chip package of similar construction to the first IC chip package arrayed in a parallel relationship with the first IC chip package; and means for interconnecting selected ones of the edge contact areas of different chip packages; wherein the means for interconnecting selected ones of the edge contact areas includes: at least one insulating board with openings therethrough, with at least some of the openings corresponding to the edge contact areas; at least one two-sided circuit board having contact areas corresponding to at least some of the openings in the insulating board and having selected connections between the contact areas; a plurality of conductive connector elements disposed in selected ones of the openings in the insulating board to make electrical contact with the edge contact areas; and means for applying compressive force to the two-sided circuit board and the insulating board, to force the connector elements into contact with the edge contact areas and the two-sided circuit board contact areas.

Claim 29

A one-dimensional integrated-circuit (IC) chip packaging construction, comprising: an IC chip having a plurality of contact areas; IC chip mounting and interconnection means having face and edge contact areas and selected connections between the face and edge contact areas, the IC chip and the IC chip mounting and interconnecting means forming an IC chip package; at least one additional IC chip package of similar construction to the first IC chip package arrayed in a parallel relationship with the first IC chip package; and means for interconnecting selected ones of the edge contact areas of different chip packages; wherein the means for interconnecting selected ones of the edge contact areas includes: at least one insulating board with openings therethrough, with at least some of the openings corresponding to the edge contact areas; at least one two-sided circuit board having contact areas corresponding to at least some of the openings in the insulating board and having selected connections between the contact areas; a plurality of conductive connector elements disposed in selected ones of the openings in the insulating board to make electrical contact with the edge contact areas; and means for applying compressive force to the two-sided circuit board and the insulating board, to force the connector elements into contact with the edge contact areas and the two-sided circuit board contact areas.

Claim 30

A packaging construction as set forth in claim 24, wherein: each of the connector elements includes a wadded strand of conductive wire that is deformed when compressed between the contact areas and makes multiple electrical contacts between the contact areas.

Claim 31

A packaging construction as set forth in claim 19, wherein the insulating board is fabricated from a glass ceramic.

Claim 32

A packaging construction as set forth in claim 25, wherein each wadded strand of wire has a density of approximately 20 to 30 percent.

Claim 33

A packaging construction as set forth in claim 20, wherein each wadded strand of wire extends slightly above and below the insulating board.

Claim 34

A packaging construction as set forth in claim 20, wherein each wadded strand of wire extends approximately 0.001 inches above and below the insulating board.

Claim 35

A packaging construction as set forth in claim 20, wherein each wadded strand of wire is a nickel wire having a diameter of approximately 0.0003 to 0.0005 inches.

Claim 36

A packaging construction as set forth in claim 20, wherein each wadded strand of wire is an alloy wire having a diameter of approximately 0.0003 to 0.0005 inches, wherein the alloy is selected from the group consisting of beryllium and copper, silver and copper, and phosphorous and bronze.

Claim 37

A three-dimensional integrated-circuit packaging construction, comprising: an IC chip having a plurality of contact areas; IC chip mounting and interconnection means having face and edge contact areas and selected connections between the face and edge contact areas, the IC chip and the IC chip mounting and interconnecting means forming an IC chip package; at least one additional IC chip package of similar construction to the first IC chip package arrayed in a parallel relationship with the first IC chip package to form a first IC chip module; at least one additional IC chip module of similar construction to the first IC chip module; transverse chip-module interconnection means disposed between the first and the additional IC chip modules, and between any other adjacent pairs of IC chip modules, to establish selected connections between the edge contact areas, the transversely interconnected IC chip modules forming a first IC chip module layer; at least one additional IC chip module layer of similar construction to the first IC chip module layer; and chip-module layer interconnection means disposed between the first and the additional IC chip module layers, and between any other adjacent pairs of IC chip module layers, to establish selected connections between the edge contact areas; whereby interconnections between the IC chips may be made in any of three dimensions, and the current path lengths within the interconnections are minimized.

Claim 38

A three-dimensional integrated-circuit packaging construction, comprising: an IC chip having a plurality of contact areas; IC chip mounting and interconnection means having face and edge contact areas and selected connections between the face and edge contact areas, the IC chip and the IC chip mounting and interconnecting means forming an IC chip package; at least one additional IC chip package of similar construction to the first IC chip package arrayed in a parallel relationship with the first IC chip package to form a first IC chip module; at least one additional IC chip module of similar construction to the first IC chip module; transverse chip-module interconnection means disposed between the first and the additional IC chip modules, and between any other adjacent pairs of IC chip modules, to establish selected connections between the edge contact areas, the transversely interconnected IC chip modules forming a first IC chip module layer; at least one additional IC chip module layer of similar construction to the first IC chip module layer; and chip-module layer interconnection means disposed between the first and the additional IC chip module layers, and between any other adjacent pairs of IC chip module layers, to establish selected connections between the edge contact areas; whereby interconnections between the IC chips may be made in any of three dimensions, and the current path lengths within the interconnections are minimized.

Claim 39

A packaging construction as set forth in claim 32, wherein the IC chip mounting and interconnection means includes: an insulating board having a plurality of openings therethrough, with at least some of the openings at positions corresponding to the IC chip contact areas; a circuit board having face and edge contact areas and selected connections between the face and edge contact areas, with at least some of the face contact areas at positions corresponding to the openings in the insulating board; a plurality of conductive connector elements disposed in selected ones of the openings in the insulating board to make electrical contact between the IC chip contact areas and the circuit board face-contact areas; and means for applying compressive force to the IC chip, the insulating board and the circuit board, to force the connector elements into contact with the IC chip contact areas and the circuit board face-contact areas.

Claim 40

A packaging construction as set forth in claim 33, wherein: each of the connector elements includes a wadded strand of conductive wire that is deformed when compressed between the contact areas and makes multiple electrical contacts between the contact areas.

Claim 41

A packaging construction as set forth in claim 33, wherein the circuit board is a multilayer printed circuit board.

Claim 42

A three-dimensional integrated-circuit packaging construction, comprising: an IC chip having a plurality of contact areas; IC chip mounting and interconnection means having face and edge contact areas and selected connections between the face and edge contact areas, the IC chip mounting and interconnection means including: an insulating board having a plurality of openings therethrough, with at least some of the openings at positions corresponding to the IC chip contact areas; a multilayer printed circuit board having face and edge contact areas and selected connections between the face and edge contact areas, with at least some of the face contact areas at positions corresponding to the openings in the insulating board, the multilayer printed circuit board including: a plurality of two-sided circuit boards, each circuit board having a plurality of contact areas on both sides of the circuit board and selected connections between the contact board; one or more insulating boards with openings therethrough, with at least some of the openings at positions corresponding to the two-sided circuit board contact areas; and a plurality of conductive connector elements disposed in selected ones of the openings in the insulating boards to make electrical contact between the two-sided circuit board contact areas; wherein the two-sided circuit boards are alternated with the insulating boards to effect a layer-replaceable multilayer circuit board; a plurality of conductive connector elements disposed in selected ones of the openings in the insulating board to make electrical contact between the IC chip contact areas and the circuit board face-contact areas; and means for applying compressive force to the IC chip, the insulating board and the circuit board, to force the connector elements into contact with the IC chip contact areas and the circuit board face-contact areas, thus forming an IC chip package; at least one additional IC chip package of similar construction to the first IC chip package arrayed in a parallel relationship with the first IC chip package to form a first IC chip module; at least one additional IC chip module of similar construction to the first IC chip module; transverse chip-module interconnection means disposed between the first and the additional IC chip modules, and between any other adjacent pairs of IC chip modules, to establish selected connections between the edge contact areas, the transversely interconnected IC chip modules forming a first IC chip module layer; at least one additional IC chip module layer of similar construction to the first IC chip module layer; and chip-module layer interconnection means disposed between the first and the additional IC chip module layers, and between any other adjacent pairs of IC chip module layers, to establish selected connections between the edge contact areas; whereby interconnections between the IC chips may be made in any of three dimensions, and the current path lengths within the interconnections are minimized.

Claim 43

A three-dimensional integrated-circuit packaging construction, comprising: an IC chip having a plurality of contact areas; IC chip mounting and interconnection means having face and edge contact areas and selected connections between the face and edge contact areas, the IC chip mounting and interconnection means including: an insulating board having a plurality of openings therethrough, with at least some of the openings at positions corresponding to the IC chip contact areas; a multilayer printed circuit board having face and edge contact areas and selected connections between the face and edge contact areas, with at least some of the face contact areas at positions corresponding to the openings in the insulating board, the multilayer printed circuit board including: a plurality of two-sided circuit boards, each circuit board having a plurality of contact areas on both sides of the circuit board and selected connections between the contact board; one or more insulating boards with openings therethrough, with at least some of the openings at positions corresponding to the two-sided circuit board contact areas; and a plurality of conductive connector elements disposed in selected ones of the openings in the insulating boards to make electrical contact between the two-sided circuit board contact areas; wherein the two-sided circuit boards are alternated with the insulating boards to effect a layer-replaceable multilayer circuit board; a plurality of conductive connector elements disposed in selected ones of the openings in the insulating board to make electrical contact between the IC chip contact areas and the circuit board face-contact areas; and means for applying compressive force to the IC chip, the insulating board and the circuit board, to force the connector elements into contact with the IC chip contact areas and the circuit board face-contact areas, thus forming an IC chip package; at least one additional IC chip package of similar construction to the first IC chip package arrayed in a parallel relationship with the first IC chip package to form a first IC chip module; at least one additional IC chip module of similar construction to the first IC chip module; transverse chip-module interconnection means disposed between the first and the additional IC chip modules, and between any other adjacent pairs of IC chip modules, to establish selected connections between the edge contact areas, the transversely interconnected IC chip modules forming a first IC chip module layer; at least one additional IC chip module layer of similar construction to the first IC chip module layer; and chip-module layer interconnection means disposed between the first and the additional IC chip module layers, and between any other adjacent pairs of IC chip module layers, to establish selected connections between the edge contact areas; whereby interconnections between the IC chips may be made in any of three dimensions, and the current path lengths within the interconnections are minimized.

Claim 44

A packaging construction as set forth in claim 36, wherein: each of the connector elements includes a wadded strand of conductive wire that is deformed when compressed between the contact areas and makes multiple electrical contacts between the contact areas.

Claim 45

A three-dimensional integrated-circuit packaging construction, comprising: an IC chip having a plurality of contact areas; IC chip mounting and interconnection means having face and edge contact areas and selected connections between the face and edge contact areas, the IC chip and the IC chip mounting and interconnecting means forming an IC chip package; at least one additional IC chip package of similar construction to the first IC chip package arrayed in a parallel relationship with the first IC chip package to form a first IC chip module; at least one additional IC chip module of similar construction to the first IC chip module; transverse chip-module interconnection means disposed between the first and the additional IC chip modules, and between any other adjacent pairs of IC chip modules, to establish selected connections between the edge contact areas, the transversely interconnected IC chip modules forming a first IC chip module layer; at least one additional IC chip module layer of similar construction to the first IC chip module layer; and chip-module layer interconnection means disposed between the first and the additional IC chip module layers, and between any other adjacent pairs of IC chip module layers, to establish selected connections between the edge contact areas; wherein the transverse chip-module interconnection means and the chip-module layer interconnection means each includes: at least one insulating board with openings therethrough, with at least some of the openings corresponding to the edge contact areas; a plurality of conductive connector elements disposed in selected ones of the openings in the insulating board to make electrical contact with the edge areas; and means for applying compressive force to the insulating board, to force the connector elements into contact with the edge contact areas; whereby interconnections between the IC chips may be made in any of three dimensions, and the current path lengths within the interconnections are minimized.

Claim 46

A three-dimensional integrated-circuit packaging construction, comprising: an IC chip having a plurality of contact areas; IC chip mounting and interconnection means having face and edge contact areas and selected connections between the face and edge contact areas, the IC chip and the IC chip mounting and interconnecting means forming an IC chip package; at least one additional IC chip package of similar construction to the first IC chip package arrayed in a parallel relationship with the first IC chip package to form a first IC chip module; at least one additional IC chip module of similar construction to the first IC chip module; transverse chip-module interconnection means disposed between the first and the additional IC chip modules, and between any other adjacent pairs of IC chip modules, to establish selected connections between the edge contact areas, the transversely interconnected IC chip modules forming a first IC chip module layer; at least one additional IC chip module layer of similar construction to the first IC chip module layer; and chip-module layer interconnection means disposed between the first and the additional IC chip module layers, and between any other adjacent pairs of IC chip module layers, to establish selected connections between the edge contact areas; wherein the transverse chip-module interconnection means and the chip-module layer interconnection means each includes: at least one insulating board with openings therethrough, with at least some of the openings corresponding to the edge contact areas; a plurality of conductive connector elements disposed in selected ones of the openings in the insulating board to make electrical contact with the edge areas; and means for applying compressive force to the insulating board, to force the connector elements into contact with the edge contact areas; whereby interconnections between the IC chips may be made in any of three dimensions, and the current path lengths within the interconnections are minimized.

Claim 47

A packaging construction as set forth in claim 38, wherein: each of the connector elements includes a wadded strand of conductive wire that is deformed when compressed between the contact areas and makes multiple electrical contacts between the contact areas.

Claim 48

A packaging construction as set forth in claim 38, wherein the transverse chip-module interconnection means and the chip-module layer interconnection means each further includes: at least one two-sided circuit board located between two of the insulating boards and having contact areas corresponding to at least some of the openings in the insulating boards, and having selected connections between the contact areas.

Claim 49

A packaging construction as set forth in claim 40, wherein: each of the connector elements includes a wadded strand of conductive wire that is deformed when compressed between the contact areas and makes multiple electrical contacts between the contact areas.

Claim 50

A packaging construction as set forth in claim 32, and further including a heat sink in thermal contact with the IC chip.

Claim 51

A three-dimensional integrated-circuit (IC) chip packaging construction, comprising: an IC chip having a plurality of contact areas; IC chip mounting and interconnection means having face and edge contact areas and selected connections between the face and edge contact areas, the IC chip and the IC chip mounting and interconnecting means forming an IC chip package, the IC chip mounting and interconnection means including: an insulating board having a plurality of openings therethrough, with at least some of the openings at positions corresponding to the IC chip contact areas; a circuit board having face and edge contact areas and selected connections between the face and edge contact areas, with at least some of the face contact areas at positions corresponding to the openings in the insulating board; a plurality of conductive connector elements disposed in selected ones of the openings in the insulating board to make electrical contact between the IC chip contact areas and the circuit board face-contact areas; and means for applying compressive force to the IC chip, the insulating board and the circuit board, to force the connector elements into contact with the IC chip contact areas and the circuit board face-contact areas; at least one additional IC chip package of similar construction to the first IC chip package arrayed in a parallel relationship with the first IC chip package to form a first IC chip module; at least one additional IC chip module of similar construction to the first IC chip module; transverse chip-module interconnection means disposed between the first and the additional IC chip modules, and between any other adjacent pairs of IC chip modules, to establish selected connections between the edge contact areas, the transversely interconnected IC chip modules forming a first IC chip module layer; at least one additional IC chip module layer of similar construction to the first IC chip module layer; and chip-module layer interconnection means disposed between the first and the additional IC chip module layers, and between any other adjacent pairs of IC chip module layers, to establish selected connections between the edge contact areas, the transverse chip-module interconnection means and the chip-module layer interconnection means each including: at least one insulating board with openings therethrough, with at least some of the openings corresponding to the edge contact areas; a plurality of conductive connector elements disposed in selected ones of the openings in the insulating board to make electrical contact with the edge contact areas; and means for applying compressive force to the insulating board, to force the connector elements into contact with the edge contact areas; whereby interconnections between the IC chips may be made in any of three dimensions, and the current path lengths within the interconnections are minimized.

Claim 52

A three-dimensional integrated-circuit (IC) chip packaging construction, comprising: an IC chip having a plurality of contact areas; IC chip mounting and interconnection means having face and edge contact areas and selected connections between the face and edge contact areas, the IC chip and the IC chip mounting and interconnecting means forming an IC chip package, the IC chip mounting and interconnection means including: an insulating board having a plurality of openings therethrough, with at least some of the openings at positions corresponding to the IC chip contact areas; a circuit board having face and edge contact areas and selected connections between the face and edge contact areas, with at least some of the face contact areas at positions corresponding to the openings in the insulating board; a plurality of conductive connector elements disposed in selected ones of the openings in the insulating board to make electrical contact between the IC chip contact areas and the circuit board face-contact areas; and means for applying compressive force to the IC chip, the insulating board and the circuit board, to force the connector elements into contact with the IC chip contact areas and the circuit board face-contact areas; at least one additional IC chip package of similar construction to the first IC chip package arrayed in a parallel relationship with the first IC chip package to form a first IC chip module; at least one additional IC chip module of similar construction to the first IC chip module; transverse chip-module interconnection means disposed between the first and the additional IC chip modules, and between any other adjacent pairs of IC chip modules, to establish selected connections between the edge contact areas, the transversely interconnected IC chip modules forming a first IC chip module layer; at least one additional IC chip module layer of similar construction to the first IC chip module layer; and chip-module layer interconnection means disposed between the first and the additional IC chip module layers, and between any other adjacent pairs of IC chip module layers, to establish selected connections between the edge contact areas, the transverse chip-module interconnection means and the chip-module layer interconnection means each including: at least one insulating board with openings therethrough, with at least some of the openings corresponding to the edge contact areas; a plurality of conductive connector elements disposed in selected ones of the openings in the insulating board to make electrical contact with the edge contact areas; and means for applying compressive force to the insulating board, to force the connector elements into contact with the edge contact areas; whereby interconnections between the IC chips may be made in any of three dimensions, and the current path lengths within the interconnections are minimized.

Claim 53

A packaging construction as set forth in claim 43, wherein: each of the connector elements includes a wadded strand of conductive wire that is deformed when compressed between the contact areas and makes multiple electrical contacts between the contact areas.

Claim 54

A packaging construction as set forth in claim 43, wherein the transverse chip-module interconnection means and the chip-module layer interconnection means each further includes: at least one two-sided circuit board located between two of the insulating boards and having contact areas corresponding to at least some of the openings in the insulating boards, and having selected connections between the contact areas.

Claim 55

A packaging construction as set forth in claim 45, wherein: each of the connector elements includes a wadded strand of conductive wire that is deformed when compressed between the contact areas and makes multiple electrical contacts between the contact areas.

Claim 56

A packaging construction as set forth in claim 33, wherein the insulating board is fabricated from a glass ceramic.

Claim 57

A packaging construction as set forth in claim 34, wherein each wadded strand of wire has a density of approximately 20 to 30 percent.

Claim 58

A packaging construction as set forth in claim 34, wherein each wadded strand of wire extends slightly above and below the insulating board.

Claim 59

A packaging construction as set forth in claim 34, wherein each wadded strand of wire extends approximately 0.001 inches above and below the insulating board.

Claim 60

A packaging construction as set forth in claim 34, wherein each wadded strand of wire is a nickel wire having a diameter of approximately 0.0003 to 0.0005 inches.

Claim 61

A packaging construction as set forth in claim 34, wherein each wadded strand of wire is an alloy wire having a diameter of approximately 0.0003 to 0.0005 inches, wherein the alloy is selected from the group consisting of beryllium and copper, silver and copper, and phosphorous and bronze.

Claim 62

A packaging construction as set forth in claim 14, wherein each wadded strand of wire extends approximately 0.001 inches above and below the insulating board.

Claim 63

A packaging construction as set forth in claim 14, wherein each wadded strand of wire is a nickel wire having a diameter of approximately 0.0003 to 0.0005 inches.

Claim 64

A packaging construction as set forth in claim 14, wherein each wadded strand of wire is an alloy wire having a diameter of approximately 0.0003 to 0.0005 inches, wherein the alloy is selected from the group consisting of beryllium and copper, silver and copper, and phosphorous and bronze.