Semiconductor cooling device

Claim 2

A semiconductor cooling device comprising: a plurality of semiconductor integrated circuits mounted on a module substrate; a sealing member attached to said module substrate and forming a housing enclosing said plurality of integrated circuits; and liquid supplying means provided on said sealing member and having a plurality of cooling liquid nozzles respectively associated with each of said individual integrated circuits, wherein said liquid nozzles emit and direct jets of a cooling liquid in a direction substantially in parallel with a back wall surface of the individual integrated circuits.

Claim 3

A semiconductor cooling device according to claim 1, wherein outlet surfaces of the cooling liquid nozzles are parallel with the back wall surfaces of the integrated circuits.

Claim 4

A semiconductor cooling device according to claim 2, wherein said cooling liquid nozzles each include a surface positioned substantially at a same level with the back wall surfaces of the integrated circuits.

Claim 5

A semiconductor cooling device according to claim 2, wherein an outlet side end of each of the cooling liquid nozzles is tilted relative to a direction in which the cooling liquid is emitted.

Claim 6

A semiconductor cooling device according to claim 1, wherein each of the cooling liquid nozzles of said liquid supplying means has a nearly rectangular shape.

Claim 7

A semiconductor cooling device according to claim 5, wherein each of the cooling liquid nozzles have a ratio h/w of a height h of a cross-section of the nozzle to a width w of the cross-section of the nozzle over a range of 0.1≦h/w≦1.0.

Claim 8

A semiconductor cooling device according to claim 1, wherein each of the integrated circuits is provided with cooling fins.

Claim 9

A semiconductor cooling device according to claim 7, wherein the cooling fins are split in a direction of flow of the cooling liquid.

Claim 10

A semiconductor cooling device according to claim 1, wherein each of the integrated circuits is provided with cooling plates at right angles with respect to a direction of flow of the cooling liquid.

Claim 11

A semiconductor cooling device according to claim 9, wherein the cooling plates are perforated.

Claim 12

A semiconductor cooling device according to claim 7, wherein a size, shape and number of the cooling fins are determined in dependence upon an amount of heat generated by each of the integrated chips.

Claim 13

A semiconductor cooling device according to claim 1, wherein said module substrate includes jumper wire means for enabling at least one of a repair and modification of the integrated circuits, and wherein a covering plate is placed in the flow direction of the cooling liquid between the cooling liquid nozzles and the jumper wires.

Claim 14

A semiconductor cooling device comprising: a plurality of semiconductor integrated circuits mounted on a module substrate; a sealing member attached to said module substrate and forming a housing enclosing said plurality of integrated circuits; and liquid supplying means provided on said sealing member and having a plurality of cooling liquid nozzles respectively associated with each of said individual integrated circuits, wherein said cooling liquid nozzles emit and direct cooling liquid jets at a slant to back wall surface of the individual integrated circuits.

Claim 15

A semiconductor cooling device comprising: a plurality of semiconductor integrated circuits mounted on a module substrate; a sealing member attached to said module substrate and forming a housing enclosing said plurality of integrated circuits; and liquid supplying means provided on said sealing member and having a plurality of cooling liquid nozzles respectively associated with each of said individual integrated circuits, wherein said cooling liquid nozzles emit and direct cooling liquid jets at a slant to back wall surface of the individual integrated circuits.

Claim 16

A semiconductor cooling device according to claim 13, wherein an angle θ subtended by a center axis of a cross section of each cooling liquid nozzles and the back wall surface of each of the integrated circuits is determined in accordance with the following relationship: θ≦arcsin (W/[ρAV.sup.2 ]), where: W=an allowable load for solder bumps connecting the respective integrated circuits to the module substrate, ρ=a density of the cooling liquid, V=a velocity of the cooling liquid, and A=a cross-sectional area of the respective cooling liquid injection nozzle.

Claim 17

A semiconductor cooling device according to claim 14, wherein each angle θ lies over a range of 0<θ≦35°.

Claim 18

A semiconductor cooling device comprising: a plurality of semiconductor integrated circuits mounted on a module substrate; a sealing member attached to said module substrate and forming a housing enclosing said plurality of integrated circuits; cooling liquid supplying means provided on said sealing member and having a plurality of cooling liquid nozzles respectively associated with each of said integrated circuits, said cooling liquid nozzles emitting and directing jets of cooling liquid in a direction substantially parallel to a back wall surface of the respective integrated circuits; a cooling liquid introducing path provided on said sealing member to introduce the cooling liquid to be supplied to said cooling liquid nozzles; and a cooling liquid discharge path provided independently of said cooling liquid introducing path to guide the cooling liquid after having cooled the integrated circuits to an exterior of said housing.

Claim 19

A semiconductor cooling device comprising: a plurality of semiconductor integrated circuits mounted on a module substrate; a sealing member attached to said module substrate and forming a housing enclosing said plurality of integrated circuits; cooling liquid supplying means provided on said sealing member and having a plurality of cooling liquid nozzles respectively associated with each of said integrated circuits, said cooling liquid nozzles emitting and directing jets of cooling liquid in a direction substantially parallel to a back wall surface of the respective integrated circuits; a cooling liquid introducing path provided on said sealing member to introduce the cooling liquid to be supplied to said cooling liquid nozzles; and a cooling liquid discharge path provided independently of said cooling liquid introducing path to guide the cooling liquid after having cooled the integrated circuits to an exterior of said housing.

Claim 20

A semiconductor cooling device according to claim 16, wherein said cooling liquid discharge path is provided in a direction in which the cooling liquid is introduced.

Claim 21

A semiconductor cooling device according to claim 16, wherein a partitioning wall separates the cooling liquid introducing path from the cooling liquid discharge path and is made of a material having a low thermal conductivity.

Claim 22

A semiconductor cooling device comprising: a plurality of semiconductor integrated circuits mounted on a module substrate; a sealing cap connected to said module substrate and sealing the plurality of integrated circuits from the exterior of the device; a plenum between said sealing cap and said module substrate; a cooling liquid accommodated in said plenum; a header formed in said cap to guide the cooling liquid; cooling liquid supplying means including a plurality of cooling liquid nozzles which directly emit the cooling liquid to each of said integrated circuits, each of said cooling liquid nozzles emitting and directing a jet of the cooling liquid in a direction substantially in parallel with a back wall surface of the individual integrated circuits; and a cooling liquid discharge port for discharging the cooling liquid to the exterior of the device after the liquid cooling passes said cap to cool the integrated circuits; wherein said cooling liquid supplying means has liquid nozzles for emitting the cooling liquid in parallel with the back surface of each of the integrated circuits.

Claim 23

A semiconductor cooling device comprising: a plurality of semiconductor integrated circuits mounted on a module substrate; a sealing cap connected to said module substrate and sealing the plurality of integrated circuits from the exterior of the device; a plenum between said sealing cap and said module substrate; a cooling liquid accommodated in said plenum; a header formed in said cap to guide the cooling liquid; cooling liquid supplying means including a plurality of cooling liquid nozzles which directly emit the cooling liquid to each of said integrated circuits, each of said cooling liquid nozzles emitting and directing a jet of the cooling liquid in a direction substantially in parallel with a back wall surface of the individual integrated circuits; and a cooling liquid discharge port for discharging the cooling liquid to the exterior of the device after the liquid cooling passes said cap to cool the integrated circuits; wherein said cooling liquid supplying means has liquid nozzles for emitting the cooling liquid in parallel with the back surface of each of the integrated circuits.

Claim 24

A semiconductor cooling device according to claim 19, wherein the cooling liquid nozzles have a width nearly the same as a width of the integrated circuits.

Claim 25

A semiconductor cooling device according to claim 19, wherein each of the integrated circuits includes a chip carrier securely connected to the module substrate, a semiconductor integrated circuit chip securely connected to the chip carrier, and a chip carrier-sealing cap for sealing the chip to the chip carrier.