US5022960A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing circuit board for mounting electronic components
Assignee: Ibiden Co Ltd
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Filing: 1990-01-02
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Granted: 1991-06-11
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Expires: 2010-01-02
Abstract
Abstract According to the present invention, a circuit board for mounting electronic components including a metal layer united with a substrate layer with a predetermined portion of the metal layer exposed is manufactured by disposing a mask between a substrate layer and a metal layer where the metal layer is to be exposed and uniting the substrate layer and the metal layer with the mask therebetween, projecting a laser beam onto the substrate layer at the periphery of the mask to cut away the substrate layer adjacent to the mask, and stripping off that part of the substrate layer which remains on the mask and the mask.
Inventors
- 👤 Takeshi Takeyama
- 👤 Mitsuhiro Kondo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 13:11
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/4092; H05K3/0011; H05K3/0017; H05K3/0026; H05K3/0032; H05K3/0035; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W99/00; B; B23; B23K; B23K26/00; B23K26/36; B23K26/361; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09754; H05K2201/10; H05K2201/10613; H05K2201/10742; H05K2201/10886; H05K2201/10924; H05K2203/00; H05K2203/02; H05K2203/0264; H10W70/65; H10W70/654; H10W70/655; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/49155; Y10T29/49165; Y10T428/00; Y10T428/24; Y10T428/24273; Y10T428/24322; Y10T428/24802; Y10T428/24917
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
98 words
A method of manufacturing a circuit board for mounting electronic components including a metal layer exposed through part of a substrate layer comprising: disposing a mask on a part of a metal layer that will be exposed; placing a substrate layer covering said mask on the metal layer; uniting said substrate layer with said metal layer with said mask therebetween; projecting a laser beam onto said substrate layer adjacent to said mask to cut away said substrate layer adjacent to said mask; and stripping off that part of said substrate layer disposed on said mask and said mask.
Claim 2
Independent Claim
98 words
A method of manufacturing a circuit board for mounting electronic components including a metal layer exposed through part of a substrate layer comprising: disposing a mask on a part of a metal layer that will be exposed; placing a substrate layer covering said mask on the metal layer; uniting said substrate layer with said metal layer with said mask therebetween; projecting a laser beam onto said substrate layer adjacent to said mask to cut away said substrate layer adjacent to said mask; and stripping off that part of said substrate layer disposed on said mask and said mask.
Claim 3
Dependent Claim
51 words
A method of manufacturing a circuit board for mounting electronic components as defined in claim 1 wherein said substrate layer is a glass resin prepreg, said metal layer is a copper alloy sheet, and said mask is a resin film including projecting a laser beam emitted from a CO 2 laser.
Claim 4
Dependent Claim
49 words
A method of manufacturing a circuit board for mounting electronic components as defined in claim 1 wherein said substrate layer is a resin sheet, said metal layer is an aluminum plate, and said mask is a metal foil including projecting a laser beam emitted from a CO 2 laser.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-06-10 | 1994-12-10 | 1995-06-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-06-10 | 1998-12-10 | 1999-06-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-06-10 | 2002-12-10 | 2003-06-11 | $7700.00 | Window Closed / Lapsed |