US5028987A
Expired / Lapsed
US
⏱️ 0.0 years remaining
High current hermetic package having a lead extending through the package lid and a packaged semiconductor chip
Assignee: Silicon Power Corp
•
Filing: 1989-07-03
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Granted: 1991-07-02
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Expires: 2009-07-03
Abstract
Abstract A hermetic, high current package for a semiconductor device includes wide flat leads which are bonded to the contact pads of the device and formed to extend through apertures in an insulating lid. The lid is sealed to a base and the apertures around the leads are sealed with solder to provide the hermetic package. This package limits lateral current flow in the contact pads of the semiconductor device to relatively low levels which ensure the integrity of the contact pads.
Inventors
- 👤 Constantine A. Neugebauer
- 👤 Robert J. Satriano
- 👤 James F. Burgess
- 👤 II Homer H. Glascock
- 👤 Victor A. K. Temple
- 👤 Donald L. Watrous
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 21:44
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/60; H10W70/00; H10W70/40; H10W70/481; H10W72/90; H10W72/921; H10W72/926
Claims Analysis
Total Claims: 31
Claim 1
Independent Claim
96 words
A packaged semiconductor chip comprising: a contract pad on a first major surface of said chip; a package base; said chip being bonded to said package base; an electrically insulating non-glass lid having an elongated aperture therein; a flat conductor bonded to said contact pad and electrically continuous with a flat external terminal of said package; said external terminal extending through said elongated aperture in said lid; and said aperture and said lid being non-glass hermetically sealed and said lid being non-glass hermetically sealed to said package base to hermetically seal said chip in said package.
Claim 2
Dependent Claim
96 words
A packaged semiconductor chip comprising: a contract pad on a first major surface of said chip; a package base; said chip being bonded to said package base; an electrically insulating non-glass lid having an elongated aperture therein; a flat conductor bonded to said contact pad and electrically continuous with a flat external terminal of said package; said external terminal extending through said elongated aperture in said lid; and said aperture and said lid being non-glass hermetically sealed and said lid being non-glass hermetically sealed to said package base to hermetically seal said chip in said package.
Claim 3
Dependent Claim
15 words
The packaged chip recited in claim 1 wherein said flat conductor comprises said external terminal.
Claim 4
Dependent Claim
37 words
The packaged chip recited in claim 2 wherein: said flat conductor includes a strain relief bend therein between the portion thereof which is bonded to said contact pad and the portion thereof which extends through said aperture.
Claim 5
Dependent Claim
13 words
The packaged chip recited in claim 2 wherein: said aperture is a slot.
Claim 6
Dependent Claim
31 words
The packaged chip recited in claim 2 wherein: said lid includes metallization surrounding said aperture; and said aperture is sealed with solder which bonds said flat conductor to said surrounding metallization.
Claim 7
Dependent Claim
18 words
The packaged chip recited in claim 5 wherein: said metallization is disposed on the wall of said aperture.
Claim 8
Dependent Claim
19 words
The packaged chip recited in claim 6 wherein: said metallization extends onto the outer major surface of said lid.
Claim 9
Dependent Claim
19 words
The packaged chip recited in claim 5 wherein: said metallization is disposed on a major surface of said lid.
Claim 10
Dependent Claim
120 words
A packaged semiconductor chip comprising: a plurality of contact pads on a first surface of said chip; a package base; an insulating lid having first and second major surfaces and a plurality of apertures therein extending from said first major surface to said second major surface; an array of conductive bumps bonded to each of said contact pads; a plurality of external leads, each bonded to a different one of said contact pads by said conductive bumps disposed on that contact pad; each of said external leads extending through one of said apertures in said lid; each of said apertures being hermetically sealed; and each lid being hermetically sealed to said base to hermetically seal said chip in said package.
Claim 11
Dependent Claim
120 words
A packaged semiconductor chip comprising: a plurality of contact pads on a first surface of said chip; a package base; an insulating lid having first and second major surfaces and a plurality of apertures therein extending from said first major surface to said second major surface; an array of conductive bumps bonded to each of said contact pads; a plurality of external leads, each bonded to a different one of said contact pads by said conductive bumps disposed on that contact pad; each of said external leads extending through one of said apertures in said lid; each of said apertures being hermetically sealed; and each lid being hermetically sealed to said base to hermetically seal said chip in said package.
Claim 12
Dependent Claim
38 words
The packaged chip recited in claim 9 wherein: said lid includes metallization surrounding each of said apertures; each of said apertures is sealed with solder which bonds the external lead extending therethrough to said metallization surrounding that aperture.
Claim 13
Dependent Claim
32 words
The packaged chip recited in claim 10 wherein: at least one of said external leads is flat; and the one of said apertures through which said flat lead extends is a slot.
Claim 14
Dependent Claim
22 words
The packaged chip recited in claim 10 wherein: at least one of said apertures has said metallization disposed on the wall thereof.
Claim 15
Dependent Claim
25 words
The packaged chip recited in claim 12 wherein said metallization extends from said wall of said aperture onto said second major surface of said lid.
Claim 16
Dependent Claim
16 words
The packaged chip recited in claim 9 wherein: said chip is bonded to said package base.
Claim 17
Dependent Claim
44 words
An electrically insulating lid for a semiconductor device package comprising: a ceramic substrate having an elongated aperture therein; solderable metallization surrounding said elongated aperture and sealingly adhered to said substrate; said elongated aperture configured for insertion of a flat lead therein during package assembly.
Claim 18
Dependent Claim
44 words
An electrically insulating lid for a semiconductor device package comprising: a ceramic substrate having an elongated aperture therein; solderable metallization surrounding said elongated aperture and sealingly adhered to said substrate; said elongated aperture configured for insertion of a flat lead therein during package assembly.
Claim 19
Dependent Claim
18 words
The packaged chip recited in claim 1 wherein: said flat conductor is substantially coextensive with said contact pad.
Claim 20
Dependent Claim
28 words
The packaged chip recited in claim 9 wherein: said conductor is bonded to said contact pad at locations distributed across said contact pad in a substantially uniform manner.
Claim 21
Dependent Claim
13 words
The lid recited in claim 15 wherein said elongated aperture is substantially rectangular.
Claim 22
Dependent Claim
108 words
A packaged semiconductor chip comprising: a contact pad on a first major surface of said chip, said contact pad having a plurality of conductive bumps disposed thereon; a package base; said chip being bonded to said contact pad via said conductive bumps; an electrically insulating lid having an elongated aperture therein; a flat conductor bonded to said contact pad and electrically continuous with a flat external terminal of said package; said external terminal extending through said elongated aperture in said lid; and said aperture and said lid being hermetically sealed and said lid being hermetically sealed to said package base to hermetically seal said chip in said package.
Claim 23
Dependent Claim
108 words
A packaged semiconductor chip comprising: a contact pad on a first major surface of said chip, said contact pad having a plurality of conductive bumps disposed thereon; a package base; said chip being bonded to said contact pad via said conductive bumps; an electrically insulating lid having an elongated aperture therein; a flat conductor bonded to said contact pad and electrically continuous with a flat external terminal of said package; said external terminal extending through said elongated aperture in said lid; and said aperture and said lid being hermetically sealed and said lid being hermetically sealed to said package base to hermetically seal said chip in said package.
Claim 24
Dependent Claim
108 words
A packaged semiconductor chip comprising: a contact pad on a first major surface of said chip; a package base; said chip being bonded to said package base; an electrically insulating lid having an elongated aperture therein; a flat conductor bonded to said contact pad and electrically continuous with a flat external terminal of said package, said flat conductor having a substantially greater lateral current carrying capacity than said contact pad; said external terminal extending through said elongated aperture in said lid; and said aperture in said lid being hermetically sealed and said lid being hermetically sealed to said package base to hermetically seal said chip to said package.
Claim 25
Dependent Claim
108 words
A packaged semiconductor chip comprising: a contact pad on a first major surface of said chip; a package base; said chip being bonded to said package base; an electrically insulating lid having an elongated aperture therein; a flat conductor bonded to said contact pad and electrically continuous with a flat external terminal of said package, said flat conductor having a substantially greater lateral current carrying capacity than said contact pad; said external terminal extending through said elongated aperture in said lid; and said aperture in said lid being hermetically sealed and said lid being hermetically sealed to said package base to hermetically seal said chip to said package.
Claim 26
Dependent Claim
64 words
An electrically insulating lid for a semiconductor device package comprising: a ceramic substrate having an elongated aperture therein; solderable metallization surrounding said elongated aperture and sealingly adhered to said substrate; a solderable flat lead extending through said aperture and spaced from portions of the wall of said aperture; and a solder fillet hermetically sealing said aperture and extending from said lead to said metallization.
Claim 27
Dependent Claim
64 words
An electrically insulating lid for a semiconductor device package comprising: a ceramic substrate having an elongated aperture therein; solderable metallization surrounding said elongated aperture and sealingly adhered to said substrate; a solderable flat lead extending through said aperture and spaced from portions of the wall of said aperture; and a solder fillet hermetically sealing said aperture and extending from said lead to said metallization.
Claim 28
Dependent Claim
34 words
The packaged chip recited in claim 19 wherein: said conductive bumps are disposed on said pad in a pattern which extends across an area which is substantially larger than the area of said aperture.
Claim 29
Dependent Claim
27 words
The packaged chip recited in claim 22 wherein: said flat conductor disposed within said package has a substantially greater lateral current carrying capacity than said contact pad.
Claim 30
Dependent Claim
15 words
The packaged chip recited in claim 23 wherein: said flat conductor comprises a metal foil.
Claim 31
Dependent Claim
8 words
The packaged chip recited in claim 20 wherein:
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-07-01 | 1994-12-31 | 1995-07-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-07-01 | 1998-12-31 | 1999-07-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-07-01 | 2002-12-31 | 2003-07-02 | $7700.00 | Window Closed / Lapsed |