US5064706A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Carrier tape including molten resin flow path element for resin packaged semiconductor devices
Assignee: Mitsubishi Electric Corp
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Filing: 1988-12-08
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Granted: 1991-11-12
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Expires: 2008-12-08
Abstract
Abstract A carrier tape includes a film having an opening for receiving a semiconductor chip to be resin-molded by a pair of mold halves and outer lead holes formed around the periphery of the opening, a plurality of leads for mounting the semiconductor chip on the film, and a resin running portion cooperating, when the mold halves are closed with the film held between the mold halves, with a gate formed on a parting surface of one of the mold halves to define a resin running path which extends from a portion of the film outside the outer lead holes to the opening for guiding a molten resin into the mold halves while preventing the resin from entering the outer lead holes.
Inventors
- 👤 Tetsuya Ueda
- 👤 Haruo Shimamoto
- 👤 Hideya Yagoura
- 👤 Hiroshi Seki
- 👤 Yasuhiro Teraoka
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 19:22
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/701; H10W70/00; H10W70/40; H10W70/453; H10W70/464; H10W70/466; H10W74/00; H10W74/01; H10W74/016; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10S428/906; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T428/00; Y10T428/24; Y10T428/24273; Y10T428/24298; Y10T428/24322
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
198 words
A carrier tape for semiconductor devices comprising: an insulating film including a central opening for receiving a semiconductor chip to be resin-molded, a plurality of outer lead holes disposed around the periphery of the central opening, a supporting portion lying between and defined by the central opening and outer lead holes, and a plurality of bridging portions disposed between respective outer lead holes connecting the supporting portion with the film beyond the outer lead holes; and a plurality of leads, each having a first end mounted on said film and an opposing second end extending over one of the outer lead holes into the central opening for connection to an electrode of a semiconductor chip disposed in the central opening wherein each of said bridging portions has a width between adjacent outer lead holes, one of said bridging portions having a larger width than the other bridging portions for forming, with resin mold halves, a resin running path extending along the wider bridging portion from said film beyond the outer lead holes to the central opening for preventing molten resin from entering the outer lead holes during resin molding of a semiconductor chip disposed in the central opening.
Claim 2
Dependent Claim
198 words
A carrier tape for semiconductor devices comprising: an insulating film including a central opening for receiving a semiconductor chip to be resin-molded, a plurality of outer lead holes disposed around the periphery of the central opening, a supporting portion lying between and defined by the central opening and outer lead holes, and a plurality of bridging portions disposed between respective outer lead holes connecting the supporting portion with the film beyond the outer lead holes; and a plurality of leads, each having a first end mounted on said film and an opposing second end extending over one of the outer lead holes into the central opening for connection to an electrode of a semiconductor chip disposed in the central opening wherein each of said bridging portions has a width between adjacent outer lead holes, one of said bridging portions having a larger width than the other bridging portions for forming, with resin mold halves, a resin running path extending along the wider bridging portion from said film beyond the outer lead holes to the central opening for preventing molten resin from entering the outer lead holes during resin molding of a semiconductor chip disposed in the central opening.
References Cited (Backward Citations)
US4049903A
Cited
JPS53149764A
Cited
US4259436A
Cited
JPS5530895A
Cited
JPS609131A
Cited
JPS614263A
Cited
US4763409A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-11-11 | 1995-05-13 | 1995-11-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-11-11 | 1999-05-13 | 1999-11-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-11-11 | 2003-05-13 | 2003-11-12 | $7700.00 | Window Closed / Lapsed |