Semiconductor integrated circuit device

Claim 2

A semiconductor integrated circuit device comprising: a semiconductor substrate having a principal surface which basic cells are formed on and arranged in a matrix array; first power source wiring lines which are arranged over said basic cells, said arrangement being substantially in a first plane above and parallel to said principal surface, and which extend in a first extending direction; second power source wiring lines which are arranged over said first power source wiring lines, said arrangement being substantially in a second plane above and parallel to said first plane, and which extend in a second extending direction different from said first extending direction; and third power source wiring lines which are arranged over said second power source wiring lines and which extend in said first extending direction; wherein second contact holes for connecting the second power source wiring line and the third power source wiring line are arranged, when viewed in plan, around first contact holes for connecting the first power source wiring line and said second power source wiring line, in a region in which said first power source wiring line, said second power source wiring line and said third power source line intersect.

Claim 3

A semiconductor integrated circuit device according to claim 1, wherein a width of each said third power source wiring line is larger than a width of each said second power source wiring line, and said width of each said second power source wiring line is larger than a width of each said first power source wiring line.

Claim 4

A semiconductor integrated circuit device according to claim 12, wherein a total area of said second contact holes is larger than that of said first contact holes.

Claim 5

A semiconductor integrated circuit device according to claim 1, wherein said second contact holes are arranged in those regions within the intersection region which are outside regions lying in the direction of said second power source wiring line extending from said first contact holes.

Claim 6

A semiconductor integrated circuit device according to claim 4, wherein an opening size of each said second contact hole is substantially equal to that of each said first contact hole.

Claim 7

A semiconductor integrated circuit device according to claim 5, wherein each said basic cell is constructed of complementary MISFETs.

Claim 8

A semiconductor integrated circuit device according to claim 6, wherein said basic cells are arranged in a sea-of-gates organization.

Claim 9

A semiconductor integrate circuit device according to claim 1, wherein said first, second and third power source wiring lines are power source voltage wiring lines.

Claim 10

A semiconductor integrated circuit device according to claim 1, wherein said first, second and third power source wiring lines are reference voltage wiring lines.

Claim 11

A semiconductor integrated circuit device according to claim 1, wherein said power source wiring lines are made of metal.

Claim 12

A semiconductor integrated circuit device according to claim 1, wherein said second extending direction is substantially perpendicular to said first extending direction.

Claim 13

A semiconductor integrated circuit device having a basic cell array which is constructed of basic cells arranging in a matrix array, comprising: a semiconductor substrate having a principal surface which basic cells are formed on and arranged in a matrix array; first power source wiring lines which are arranged over said basic cells, said arrangement being substantially in a first plane above and parallel to said principal surface, to feed them with a supply voltage of first fixed level, and which extend in a first extending direction; second power source wiring lines which are arranged over said first power source wiring lines, said arrangement being substantially in a second plane above and parallel to said first plane, and are electrically connected with said first power source wiring lines through first contact holes, and which extend in a second extending direction different from said first extending direction; and third power source wiring lines which are arranged over said second power source wiring lines and are electrically connected with said second power source wiring lines through second contact holes, and which extend in said first extending direction; wherein second contact holes are arranged, when viewed in plan, around said first contact holes, in a region in which the first power source wiring line, the second power source wiring line and said third power source wiring line intersect.

Claim 14

A semiconductor integrated circuit device having a basic cell array which is constructed of basic cells arranging in a matrix array, comprising: a semiconductor substrate having a principal surface which basic cells are formed on and arranged in a matrix array; first power source wiring lines which are arranged over said basic cells, said arrangement being substantially in a first plane above and parallel to said principal surface, to feed them with a supply voltage of first fixed level, and which extend in a first extending direction; second power source wiring lines which are arranged over said first power source wiring lines, said arrangement being substantially in a second plane above and parallel to said first plane, and are electrically connected with said first power source wiring lines through first contact holes, and which extend in a second extending direction different from said first extending direction; and third power source wiring lines which are arranged over said second power source wiring lines and are electrically connected with said second power source wiring lines through second contact holes, and which extend in said first extending direction; wherein second contact holes are arranged, when viewed in plan, around said first contact holes, in a region in which the first power source wiring line, the second power source wiring line and said third power source wiring line intersect.

Claim 15

A semiconductor integrated circuit device according to claim 12, wherein a width of each said third power source wiring line is larger than a width of each said second power source wiring line, and said width of each said second power source wiring line is larger than a width of each said first power source wiring line.

Claim 16

A semiconductor integrated circuit device according to claim 13, wherein a total area of said second contact holes is larger than that of said first contact holes.

Claim 17

A semiconductor integrated circuit device according to claim 12, wherein said second contact holes are arranged in those regions within the intersection region which are outside regions lying in the direction of said second power source wiring line extending from said first contact holes.

Claim 18

A semiconductor integrated circuit device according to claim 15, wherein an opening size of each said second contact hole is substantially equal to that of said each first contact hole.

Claim 19

A semiconductor integrated circuit device according to claim 16, wherein each said basic cell is constructed of complementary MISFETs.

Claim 20

A semiconductor integrated circuit device according to claim 17, wherein said basic cells are arranged in a sea-of-gates organization.

Claim 21

A semiconductor integrated circuit device according to claim 12, wherein said first, second and third power source wiring lines are power source voltage wiring lines.

Claim 22

A semiconductor integrated circuit device according to claim 12, wherein said first, second and third power source wiring lines are reference voltage wiring lines.

Claim 23

A semiconductor integrated circuit device according to claim 12, wherein said power source wiring lines are made of metal.

Claim 24

A semiconductor integrated circuit device comprising: a semiconductor substrate having a principal surface which basic cells are formed on and arranged in a matrix array; a first insulator film which is formed so as to cover said basic cells; first power source wiring lines which are arranged, said arrangement being substantially in a first plane above and parallel to said principal surface, on said first insulator film to feed them with a supply voltage of first fixed level, and which extend in a first extending direction; first signal wiring lines which are arranged on said first insulator film; a second insulator film which is formed so as to cover said first power source wiring lines and said first signal wiring lines; second power source wiring lines which are arranged on said second insulator film, said arrangement being substantially in a second plane above and parallel to said first plane, and are electrically connected with said first power source wiring lines through first contact holes, and which extend in a second extending direction different from said first extending direction; second signal wiring lines which are arranged on said second insulator film and are electrically connected with said first signal wiring lines through second contact holes, wherein an opening size of each said second contact hole is equal to that of each said first contact hole; a third insulator film which is formed to as to cover said second power source wiring lines and said second signal wiring lines; third power source wiring lines which are arranged on said third insulator film, and are electrically connected with said second power source wiring lines through third contact holes, and which extend in said first extending direction; and third signal wiring lines which are arranged on said third insulator film and are electrically connected with said second signal wiring lines through fourth contact holes, wherein an opening size of each said fourth contact hole is equal to that of each said third contact hole; wherein said third contact holes are arranged, when viewed in plan, around said first contact holes, in a region in which the first power source wiring line, the second power source wiring line and the third power source wiring line intersect.

Claim 25

A semiconductor integrated circuit device comprising: a semiconductor substrate having a principal surface which basic cells are formed on and arranged in a matrix array; a first insulator film which is formed so as to cover said basic cells; first power source wiring lines which are arranged, said arrangement being substantially in a first plane above and parallel to said principal surface, on said first insulator film to feed them with a supply voltage of first fixed level, and which extend in a first extending direction; first signal wiring lines which are arranged on said first insulator film; a second insulator film which is formed so as to cover said first power source wiring lines and said first signal wiring lines; second power source wiring lines which are arranged on said second insulator film, said arrangement being substantially in a second plane above and parallel to said first plane, and are electrically connected with said first power source wiring lines through first contact holes, and which extend in a second extending direction different from said first extending direction; second signal wiring lines which are arranged on said second insulator film and are electrically connected with said first signal wiring lines through second contact holes, wherein an opening size of each said second contact hole is equal to that of each said first contact hole; a third insulator film which is formed to as to cover said second power source wiring lines and said second signal wiring lines; third power source wiring lines which are arranged on said third insulator film, and are electrically connected with said second power source wiring lines through third contact holes, and which extend in said first extending direction; and third signal wiring lines which are arranged on said third insulator film and are electrically connected with said second signal wiring lines through fourth contact holes, wherein an opening size of each said fourth contact hole is equal to that of each said third contact hole; wherein said third contact holes are arranged, when viewed in plan, around said first contact holes, in a region in which the first power source wiring line, the second power source wiring line and the third power source wiring line intersect.

Claim 26

A semiconductor integrated circuit device according to claim 22, wherein a width of each said third power source wiring line is larger than a width of each said second power source wiring line, and said width of each said second power source wiring line is larger than a width of each said first power source wiring line.

Claim 27

A semiconductor integrated circuit device according to claim 23, wherein a total area of said third contact holes is larger than that of said first contact holes.

Claim 28

A semiconductor integrated circuit device according to claim 13, wherein said third contact holes are arranged in those regions within the intersection region which are outside regions lying in the direction of said second power source wiring line extending from said first contact holes.

Claim 29

A semiconductor integrated circuit device according to claim 25, wherein an opening size of said each third contact hole is substantially equal to that of said each first contact hole.

Claim 30

A semiconductor integrated circuit device according to claim 26, wherein said each basic cell is constructed of complementary MISFETs.

Claim 31

A semiconductor integrated circuit device according to claim 27, wherein said basic cells are arranged in a sea-of-gates organization.

Claim 32

A semiconductor integrated circuit device according to claim 28, wherein said first contact holes are arranged in a first region, within the intersection region when viewed in plan, wherein said first power source wiring line and said second power source wiring line are overlapped, and wherein said second contact holes are arranged in second regions except third regions, within the intersection region when viewed in plan which are laying in said second extending direction extending from said first region.

Claim 33

A semiconductor integrated circuit device according to claim 22, wherein said first, second and third power source wiring lines are power source voltage wiring lines.

Claim 34

A semiconductor integrated circuit device according to claim 29, wherein said first contact holes are arranged in a matrix array within said first region, and said second contact holes are arranged in a matrix array within said second regions.

Claim 35

A semiconductor integrated circuit device according to claim 22, wherein said first, second and third power source wiring lines are reference voltage wiring lines.

Claim 36

A semiconductor integrated circuit device according to claim 32, wherein said first contact holes are formed in a first inter-layer insulating film which is disposed between said first power source wiring line and said second power source inter-layer insulating film which is disposed between said second power source wiring line and said third power source wiring line.

Claim 37

A semiconductor integrated circuit device according to claim 22, wherein said power source wiring lines are made of metal.

Claim 38

A semiconductor integrated circuit device according to claim 34, wherein said first power source wiring line is comprised of a first-level metal layer, said second power source wiring line is comprised of a second-level metal layer, and said third power source wiring line is comprised of a third-level metal layer.