US5140405A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor assembly utilizing elastomeric single axis conductive interconnect
Assignee: Micron Technology Inc
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Filing: 1991-03-29
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Granted: 1992-08-18
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Expires: 2011-03-29
Abstract
Abstract An semiconductor assembly includes at least one die having substantially planar first and second engagement surfaces and external edges which define a die shape. A base having an opening formed therein receives the die. The base opening has peripheral edges which define an opening shape and size which is complementary to the die external shape. The opening edges engage the die edges to spatially fix the die in a selected orientation in a plane parallel to the die first planar engagement surface. An interconnecting plate has at least one substantially planar engagement surface facing the first planar engagement surface of the die received within the base opening. At least one conductive pad on the plate planar engagement surface is spatially aligned or registered with a corresponding conductive pad on the first engagement surface of the die. A sheet of anisotropically conductive elastomeric material is interposed between the base and interconnecting plate between the first engagement surface of the die and engagement surface of the interconnecting plate. The base and interconnecting plate are clamped relative to one another in selected registration, sandwiching the anisotropically conductive elastomeric material therebetween. This conductively engages the at least one conductive pad of the die with the at least one conductive pad of the interconnecting plate through the sheet of anisotropically conductive elastomeric material.
Inventors
- 👤 Jerrold L. King
- 👤 Jerry M. Brooks
- 👤 Warren M. Farnworth
- 👤 George P. McGill
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 01:50
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W90/00; H10W90/401; H10W72/00; H10W72/01; H10W72/0198; H10W72/071; H10W72/073; H10W72/074; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W90/701; H10W90/731; H10W90/734
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
277 words
A semiconductor assembly comprising: a die having substantially planar first and second engagement surfaces, a defined thickness therebetween, and having external edges which define a die external shape, the first engagement surface including one or more conductive pads; a base having an opening formed therein, the base opening having peripheral edges which define an opening shape which is complementary to the die external shape, the opening being sized to receive and engage the die, the die being so received within the base opening with the opening edges engaging the die edges to spatially fix the die in a selected orientation in a plane parallel to the die first planar engagement surface; an interconnecting plate having at least one substantially planar engagement surface facing the first planar engagement surface of the die received within the base opening, the plate planar engagement surface having one or more conductive pads and conductive traces formed thereon, at least one conductive pad of the plate planar engagement surface being spatially aligned with one conductive pad on the first engagement surface of the die received within the base opening; a sheet of anisotropically conductive elastomeric material that is electrically conductive in a direction across its thickness, the sheet being interposed between the base and interconnecting plate between the first engagement surface of the die and engagement surface of the interconnecting plate; and clamping means engaging the base and interconnecting plate for urging the die and plate toward one another in spatial registration to conductively engage the at least one conductive pad of the die with the at least one conductive pad of the interconnecting plate through the sheet of anisotropically conductive elastomeric material.
Claim 2
Dependent Claim
277 words
A semiconductor assembly comprising: a die having substantially planar first and second engagement surfaces, a defined thickness therebetween, and having external edges which define a die external shape, the first engagement surface including one or more conductive pads; a base having an opening formed therein, the base opening having peripheral edges which define an opening shape which is complementary to the die external shape, the opening being sized to receive and engage the die, the die being so received within the base opening with the opening edges engaging the die edges to spatially fix the die in a selected orientation in a plane parallel to the die first planar engagement surface; an interconnecting plate having at least one substantially planar engagement surface facing the first planar engagement surface of the die received within the base opening, the plate planar engagement surface having one or more conductive pads and conductive traces formed thereon, at least one conductive pad of the plate planar engagement surface being spatially aligned with one conductive pad on the first engagement surface of the die received within the base opening; a sheet of anisotropically conductive elastomeric material that is electrically conductive in a direction across its thickness, the sheet being interposed between the base and interconnecting plate between the first engagement surface of the die and engagement surface of the interconnecting plate; and clamping means engaging the base and interconnecting plate for urging the die and plate toward one another in spatial registration to conductively engage the at least one conductive pad of the die with the at least one conductive pad of the interconnecting plate through the sheet of anisotropically conductive elastomeric material.
Claim 3
Dependent Claim
22 words
The semiconductor assembly of claim 1 wherein the interconnecting plate further includes a plurality of edge conductors operably connected to the traces.
Claim 4
Dependent Claim
54 words
The semiconductor assembly of claim 1 wherein the interconnecting plate includes a second planar engagement surface opposing the one planar engagement surface, the base includes a planar engagement surface, the assembly further comprising rigid backing plates overlying the second planar engagement surface of the interconnecting plate and the planar engagement surface of the base.
Claim 5
Dependent Claim
36 words
The semiconductor assembly of claim 1 wherein the base includes first and second engagement surfaces and a thickness defined therebetween, the base opening extending entirely through the base between the base first and second engagement surfaces.
Claim 6
Dependent Claim
48 words
The semiconductor assembly of claim 4 wherein the interconnecting plate includes a second planar engagement surface opposing the one planar engagement surface, the assembly further comprising rigid backing plates overlying the second planar engagement surface of the interconnecting plate and the second planar engagement surface of the base.
Claim 7
Dependent Claim
94 words
The semiconductor assembly of claim 1 wherein the base includes a first planar engagement surface, the base opening being defined by a recess formed into the base from the first base planar engagement surface, the recess having a planar recess base surface, the recess having a depth which is substantially equal to the die thickness, the die being received within the recess with the die second planar engagement surface being received against the planar recess base surface and the die first planar engagement surface being substantially coplanar with the first base planar engagement surface.
Claim 8
Dependent Claim
56 words
The semiconductor assembly of claim 6 wherein the interconnecting plate includes a second planar engagement surface opposing the one planar engagement surface, the base includes a second planar engagement surface, the assembly further comprising rigid backing plates overlying the second planar engagement surface of the interconnecting plate and the second planar engagement surface of the base.
Claim 9
Dependent Claim
282 words
A semiconductor assembly comprising: a plurality of dies having substantially planar first and second engagement surfaces, engagement surfaces including one or more conductive pads, defined thicknesses therebetween, and external edges which define die eternal shapes, the first engagement surfaces including one or more conductive pads; a base having a plurality of openings formed therein, the base openings having peripheral edges which define opening shapes which are complementary to the respective die external shapes, the respective openings being sized to receive and engage respective dies, the respective dies being so received within the respective base openings with the opening edges engaging the respective die edges to spatially fix the respective dies in a selected orientation in a plane parallel to the respective die first planar engagement surfaces; an interconnecting plate having at least one substantially planar engagement surface facing the first planar engagement surfaces of the dies received within the base openings, the plate planar engagement having a plurality of conductive pads and traces formed thereon, the conductive pads of the plate planar engagement surface being spatially aligned with respective conductive pads on the first planar engagement surfaces of the dies received within the base openings; a sheet of anisotropically conductive elastomeric material that is electrically conductive in a direction across its thickness, the sheet being interposed between the base and interconnecting plate between the first engagement surfaces of the dies and engagement surface of the interconnecting plate; and clamping means engaging the base and interconnecting plate for urging the dies and plate toward one another in spatial registration to conductively engage the conductive pads of the dies with conductive pads of the interconnecting plate through the sheet of anisotropically conductive elastomeric material.
Claim 10
Dependent Claim
282 words
A semiconductor assembly comprising: a plurality of dies having substantially planar first and second engagement surfaces, engagement surfaces including one or more conductive pads, defined thicknesses therebetween, and external edges which define die eternal shapes, the first engagement surfaces including one or more conductive pads; a base having a plurality of openings formed therein, the base openings having peripheral edges which define opening shapes which are complementary to the respective die external shapes, the respective openings being sized to receive and engage respective dies, the respective dies being so received within the respective base openings with the opening edges engaging the respective die edges to spatially fix the respective dies in a selected orientation in a plane parallel to the respective die first planar engagement surfaces; an interconnecting plate having at least one substantially planar engagement surface facing the first planar engagement surfaces of the dies received within the base openings, the plate planar engagement having a plurality of conductive pads and traces formed thereon, the conductive pads of the plate planar engagement surface being spatially aligned with respective conductive pads on the first planar engagement surfaces of the dies received within the base openings; a sheet of anisotropically conductive elastomeric material that is electrically conductive in a direction across its thickness, the sheet being interposed between the base and interconnecting plate between the first engagement surfaces of the dies and engagement surface of the interconnecting plate; and clamping means engaging the base and interconnecting plate for urging the dies and plate toward one another in spatial registration to conductively engage the conductive pads of the dies with conductive pads of the interconnecting plate through the sheet of anisotropically conductive elastomeric material.
Claim 11
Dependent Claim
22 words
The semiconductor assembly of claim 8 wherein the interconnecting plate further includes a plurality of edge conductors operably connected to the traces.
Claim 12
Dependent Claim
54 words
The semiconductor assembly of claim 8 wherein the interconnecting plate includes a second planar engagement surface opposing the one planar engagement surface, the base includes a planar engagement surface, the assembly further comprising rigid backing plates overlying the second planar engagement surface of the interconnecting plate and the planar engagement surface of the base.
Claim 13
Dependent Claim
35 words
The semiconductor assembly of claim 8 wherein the base includes first and second engagement surfaces and a thickness defined therebetween, the base openings extending entirely through the base between the first and second engagement surfaces.
Claim 14
Dependent Claim
48 words
The semiconductor assembly of claim 11 wherein the interconnecting plate includes a second planar engagement surface opposing the one planar engagement surface, the assembly further comprising rigid backing plates overlying the second planar engagement surface of the interconnecting plate and the second planar engagement surface of the base.
Claim 15
Dependent Claim
94 words
The semiconductor assembly of claim 8 wherein the base includes a first planar engagement surface, the base openings being defined by recesses formed into the base from the first base planar engagement surface, the recesses having planar recess base surfaces, the recesses having depths which are substantially equal to the respective die thickness, the respective dies being received within the respective recessed with the die second planar engagement surfaces being received against the planar recess base surfaces and the die first planar engagement surfaces being substantially coplanar with the first base planar engagement surface.
Claim 16
Dependent Claim
56 words
The semiconductor assembly of claim 13 wherein the interconnecting plate includes a second planar engagement surface opposing the one planar engagement surface, the base includes a second planar engagement surface, the assembly further comprising rigid backing plates overlying the second planar engagement surface of the interconnecting plate and the second planar engagement surface of the base.
Claim 17
Dependent Claim
19 words
The semiconductor assembly of claim 13 wherein the dies comprise electronic memories arranged in a single in-line memory module.
References Cited (Backward Citations)
GB232127A
Cited
GB2072433A
Cited
US4744850A
Cited
US4729809A
Cited
US4692839A
Cited
US4954873A
Cited
US4652973A
Cited
US4954875A
Cited
US5001542A
Cited
US4902857A
Cited
US4933747A
Cited
US4922376A
Cited
US5006919A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-08-18 | 1996-02-17 | 1996-08-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-08-18 | 2000-02-17 | 2000-08-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-08-18 | 2004-02-17 | 2004-08-18 | $7700.00 | Window Closed / Lapsed |