US5151276A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Resin molding apparatus
Assignee: Toshiba Corp
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Filing: 1990-12-27
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Granted: 1992-09-29
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Expires: 2010-12-27
Abstract
Abstract A resin molding apparatus for molding an insulating resin mold at the peripheral portion of a semiconductor wafer has an upper metallic mold, and a lower metallic mold which clamps the semiconductor wafer with the upper metallic mold. The upper and lower metallic molds form a resin space at the portion corresponding to the peripheral portion of the semiconductor wafer. The contact surfaces of the upper and lower metallic molds, which are in contact with the semiconductor wafer, and the inner surface of the resin space are coated with elastic material which does not adhere to the insulating resin.
Inventors
- 👤 Mitsuo Sato
- 👤 Hazime Shaura
- 👤 Megumi Tateishi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 12:33
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; B; B29; B29C; B29C45/00; B29C45/14; B29C45/14639; B29C45/14655; B29C45/17; B29C45/26; B29C45/37
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
188 words
A resin molding apparatus for molding an insulating resin mold at the peripheral portion of a semiconductor wafer comprising: an upper metallic mold having an upper mold contact surface in contact with the semiconductor wafer, a lower metallic mold having a lower mold contact surface in contact with the semiconductor wafer, and for clamping the semiconductor wafer with the upper metallic mold, and first and second resin stoppers; wherein the upper lower metallic molds form a resin space therebetween which is to be filled with insulating resin through an injection port at the portion corresponding to the peripheral portion of the semiconductor wafer, the upper mold contact surface, the lower mold contact surface and the inner surface of the resin space are coated with an elastic material which does not adhere to the insulating resin; the resin space communicates with the outside environment through the injection port and a discharge port, the first resin stopper cooperates with the injection port to close an upper portion of the injection port, and the second resin stopper cooperates with the discharge port to close an upper portion of the discharge port.
Claim 2
Dependent Claim
188 words
A resin molding apparatus for molding an insulating resin mold at the peripheral portion of a semiconductor wafer comprising: an upper metallic mold having an upper mold contact surface in contact with the semiconductor wafer, a lower metallic mold having a lower mold contact surface in contact with the semiconductor wafer, and for clamping the semiconductor wafer with the upper metallic mold, and first and second resin stoppers; wherein the upper lower metallic molds form a resin space therebetween which is to be filled with insulating resin through an injection port at the portion corresponding to the peripheral portion of the semiconductor wafer, the upper mold contact surface, the lower mold contact surface and the inner surface of the resin space are coated with an elastic material which does not adhere to the insulating resin; the resin space communicates with the outside environment through the injection port and a discharge port, the first resin stopper cooperates with the injection port to close an upper portion of the injection port, and the second resin stopper cooperates with the discharge port to close an upper portion of the discharge port.
Claim 3
Dependent Claim
16 words
The resin molding apparatus as claimed in claim 1, wherein the elastic material is trifluoride resin.
Claim 4
Dependent Claim
16 words
The resin molding apparatus as claimed in claim 1, wherein the elastic material is tetrafluoride resin.
Claim 5
Dependent Claim
28 words
The resin molding apparatus as claimed in claim 1, wherein the injection port and the discharge port each have inner surfaces which are coated with the elastic material.
Claim 6
Dependent Claim
16 words
The resin molding apparatus as claimed in claim 4, wherein the elastic material is trifluoride resin.
Claim 7
Dependent Claim
16 words
The resin molding apparatus as claimed in claim 4, wherein the elastic material is tetrafluoride resin.
Claim 8
Dependent Claim
27 words
A resin molding apparatus as claimed in claim 4, further comprising first and second mold holders which are connected to the upper and lower metallic molds, respectively.
Claim 9
Dependent Claim
27 words
A resin molding apparatus as claimed in claim 7, further comprising first and second heat blocks which are connected to said first and second mold holders, respectively.
Claim 10
Dependent Claim
33 words
A resin molding apparatus as claimed in claim 8, wherein the injection and discharge ports are formed in the second mold holder and extend to an upper surface of the second mold holder.
Claim 11
Dependent Claim
39 words
A resin molding apparatus as claimed in claim 9, wherein said first mold holder fits within said second mold holder such that the resin space is defined by the upper and lower metallic molds and the second mold holder.
Claim 12
Dependent Claim
23 words
A resin molding apparatus as claimed in claim 10, wherein the first and second resin stoppers are provided on the first mold holder.
Claim 13
Dependent Claim
31 words
A resin molding apparatus as claimed in claim 11, further comprising means for blowing high pressure air against the semiconductor wafer thereby dislodging the semiconductor wafer, from the lower metallic mold.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-09-29 | 1996-03-30 | 1996-09-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-09-29 | 2000-03-30 | 2000-09-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-09-29 | 2004-03-30 | 2004-09-29 | $7700.00 | Window Closed / Lapsed |