Elastomer connector for integrated circuits or similar, and method of manufacturing same

Claim 2

Elastomer connector for integrated and hybrid circuits, comprising an elastomer material support on which electro-conducting lines are formed, whose ends are intended to be connected by pressure contact to input/output conductors of such circuits, wherein said electro-conducting lines are solid and continuous metal conductors, partially embedded in the elastomer material support and having minimum widths of about one micron.

Claim 3

Connector as claimed in claim 1, wherein the minimum thicknesses of the electro-conducting lines are of about five microns.

Claim 4

Connector as claimed in claim 1, wherein the minimum pitch of the electro-conducting lines is of about five microns.

Claim 5

Connector as claimed in claim 1, wherein the elastomer material of the support is transparent.

Claim 6

Connector as claimed in claim 1, comprising at least two superimposed levels of electro-conducting lines, the upper level being separated from the lower level by a thickness of a dielectric polymer material, the electro-conducting lines of the lower level being connected to electro-conducting lines and zones of the upper level by electrically conducting metal studs passing through said polymer material thickness.

Claim 7

Connector as claimed in claim 5, wherein said polymer material is transparent.

Claim 8

Method of manufacturing an elastomer connector for integrated and hybrid circuits, comprising an elastomer material support on which electro-conducting lines are formed, said method comprising depositing on a face of the support a thin layer of strippable material, forming channels by photo-etching in this thin layer and in the underlying face of the support, said channels having a minimum width of about one micron, depositing a thin electrically conducting metal layer on this strippable material layer and in said channels of the support, then removing said strippable material layer with the metal layer which covers it from the support so as to leave only the metal in said channels of the support for forming said electro-conducting lines.

Claim 9

Method of manufacturing an elastomer connector for integrated and hybrid circuits, comprising an elastomer material support on which electro-conducting lines are formed, said method comprising depositing on a face of the support a thin layer of strippable material, forming channels by photo-etching in this thin layer and in the underlying face of the support, said channels having a minimum width of about one micron, depositing a thin electrically conducting metal layer on this strippable material layer and in said channels of the support, then removing said strippable material layer with the metal layer which covers it from the support so as to leave only the metal in said channels of the support for forming said electro-conducting lines.

Claim 10

Method as claimed in claim 7, wherein said step of forming channels by photo-etching comprises depositing a photo-sensitive resin layer on the strippable material layer, exposing this resin layer to light radiation of suitable kind through a mask, developing said resin layer, then etching said strippable material layer and then the face of the support before depositing the thin electro-conducting metal layer.

Claim 11

Method as claimed in claim 7, comprising in depositing initially on said face of the support a thin intermediate layer of polymer material on which the thin layer of strippable material is then deposited, then etching this thin intermediate layer at the same time as said face of the support.

Claim 12

Method as claimed in claim 9, wherein, after deposition of the metal layer and removal of the strippable material layer, said intermediate layer is subjected to an additional etching operation for reducing its thickness.

Claim 13

Method as claimed in claim 7, comprising the further steps of covering said face of the support, on which the electro-conducting lines are formed, with a thin layer of polymer material, forming in the above mentioned way by etching and metal deposition, electro-conducting studs which pass through this thin layer and are connected to said electro-conducting lines, then depositing a new thin layer of polymer material and forming therein, by etching and metal deposition as mentioned above, a new series of electro-conducting lines and zones, some of which are connected to said studs.