US5164818A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Removable vlsi assembly
Assignee: International Business Machines Corp
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Filing: 1991-09-24
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Granted: 1992-11-17
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Expires: 2011-09-24
Abstract
Abstract A system for mounting VLSI devices on a substrate is disclosed, offering a high contact density. Each package consists of a semiconductor device having protruding elongated contact pin (2) on its surface and a wiring substrate having a cavity (3) on its surface. The cavities are filed with a conductive material (7) of a low melting point composition and sealed with a thin non-conductive foil (4). During packaging, the contact pins are made to penetrate the foil, and extend into the conductive alloy, thus making electrical contact therewith. To ease the penetration of the foil, the contact pins could be set into oscillating motion by means of an ultrasonic generator.
Inventors
- 👤 Arnold Blum
- 👤 Frank Gerth
- 👤 Manfred Perske
- 👤 Manfred Schmidt
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 16:42
CPC Classifications
H; H10; H10W; H10W72/00; H05; H05K; H05K3/00; H05K3/30; H05K3/306; H05K3/32; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09472; H05K2201/10; H05K2201/10431; H05K2201/10575; H05K2201/10613; H05K2201/10621; H05K2201/10689; H05K2201/10704; H05K2203/00; H05K2203/02; H05K2203/0285; H05K2203/11; H05K2203/1189; H05K2203/17; H05K2203/176; H05K3/22; H05K3/28; H05K3/281; H05K3/34; H05K3/346
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
124 words
A semiconductor package comprising a semiconductor device having a major surface; a plurality of elongated means located on the surface of said device extending perpendicular to said major surface, and a substrate having a major surface and a a plurality of cavities on the major surface of said substrate, each cavity of said plurality of cavities, located with respect to the corresponding position of one of said plurality of elongated means on said device, a conductive metal having a melting temperature no greater than wood alloy melting temperatures in each of said cavities; and a nonconductive foil covering each of said cavities and said conductive metal, said elongated means penetrating said foil and establishing electrical contact between said conductive metal and said elongated means.
Claim 2
Dependent Claim
124 words
A semiconductor package comprising a semiconductor device having a major surface; a plurality of elongated means located on the surface of said device extending perpendicular to said major surface, and a substrate having a major surface and a a plurality of cavities on the major surface of said substrate, each cavity of said plurality of cavities, located with respect to the corresponding position of one of said plurality of elongated means on said device, a conductive metal having a melting temperature no greater than wood alloy melting temperatures in each of said cavities; and a nonconductive foil covering each of said cavities and said conductive metal, said elongated means penetrating said foil and establishing electrical contact between said conductive metal and said elongated means.
Claim 3
Dependent Claim
14 words
The package according to claim 1, wherein said elongated means are tapered contact pins.
Claim 4
Dependent Claim
26 words
The package according to claim 1, wherein said elongated means are formed of a material selected from the group comprising tungsten, tungsten-carbide, copper-beryllium, and doped silicon.
Claim 5
Dependent Claim
20 words
The package according to claim 1, wherein said elongated means are formed by etching said major surface of said device.
Claim 6
Dependent Claim
25 words
The package according to claim 1, wherein said elongated means is about 30 microns in diameter and having a tip sharpened to about 5 microns.
Claim 7
Dependent Claim
16 words
The package according to claim 1, wherein said cavities are connected to wiring on said substrate.
Claim 8
Dependent Claim
24 words
The package according to claim 1, wherein said conductive metal consists of a material selected from the group comprising the wood alloys and mercury.
Claim 9
Dependent Claim
23 words
The package according to claim 1, wherein said foil has a thickness equal to or less than the diameter of the elongated means.
Claim 10
Dependent Claim
15 words
The package according to claim 1, wherein said foil consists of a non-conductive elastic material.
Claim 11
Dependent Claim
21 words
The package according to claim 1, wherein said cavity has a surface width several times the diameter of the elongated means.
Claim 12
Dependent Claim
24 words
The package according to claim 1, wherein a region around said elongated means is recessed with respect to the major surface of the device.
Claim 13
Dependent Claim
22 words
The package according to claim 1, wherein said wiring substrate consists of a material selected from the group comprising ceramic and silicon.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-11-17 | 1996-05-18 | 1996-11-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-11-17 | 2000-05-18 | 2000-11-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-11-17 | 2004-05-18 | 2004-11-17 | $7700.00 | Window Closed / Lapsed |