US5166856A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electrostatic chuck with diamond coating
Assignee: International Business Machines Corp
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Filing: 1991-01-31
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Granted: 1992-11-24
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Expires: 2011-01-31
Abstract
Abstract An electrostatic chuck includes a body of refractory metal, preferably molybdenum, sized to support a semiconductor wafer. A first layer of diamond having a thickness in the range of 0.1-5.0 microns coats the refractory metal body. A pair of generally planar electrodes, preferably formed by molybdenum, are disposed on the first layer of diamond. A second layer of diamond, of like thickness as the first layer, conformally coats the pair of electrodes. A dc voltage applied across the pair of electrodes develops an electrostatic force to hold the wafer against the second diamond layer.
Inventors
- 👤 James W. Liporace
- 👤 James A. Seirmarco
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 21:50
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/70; G03F7/70691; G03F7/707; G03F7/70708; H; H10; H10P; H10P72/00; H10P72/70; H10P72/72; H10P72/722; Y; Y10; Y10S; Y10S269/00; Y10S269/903; Y10T; Y10T279/00; Y10T279/23
Claims Analysis
Total Claims: 43
Claim 1
Independent Claim
56 words
An electrostatic chuck for supporting a wafer, comprising: a conductive body; a layer of diamond coating at least a portion of said conductive body; and means for developing an electrostatic force, including two electrodes supported on said body between said body and said layer of diamond coating to hold said wafer against said layer of diamond.
Claim 2
Dependent Claim
56 words
An electrostatic chuck for supporting a wafer, comprising: a conductive body; a layer of diamond coating at least a portion of said conductive body; and means for developing an electrostatic force, including two electrodes supported on said body between said body and said layer of diamond coating to hold said wafer against said layer of diamond.
Claim 3
Dependent Claim
14 words
The electrostatic chuck of claim 1 wherein said conductive body comprises a refractory metal.
Claim 4
Dependent Claim
24 words
The electrostatic chuck of claim 1 wherein said means for developing an electrostatic force includes means for applying an electrical potential to said body.
Claim 5
Dependent Claim
46 words
An electrostatic chuck for supporting a wafer, comprising: a body of conductive material; a first layer of diamond coating at least a portion of said body; two electrodes disposed on said first layer of diamond; and a second layer of diamond over said two electrical conductors.
Claim 6
Dependent Claim
46 words
An electrostatic chuck for supporting a wafer, comprising: a body of conductive material; a first layer of diamond coating at least a portion of said body; two electrodes disposed on said first layer of diamond; and a second layer of diamond over said two electrical conductors.
Claim 7
Dependent Claim
13 words
The electrostatic chuck of claim 4 wherein said two electrodes are generally planar.
Claim 8
Dependent Claim
16 words
The electrostatic chuck of claim 4 wherein said body of conductive material comprises a refractory metal.
Claim 9
Dependent Claim
16 words
The electrostatic chuck of claim 4 wherein each of said two electrodes comprises a refractory metal.
Claim 10
Dependent Claim
23 words
The electrostatic chuck of claim 4 wherein said first and second diamond layers each have a thickness in the range of 0.1-5.0 microns.
Claim 11
Dependent Claim
23 words
The electrostatic chuck of claim 8 wherein said first and second diamond layers each have a thickness in the range of 1.0-2.0 microns.
Claim 12
Dependent Claim
25 words
The electrostatic chuck of claim 4 and further including means for developing an electrostatic force for holding said wafer against said second layer of diamond.
Claim 13
Dependent Claim
25 words
The electrostatic chuck of claim 10 wherein said means for developing an electrostatic force includes means for applying an electric potential between said two electrodes.
Claim 14
Dependent Claim
64 words
An electrostatic chuck for supporting a wafer comprising: a body of refractory metal including at least one planar surface sized to support said wafer; a first layer of diamond coating at least said planar surface; at least two generally planar refractory metal electrical conductors disposed on said first layer of diamond; and a second layer of diamond coating said at least two electrical conductors.
Claim 15
Dependent Claim
64 words
An electrostatic chuck for supporting a wafer comprising: a body of refractory metal including at least one planar surface sized to support said wafer; a first layer of diamond coating at least said planar surface; at least two generally planar refractory metal electrical conductors disposed on said first layer of diamond; and a second layer of diamond coating said at least two electrical conductors.
Claim 16
Dependent Claim
36 words
The electrostatic chuck of claim 12 wherein said second layer of diamond is situated conformally to cover said at least two conductors and any regions of said first layer of diamond exposed between said two conductors.
Claim 17
Dependent Claim
25 words
The electrostatic chuck of claim 13 and further including means for developing an electrostatic force to support said wafer against said second layer of diamond.
Claim 18
Dependent Claim
28 words
The electrostatic chuck of claim 14 wherein said means for developing an electrostatic force includes means for applying a dc voltage potential between said at least two conductors.
Claim 19
Dependent Claim
24 words
The electrostatic chuck of claim 12 wherein each of said first and second layers of diamond are between 0.1 and 5.0 microns in thickness.
Claim 20
Dependent Claim
24 words
The electrostatic chuck of claim 16 wherein each of said first and second layers of diamond are between 1.0 and 2.0 microns in thickness.
Claim 21
Dependent Claim
20 words
The electrostatic chuck of claim 12 wherein said body and each of said at least two electrical conductors comprise molybdenum.
Claim 22
Dependent Claim
18 words
The electrostatic chuck of claim 12 and further including means for applying an rf signal to said body.
Claim 23
Independent Claim
67 words
A method of forming an electrostatic chuck for supporting a wafer, comprising the steps of: providing a conductive body; forming a layer of diamond over at least a portion of said conductive body; and developing an electrostatic force to hold said wafer against said layer of diamond, including the step of providing two electrical conductors supported on said body between said body and said layer of diamond.
Claim 24
Independent Claim
67 words
A method of forming an electrostatic chuck for supporting a wafer, comprising the steps of: providing a conductive body; forming a layer of diamond over at least a portion of said conductive body; and developing an electrostatic force to hold said wafer against said layer of diamond, including the step of providing two electrical conductors supported on said body between said body and said layer of diamond.
Claim 25
Dependent Claim
13 words
The method of claim 19 wherein said conductive body comprises a refractory metal.
Claim 26
Dependent Claim
23 words
The method of claim 20 wherein said step of developing an electrostatic force includes applying an electrical potential between said two electrical conductors.
Claim 27
Independent Claim
56 words
A method of manufacturing an electrostatic chuck for supporting a wafer, comprising: providing a body of conductive material; forming a first layer of diamond coating at least a portion of said body; forming two generally planar electrical conductors on said first layer of diamond; and forming a second layer of diamond over said two electrical conductors.
Claim 28
Independent Claim
56 words
A method of manufacturing an electrostatic chuck for supporting a wafer, comprising: providing a body of conductive material; forming a first layer of diamond coating at least a portion of said body; forming two generally planar electrical conductors on said first layer of diamond; and forming a second layer of diamond over said two electrical conductors.
Claim 29
Dependent Claim
15 words
The method of claim 23 wherein said body of conductive material comprises a refractory metal.
Claim 30
Dependent Claim
16 words
The method of claim 23 wherein each of said two electrical conductors comprises a refractory metal.
Claim 31
Dependent Claim
22 words
The method of claim 23 wherein said first and second diamond layers each have a thickness in the range of 0.1-5.0 microns.
Claim 32
Dependent Claim
22 words
The method of claim 26 wherein said first and second diamond layers each have a thickness in the range of 1.0-2.0 microns.
Claim 33
Dependent Claim
25 words
The method of claim 23 and further including the step of developing an electrostatic force for holding said wafer against said second layer of diamond.
Claim 34
Dependent Claim
24 words
The method of a claim 28 wherein said step of developing an electrostatic force includes applying an electric potential between said two electrical conductors.
Claim 35
Independent Claim
72 words
A method of fabricating an electrostatic chuck for supporting a wafer comprising the steps of: providing a body of refractory metal including at least one planar surface sized to support said wafer; forming a first layer of diamond over at least said planar surface; forming at least two generally planar electrical conductors on said first layer of diamond; and forming a second layer of diamond over said at least two electrical conductors.
Claim 36
Independent Claim
72 words
A method of fabricating an electrostatic chuck for supporting a wafer comprising the steps of: providing a body of refractory metal including at least one planar surface sized to support said wafer; forming a first layer of diamond over at least said planar surface; forming at least two generally planar electrical conductors on said first layer of diamond; and forming a second layer of diamond over said at least two electrical conductors.
Claim 37
Dependent Claim
35 words
The method of claim 30 wherein said second layer of diamond is situated conformally to cover said two electrical conductors and any regions of said first layer of diamond exposed between said two electrical conductors.
Claim 38
Dependent Claim
25 words
The method of claim 31 and further including the step of developing an electrostatic force to support said wafer against said second layer of diamond.
Claim 39
Dependent Claim
29 words
The method of claim 32 wherein said step of developing an electrostatic potential includes the step of applying a dc voltage potential between said first and second electrical conductors.
Claim 40
Dependent Claim
23 words
The method of claim 30 wherein each of said first and second layers of diamond are between 0.1 and 5.0 microns in thickness.
Claim 41
Dependent Claim
23 words
The method of claim 34 wherein each of said first and second layers of diamond are between 1 and 2 microns in thickness.
Claim 42
Dependent Claim
17 words
The method of claim 30 wherein said body and said layer of refractory metal each comprise molybdenum.
Claim 43
Dependent Claim
20 words
The method of claim 30 and further including the step of selectively applying an rf signal to said conductive body.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-11-24 | 1996-05-25 | 1996-11-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-11-24 | 2000-05-25 | 2000-11-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-11-24 | 2004-05-25 | 2004-11-24 | $7700.00 | Window Closed / Lapsed |