Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
152 words
A breakdown evaluating test element comprising: a silicon wafer; a thin oxide film formed on said wafer; a thick oxide film formed on said wafer, said thick oxide film being located on a peripheral portion of said thin film; and a polysilicon film formed on both said thin and thick oxide films; and wherein, a first area of said polysilicon film covers an area of said thick oxide film which is substantially greater than a second area of said polysilicon film covering said thin oxide film, such that, when an electric field is applied to the wafer during a manufacturing process, the thin oxide film has a predetermined probability of breaking down from the strength of an electric field resulting from electric charge accumulated in a capacitor formed by said silicon wafer as a first electrode, said polysilicon film as a second electrode said thin and thick oxide films as a dielectric.
Claim 2
Dependent Claim
152 words
A breakdown evaluating test element comprising: a silicon wafer; a thin oxide film formed on said wafer; a thick oxide film formed on said wafer, said thick oxide film being located on a peripheral portion of said thin film; and a polysilicon film formed on both said thin and thick oxide films; and wherein, a first area of said polysilicon film covers an area of said thick oxide film which is substantially greater than a second area of said polysilicon film covering said thin oxide film, such that, when an electric field is applied to the wafer during a manufacturing process, the thin oxide film has a predetermined probability of breaking down from the strength of an electric field resulting from electric charge accumulated in a capacitor formed by said silicon wafer as a first electrode, said polysilicon film as a second electrode said thin and thick oxide films as a dielectric.
Claim 3
Dependent Claim
23 words
The breakdown evaluating test element as claimed in claim 1, wherein a plurality of the capacitors are formed scattered on the silicon wafer.
Claim 4
Dependent Claim
37 words
The breakdown evaluating test element as claimed in claim 1, wherein the area of the thick portion of the oxide film is at least 1000 times greater than that of the thin portion of the oxide film.
Claim 5
Dependent Claim
36 words
The breakdown evaluating test element as claimed in claim 1, wherein the polysilicon film is formed on the oxide film in such a way as to expose part of the thin portion of the oxide film.
Claim 6
Dependent Claim
20 words
The breakdown evaluating test element as claimed in claim 1, wherein another oxide film is formed on the polysilicon film.
Claim 7
Dependent Claim
22 words
The breakdown evaluating test element as claimed in claim 1, wherein said polysilicon film is completely covered with a photo resist film.
Claim 8
Dependent Claim
31 words
The breakdown evaluating test element as claimed in claim 1, wherein said polysilicon film is partially covered with a photo resist film and a part of said polysilicon film is exposed.