Semiconductor device having a multilayer leadframe with full power and ground planes

Claim 2

A semiconductor device comprising: a multilayer metallic leadframe comprising: a first full voltage plane; a second full voltage plane positioned above the first voltage plane, the first and second voltage planes being electrically insulated from one another, the second voltage plane having a die receiving area; an opening extending completely through the second voltage plane and exposing a portion of the first voltage plane, the opening being located outside the die receiving area; and a plurality of leads; a semiconductor die having a plurality of bond pads formed on a surface thereof, the plurality of bond pads being electrically coupled to the plurality of leads, and the die being attached to the second voltage plane within the die receiving area; and a conductive wire electrically coupling one of the plurality of bond pads to the exposed portion of the first voltage plane, the conductive wire passing through the opening in the second voltage plane.

Claim 3

The semiconductor device of claim 1 further comprising: means to electrically couple a first lead of the plurality of leads to the first voltage plane; and means to electrically couple a second lead of the plurality of leads to the second voltage plane.

Claim 4

The semiconductor device of claim 2 wherein the first and second voltages planes are respectively ground and power planes of the device.

Claim 5

The semiconductor device of claim 2 wherein the first and second voltages planes are respectively power and ground planes of the device.

Claim 6

The semiconductor device of claim 1 wherein the metallic leadframe is comprised of a material selected from the group consisting of copper, a copper alloy, and a nickel-iron alloy.

Claim 7

The semiconductor device of claim 1 wherein the first and second voltage planes are electrically insulated from one another by an adhesive tape.

Claim 8

The semiconductor device of claim 6 wherein the adhesive tape is a thermally conductive adhesive tape.

Claim 9

A semiconductor device comprising: a multilayer leadframe comprising: a continuous first layer of conductive material; a second layer of conductive material positioned above the first layer of conductive material, the second layer having first and second opposing surfaces, a die receiving area within one of the first and second opposing surfaces, and at least one opening extending from the first surface to the second surface and being located outside the die receiving area, the second layer of conductive material being substantially continuous apart from the at least one opening and being electrically insulated from the first layer of conductive material; and a third layer of conductive material forming a plurality of leads, the third layer being adhesively coupled to at least one of the first and second layers of conductive material; a semiconductor die positioned on the second layer of conductive material within the die receiving area such that the at least one opening is uncovered, the semiconductor die having a plurality of bond pads formed on a surface thereof; and means for electrically coupling one of the plurality of bond pads to the first layer of conductive material, the means passing through the at least one opening in the second layer of conductive material.

Claim 10

A semiconductor device comprising: a multilayer leadframe comprising: a continuous first layer of conductive material; a second layer of conductive material positioned above the first layer of conductive material, the second layer having first and second opposing surfaces, a die receiving area within one of the first and second opposing surfaces, and at least one opening extending from the first surface to the second surface and being located outside the die receiving area, the second layer of conductive material being substantially continuous apart from the at least one opening and being electrically insulated from the first layer of conductive material; and a third layer of conductive material forming a plurality of leads, the third layer being adhesively coupled to at least one of the first and second layers of conductive material; a semiconductor die positioned on the second layer of conductive material within the die receiving area such that the at least one opening is uncovered, the semiconductor die having a plurality of bond pads formed on a surface thereof; and means for electrically coupling one of the plurality of bond pads to the first layer of conductive material, the means passing through the at least one opening in the second layer of conductive material.

Claim 11

The semiconductor device of claim 8 wherein the means for electrically coupling comprises a conductive wire.

Claim 12

The semiconductor device of claim 9 wherein the first and second layers of conductive material are respectively a ground plane and a power plane for the device.

Claim 13

The semiconductor device of claim 9 wherein the first and second layers of conductive material are respectively a power plane and a ground plane for the device.

Claim 14

The semiconductor device of claim 8 further comprising: means to electrically couple a first head of the plurality of leads to the first layer of conductive material; and means to electrically couple a second lead of the plurality of leads to the second layer of conductive material.

Claim 15

The semiconductor device of claim 8 further comprising a plastic encapsulating material which surrounds the semiconductor die, the first and second layers of conductive material, and portions of the plurality of leads.

Claim 16

The semiconductor device of claim 1 wherein first voltage plane is physically and electrically coupled to at least a first lead of the plurality of leads and the second voltage plane is physically and electrically coupled to at least a second lead of the plurality of leads.

Claim 17

The semiconductor device of claim 1 wherein the first voltage plane is coupled to at least the first lead and the second voltage plane is coupled to at least the second lead by welds.