US5233221A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electronic substrate multiple location conductor attachment technology
Assignee: International Business Machines Corp
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Filing: 1991-07-26
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Granted: 1993-08-03
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Expires: 2011-07-26
Abstract
Abstract A conductor attachment wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.
Inventors
- 👤 Mark F. Bregman
- 👤 Raymond R. Horton
- 👤 Alphonso P. Lanzetta
- 👤 Ismail C. Noyan
- 👤 Michael J. Palmer
- 👤 Ho-Ming Tong
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 02:31
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/04; H10W70/048; H10W70/40; H10W70/479; H10W72/00; H10W72/701; H10W90/00; H10W90/701; H05; H05K; H05K3/00; H05K3/40; H05K3/4038; H05K3/4084
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
41 words
A structure comprising: a dielectric layer having an edge extending through said layer with separated protrusions, and a plurality of conducting leads on one face of said dielectric layer, each of said leads extending over each single separation and each protrusion.
Claim 2
Dependent Claim
41 words
A structure comprising: a dielectric layer having an edge extending through said layer with separated protrusions, and a plurality of conducting leads on one face of said dielectric layer, each of said leads extending over each single separation and each protrusion.
Claim 3
Dependent Claim
51 words
The structure of claim 1 wherein each of said conducting leads on said dielectric layer that is extending over each said single separation and each said protrusion of said edge of said dielectric layer is bent to a position even with and parallel to the opposite face of said dielectric layer.
Claim 4
Dependent Claim
63 words
A structure comprising: a dielectric layer having first and second opposite faces and an edge said edge extending through said layer from said first to said second face said edge further having separated protrusions, and, a plurality of conducting leads on said first face of said dielectric layer each of said leads extending cantilevered beyond said edge at each separation and each protrusion.
Claim 5
Dependent Claim
63 words
A structure comprising: a dielectric layer having first and second opposite faces and an edge said edge extending through said layer from said first to said second face said edge further having separated protrusions, and, a plurality of conducting leads on said first face of said dielectric layer each of said leads extending cantilevered beyond said edge at each separation and each protrusion.
Claim 6
Dependent Claim
43 words
The structure of claim 3 wherein each of said conducting leads on said first face of said dielectric layer that is extending cantilevered beyond said edge is bent to a position even with and parallel to said second face of said dielectric layer.
Claim 7
Dependent Claim
23 words
The structure of claim 2 wherein each said lead is bent over said dielectric layer to a uniform distance from said dielectric layer.
Claim 8
Dependent Claim
32 words
The structure of claim 5 wherein said dielectric layer is 2.0 mils thick polyimide, said conducting leads are 1.4 mils thick Cu plated with Au, and said uniform distance is 4.0 mils.
Claim 9
Dependent Claim
40 words
The structure of claim 1 wherein each said lead has a ball contact at said end thereof, said ball contact being a uniform distance from said edge and extending to the plane of the opposite face of said dielectric layer.
Claim 10
Dependent Claim
31 words
The structure of claim 7 wherein said dielectric layer is 2.0 mils thick polyimide, said conducting leads 1.4 mils thick Cu plated with Au, and said uniform distance is 4.0 mils.
Claim 11
Dependent Claim
72 words
A structure comprising: a dielectric layer area having a pattern of conducting leads thereon, said dielectric layer shape and said conducting lead pattern being so interrelated that each conducting lead in said pattern is supported by an edge portion of said dielectric to within an equal cantilever length of the end of said conducting lead and, adjacent conducting leads in said pattern terminate at different distances from the periphery of said area.
Claim 12
Dependent Claim
72 words
A structure comprising: a dielectric layer area having a pattern of conducting leads thereon, said dielectric layer shape and said conducting lead pattern being so interrelated that each conducting lead in said pattern is supported by an edge portion of said dielectric to within an equal cantilever length of the end of said conducting lead and, adjacent conducting leads in said pattern terminate at different distances from the periphery of said area.
Claim 13
Dependent Claim
22 words
The structure of claim 9 wherein all cantilevered conducting leads extend into a common chip surface accommodating opening in said dielectric layer.
Claim 14
Dependent Claim
20 words
The structure of claim 9 wherein each cantilevered conducting lead extends into an individual contact opening in said dielectric layer.
Claim 15
Dependent Claim
97 words
A structure comprising: a conducting lead supporting dielectric layer having an area contiguous with the surface of a chip, said dielectric layer having at least one aperture therethrough exposing at least one chip contact bonding location, said dielectric layer having a pattern of conducting leads thereon, each said conductor in said pattern extending cantilevered into said at least one aperture a uniform distance beyond a supporting edge portion of said dielectric at each said at least one aperture, and, each adjacent conductor in said pattern terminating a different distance from the boundary of said dielectric layer area.
Claim 16
Dependent Claim
97 words
A structure comprising: a conducting lead supporting dielectric layer having an area contiguous with the surface of a chip, said dielectric layer having at least one aperture therethrough exposing at least one chip contact bonding location, said dielectric layer having a pattern of conducting leads thereon, each said conductor in said pattern extending cantilevered into said at least one aperture a uniform distance beyond a supporting edge portion of said dielectric at each said at least one aperture, and, each adjacent conductor in said pattern terminating a different distance from the boundary of said dielectric layer area.
Claim 17
Dependent Claim
56 words
A structure comprising: a dielectric layer having first and second opposite faces and an edge; said edge extending through said layer from said first to said second face; said edge further having separated protrusions, and, at least one conducting lead on said first face of said dielectric layer extending onto at least one of said protrusions.
Claim 18
Dependent Claim
56 words
A structure comprising: a dielectric layer having first and second opposite faces and an edge; said edge extending through said layer from said first to said second face; said edge further having separated protrusions, and, at least one conducting lead on said first face of said dielectric layer extending onto at least one of said protrusions.
Claim 19
Dependent Claim
46 words
The structure of claim 13 wherein each said conducting lead on said first face of said dielectric layer extending onto a protrusion extends further cantilevered beyond said edge and is bent to a position even with and parallel to said second face of said dielectric layer.
Claim 20
Dependent Claim
39 words
The structure of claim 14 wherein said dielectric layer is 2.0 mils thick polyimide, said conducting leads are 1.4 mils thick Cu plated with Au, and said cantilevered portion of said conducting lead extends a distance of 4.0 mils.
Claim 21
Dependent Claim
52 words
The structure of claim 13 wherein each said conducting lead on said first face of said dielectric layer extending onto a protrusion extends further cantilevered beyond said edge and has a ball contact on the end thereof said ball contact extending to the plane of the second face of said dielectric layer.
Claim 22
Dependent Claim
38 words
The structure of claim 16 wherein said dielectric layer is 2.0 mils thick polyimide, said conducting leads are 1.4 mils thick Cu plated with Au, and said ball contact is a distance of 4.0 mils from said edge.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-08-02 | 1997-02-01 | 1997-08-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-08-02 | 2001-02-01 | 2001-08-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-08-02 | 2005-02-01 | 2005-08-03 | $7700.00 | Window Closed / Lapsed |