US5249142A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Indirect temperature-measurement of films formed on semiconductor wafers
Assignee: Tokyo Electron Ltd
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Filing: 1992-04-03
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Granted: 1993-09-28
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Expires: 2012-04-03
Abstract
Abstract A method of measuring the temperature of a matter accurately, in non-contact fashion and without setting any emissivity comprising obtaining a spectral characteristics of absorbing electromagnetic waves inherent to a matter whose temperature is to be measured, obtaining those absorption peak wavelengths of the electromagnetic waves which correspond to two or more high points of electromagnetic wave absorption rate obtained from the spectral characteristics, measuring amounts of the electromagnetic waves, which have the absorption peak wavelengths, radiated from the temperature-measured matter, and calculating the temperature of the matter from blues of the radiant amounts of the electromagnetic waves thus measured.
Inventors
- 👤 Eiichi Shirakawa
- 👤 Masafumi Nomura
- 👤 Kimiharu Matsumura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 11:24
CPC Classifications
G; G01; G01J; G01J5/00; G01J5/60
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
263 words
A method of determining a temperature of a film formed on a semiconductor wafer mounted on a heating plate, said method comprising the steps of: filtering electromagnetic waves radiated from said film by means of a first filter substantially allowing only a first electromagnetic wave of said electromagnetic waves to pass through, said first electromagnetic wave having a specific wavelength selected to correspond to an electromagnetic wave absorption rate peak point appearing in first spectral characteristics of absorbing electromagnetic waves inherent to said film, and selected to be prevented from corresponding to an electromagnetic wave absorption rate peak point appearing in second spectral characteristics of absorbing electromagnetic waves inherent to said wafer, in order to decrease a background heat effect; filtering electromagnetic waves radiated from said film by means of a second filter substantially allowing only a second electromagnetic wave of said electromagnetic waves to pass through, said second electromagnetic wave having a specific wavelength selected to correspond to another electromagnetic wave absorption rate peak point appearing in said first spectral characteristics, and selected to be prevented from corresponding to an electromagnetic wave absorption rate peak point appearing in said second spectral characteristics, in order to decrease a background heat-effect; respectively detecting the first electromagnetic wave having passed through said first filter, and the second electromagnetic wave having passed through said second filter; respectively measuring the first radiant amount of the detected first electromagnetic wave, and the second radiant amount of the detected second electromagnetic wave; and calculating the temperature of said film from the values of said first and second radiant amounts.
Claim 2
Independent Claim
263 words
A method of determining a temperature of a film formed on a semiconductor wafer mounted on a heating plate, said method comprising the steps of: filtering electromagnetic waves radiated from said film by means of a first filter substantially allowing only a first electromagnetic wave of said electromagnetic waves to pass through, said first electromagnetic wave having a specific wavelength selected to correspond to an electromagnetic wave absorption rate peak point appearing in first spectral characteristics of absorbing electromagnetic waves inherent to said film, and selected to be prevented from corresponding to an electromagnetic wave absorption rate peak point appearing in second spectral characteristics of absorbing electromagnetic waves inherent to said wafer, in order to decrease a background heat effect; filtering electromagnetic waves radiated from said film by means of a second filter substantially allowing only a second electromagnetic wave of said electromagnetic waves to pass through, said second electromagnetic wave having a specific wavelength selected to correspond to another electromagnetic wave absorption rate peak point appearing in said first spectral characteristics, and selected to be prevented from corresponding to an electromagnetic wave absorption rate peak point appearing in said second spectral characteristics, in order to decrease a background heat-effect; respectively detecting the first electromagnetic wave having passed through said first filter, and the second electromagnetic wave having passed through said second filter; respectively measuring the first radiant amount of the detected first electromagnetic wave, and the second radiant amount of the detected second electromagnetic wave; and calculating the temperature of said film from the values of said first and second radiant amounts.
Claim 3
Dependent Claim
55 words
The method according to claim 1, wherein said method further comprises the steps of: producing first and second electrical signals representing said first and second radiant amounts respectively; inputting said first and second electrical signals into a computer so as to calculate the temperature of the object based on said first and second electrical signals.
Claim 4
Dependent Claim
24 words
The method according to claim 2, wherein Planck's law of radiation and the Newton-Raphson method are utilized in said step of calculating the temperature.
Claim 5
Dependent Claim
13 words
The method according to claim 2, wherein said electromagnetic waves are infrared rays.
Claim 6
Dependent Claim
37 words
The method according to claim 4, wherein said wafer is made of silicon, and said first and second electromagnetic waves are selected to be prevented from having a wavelength of about 9 μm or about 16 μm.
Claim 7
Dependent Claim
31 words
The method according to claim 5, wherein said film is a photoresist film, and said first and second electromagnetic waves have wavelengths of about 3 μm and about 7 μm, respectively.
Claim 8
Independent Claim
202 words
A method of determining a temperature of a film formed on a semiconductor wafer mounted on a heating plate, said method comprising the steps of: selecting first and second wavelengths corresponding to different electromagnetic wave absorption rate peak points which appear in the spectral characteristics of absorbing electromagnetic waves inherent to said film, said first and second wavelengths being selected to be prevented from corresponding to an electromagnetic wave absorption rate peak point appearing in spectral characteristics of absorbing electromagnetic waves inherent to said wafer; filtering electromagnetic waves radiated from said film by means of a first filter substantially allowing only a first electromagnetic wave having the first wavelength to pass through; filtering electromagnetic waves radiated from said film by means of a second filter substantially allowing only a second electromagnetic wave having the second wavelength to pass through; respectively detecting the first electromagnetic wave having passed through the first filter, and the second electromagnetic wave having passed through the second filter; respectively measuring the first radiant amount of the detected first electromagnetic wave and the second radiant amount of the detected second electromagnetic wave; and calculating the temperature of the film from the values of the first and second radiant amounts.
Claim 9
Independent Claim
202 words
A method of determining a temperature of a film formed on a semiconductor wafer mounted on a heating plate, said method comprising the steps of: selecting first and second wavelengths corresponding to different electromagnetic wave absorption rate peak points which appear in the spectral characteristics of absorbing electromagnetic waves inherent to said film, said first and second wavelengths being selected to be prevented from corresponding to an electromagnetic wave absorption rate peak point appearing in spectral characteristics of absorbing electromagnetic waves inherent to said wafer; filtering electromagnetic waves radiated from said film by means of a first filter substantially allowing only a first electromagnetic wave having the first wavelength to pass through; filtering electromagnetic waves radiated from said film by means of a second filter substantially allowing only a second electromagnetic wave having the second wavelength to pass through; respectively detecting the first electromagnetic wave having passed through the first filter, and the second electromagnetic wave having passed through the second filter; respectively measuring the first radiant amount of the detected first electromagnetic wave and the second radiant amount of the detected second electromagnetic wave; and calculating the temperature of the film from the values of the first and second radiant amounts.
Claim 10
Dependent Claim
33 words
The method according to claim 7, wherein said wafer is made of silicon, and said first and second wavelengths are selected to be prevented from being about 9 μm or about 16 μm.
Claim 11
Dependent Claim
28 words
The method according to claim 8, wherein said film is a photoresist film, and said first and second wavelengths are about 3 μm and about 7 μm, respectively.
Claim 12
Independent Claim
188 words
A method of determining a temperature of a film formed on a silicon wafer mounted on a heating plate, said method comprising the steps of: selecting first and second wavelengths corresponding to different electromagnetic wave absorption rate peak points which appear in spectral characteristics of absorbing electromagnetic waves inherent to said film, said first and second wavelengths being selected to be prevented from being about 9 μm or about 16 μm; filtering electromagnetic waves radiated from the film by means of a first filter substantially allowing only a first electromagnetic wave having the first wavelength to pass through; filtering electromagnetic waves radiated from the film by means of a second filter substantially allowing only a second electromagnetic wave having the second wavelength to pass through; respectively detecting the first electromagnetic wave having passed through the first filter, and the second electromagnetic wave having passed through the second filter; respectively measuring the first radiant amount of the detected first electromagnetic wave, and the second radiant amount of the detected second electromagnetic wave; and calculating the temperature of the film from the values of the first and second radiant amounts.
Claim 13
Independent Claim
188 words
A method of determining a temperature of a film formed on a silicon wafer mounted on a heating plate, said method comprising the steps of: selecting first and second wavelengths corresponding to different electromagnetic wave absorption rate peak points which appear in spectral characteristics of absorbing electromagnetic waves inherent to said film, said first and second wavelengths being selected to be prevented from being about 9 μm or about 16 μm; filtering electromagnetic waves radiated from the film by means of a first filter substantially allowing only a first electromagnetic wave having the first wavelength to pass through; filtering electromagnetic waves radiated from the film by means of a second filter substantially allowing only a second electromagnetic wave having the second wavelength to pass through; respectively detecting the first electromagnetic wave having passed through the first filter, and the second electromagnetic wave having passed through the second filter; respectively measuring the first radiant amount of the detected first electromagnetic wave, and the second radiant amount of the detected second electromagnetic wave; and calculating the temperature of the film from the values of the first and second radiant amounts.
Claim 14
Dependent Claim
23 words
The method according to claim 10, wherein said first and second wavelengths are selected within a range of from 2.5 to 20 μm.
Claim 15
Dependent Claim
28 words
The method according to claim 11, wherein said film is a photoresist film, and said first and second wavelengths are about 3 μm and about 7 [2m, respectively.
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