US5257162A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Bellows lid for c4 flip-chip package
Assignee: Intel Corp
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Filing: 1992-11-20
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Granted: 1993-10-26
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Expires: 2012-11-20
Abstract
Abstract An electronic package that has a lid that is in direct contact with an integrated circuit that is mounted to a substrate. The lid includes a plate portion that is in contact with the integrated circuit, an outer frame portion that is attached to the substrate, and a bellows portion that couples the plate portion to the outer frame portion.
Inventors
- 👤 Douglas Crafts
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 15:58
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W76/00; H10W76/10; H10W76/12
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
91 words
An electronic package, comprising: a substrate; an electrical device coupled to said substrate; and, a lid that has a plate portion contiguous with said electrical device, an outer frame portion attached to said substrate and a bellows portion coupled to said outer frame portion and said plate portion, said lid being attached to said substrate so that said plate portion applies a pressure to said electrical device, said bellows portion extending between said plate portion and said outer frame portion in both an axial and longitudinal direction relative to said substrate.
Claim 2
Dependent Claim
91 words
An electronic package, comprising: a substrate; an electrical device coupled to said substrate; and, a lid that has a plate portion contiguous with said electrical device, an outer frame portion attached to said substrate and a bellows portion coupled to said outer frame portion and said plate portion, said lid being attached to said substrate so that said plate portion applies a pressure to said electrical device, said bellows portion extending between said plate portion and said outer frame portion in both an axial and longitudinal direction relative to said substrate.
Claim 3
Dependent Claim
19 words
The package as recited in claim 1, wherein said outer frame portion is attached to said substrate by solder.
Claim 4
Dependent Claim
20 words
The package as recited in claim 1, wherein said lid includes a plurality of fins extending form said plate portion.
Claim 5
Dependent Claim
14 words
The package as recited in claim 1, wherein said lid is constructed from aluminum.
Claim 6
Dependent Claim
19 words
The package as recited in claim 1, wherein said outer frame portion is attached to said substrate by epoxy.
Claim 7
Dependent Claim
19 words
The package as recited in claim 1, wherein said outer frame portion is attached to said substrate by gold.
Claim 8
Independent Claim
95 words
A method for assembling an electronic package, comprising the steps of; a) providing an electrical device that is mounted to a substrate; b) placing a lid adjacent to said electrical device so that a plate portion of said lid is contiguous with said electrical device and an outer frame portion of said lid is adjacent to said substrate, said plate portion being separated from said outer frame portion by a bellows portion which extends in both an axial and longitudinal direction relative to said substrate; and, c) coupling said outer frame portion to said substrate.
Claim 9
Independent Claim
95 words
A method for assembling an electronic package, comprising the steps of; a) providing an electrical device that is mounted to a substrate; b) placing a lid adjacent to said electrical device so that a plate portion of said lid is contiguous with said electrical device and an outer frame portion of said lid is adjacent to said substrate, said plate portion being separated from said outer frame portion by a bellows portion which extends in both an axial and longitudinal direction relative to said substrate; and, c) coupling said outer frame portion to said substrate.
Claim 10
Dependent Claim
22 words
The method as recited in claim 7, wherein said lid is attached to said substrate by heating said lid and said substrate.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-10-25 | 1997-04-26 | 1997-10-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-10-25 | 2001-04-26 | 2001-10-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-10-25 | 2005-04-26 | 2005-10-26 | $7700.00 | Window Closed / Lapsed |