US5264377A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit electromigration monitor
Assignee: Nokia Bell Labs
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Filing: 1992-04-03
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Granted: 1993-11-23
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Expires: 2012-04-03
Abstract
Abstract The electromigration characteristics of integrated circuit conductors are determined by passing a high current for a short period of time through an inventive test structure. This provides a rapid test in a more accurate manner than with the prior art SWEAT (Standard Wafer-level Electromigration Accelerated Test) structure. The test results have been found to be well correlated with long-term low current electromigration tests. A sensitive differential test may be implemented that determines the effects of topography features. The inventive test technique can be performed on every wafer lot, or even every wafer, so that adjustments to the wafer fabrication process can be rapidly implemented.
Inventors
- 👤 Daniel P. Chesire
- 👤 Anthony S. Oates
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 16:45
CPC Classifications
G; G01; G01R; G01R31/00; G01R31/28; G01R31/2851; G01R31/2855; G01R31/2856; G01R31/2858; G01R31/26; G01R31/2642; H; H10; H10P; H10P74/00; H10P74/27; H10P74/277
Claims Analysis
Total Claims: 31
Claim 1
Independent Claim
115 words
A method of making an integrated circuit including the step of determining the electromigration characteristics of an integrated circuit conductor by steps comprising flowing an electrical current through a test structure, and determining the time for a failure to occur, characterized in that the current density of said electrical current is at least 5×10 6 amps/cm 2 , and said test structure comprises an elongated test conductor at least 50 micrometers long, wherein said elongated test conductor is contacted at its ends by wider metal conductors having a width at least 5 times the width of said elongated test conductor, and with said wider metal conductors tapering down to the width of said test conductor.
Claim 2
Independent Claim
115 words
A method of making an integrated circuit including the step of determining the electromigration characteristics of an integrated circuit conductor by steps comprising flowing an electrical current through a test structure, and determining the time for a failure to occur, characterized in that the current density of said electrical current is at least 5×10 6 amps/cm 2 , and said test structure comprises an elongated test conductor at least 50 micrometers long, wherein said elongated test conductor is contacted at its ends by wider metal conductors having a width at least 5 times the width of said elongated test conductor, and with said wider metal conductors tapering down to the width of said test conductor.
Claim 3
Dependent Claim
24 words
The method of claim 1 wherein the width of the wider metal conductors is about 10 times the width of said elongated test conductor.
Claim 4
Dependent Claim
21 words
The method of claim 1 wherein the current density of said electrical current is at least 1×10 7 amps/cm 2 .
Claim 5
Dependent Claim
14 words
The method of claim 1 wherein said test conductor is about 800 micrometers long.
Claim 6
Dependent Claim
41 words
The method of claim 1 wherein said test structure further comprises voltage tap conductors that connect to each of said wider metal conductors at the point at which said wider metal conductors taper down to the width of said test conductor.
Claim 7
Dependent Claim
27 words
The method of claim 1 wherein said test structure further comprises elongated side conductors located on both sides of said test conductor and contacted by a bondpad.
Claim 8
Dependent Claim
41 words
The method of claim 1 wherein said test structure further comprises elongated topographic features located under, and oriented generally transverse to, said test conductor, wherein said elongated topographic features are formed of conductive material that is insulated from said test conductor.
Claim 9
Dependent Claim
39 words
The method of claim 1 further comprising the step of adjusting a parameter of a process step used in making said integrated circuit in response to information derived from said determining the electromigration characteristics of an integrated circuit conductor.
Claim 10
Dependent Claim
14 words
The method of claim 7 wherein said process step is a dielectric deposition process.
Claim 11
Dependent Claim
14 words
The method of claim 8 wherein said parameter is the thickness of said dielectric.
Claim 12
Dependent Claim
15 words
The method of claim 7 wherein said process step is a conductor forming process step.
Claim 13
Dependent Claim
16 words
The method of claim 10 wherein said conductor forming process step is a conductor deposition step.
Claim 14
Dependent Claim
16 words
The method of claim 10 wherein said conductor forming process step is a conductor etching step.
Claim 15
Dependent Claim
14 words
The method of claim 10 wherein said parameter is the thickness of said conductor.
Claim 16
Dependent Claim
14 words
The method of claim 10 wherein said parameter is the width of said conductor.
Claim 17
Dependent Claim
14 words
The method of claim 10 wherein said parameter is the composition of said conductor.
Claim 18
Independent Claim
137 words
A method of making an integrated circuit including the step of determining the electromigration characteristics of an integrated circuit conductor, characterized by steps comprising flowing electrical current through first and second test structures, and comparing the effect of the current flow on the structures, wherein said first test structure comprises elongated topographic features located under, and oriented generally transverse to, said test conductor, and said second test structure is located on a generally planar surface, and further characterized in that each of said test structures comprise elongated test conductors at least 50 micrometers long, wherein said elongated test conductors are contacted at their ends by wider metal conductors having a width at least 5 times the width of said elongated test conductors, and with said wider metal conductors tapering down to the width of said test conductors.
Claim 19
Independent Claim
137 words
A method of making an integrated circuit including the step of determining the electromigration characteristics of an integrated circuit conductor, characterized by steps comprising flowing electrical current through first and second test structures, and comparing the effect of the current flow on the structures, wherein said first test structure comprises elongated topographic features located under, and oriented generally transverse to, said test conductor, and said second test structure is located on a generally planar surface, and further characterized in that each of said test structures comprise elongated test conductors at least 50 micrometers long, wherein said elongated test conductors are contacted at their ends by wider metal conductors having a width at least 5 times the width of said elongated test conductors, and with said wider metal conductors tapering down to the width of said test conductors.
Claim 20
Dependent Claim
21 words
The method of claim 17 wherein the current density of said electrical current is at least 5×10 6 amps/cm 2 .
Claim 21
Dependent Claim
22 words
The method of claim 18 wherein said elongated topographic features are formed of conductive material that is insulated from said test conductor.
Claim 22
Dependent Claim
38 words
The method of claim 18 wherein said comparing includes comparing the resistance of the test conductor of said first test structure to the resistance of the test conductor of said second test structure during said flowing electrical current.
Claim 23
Dependent Claim
37 words
The method of claim 18 wherein said comparing includes comparing the time of failure of the test conductor of said first test structure to the time of failure of the test conductor of said second test structure.
Claim 24
Independent Claim
80 words
A method of making an integrated circuit including the step of determining the electromigration characteristics of an integrated circuit conductor, characterized by steps comprising flowing electrical current through an elongated test conductor at least 50 micrometers long, wherein said elongated test conductor is contacted at both ends by wider metal conductors having a width at least 5 times the width of said elongated test conductor, and with said wider metal conductors tapering down to the width of said test conductor.
Claim 25
Independent Claim
80 words
A method of making an integrated circuit including the step of determining the electromigration characteristics of an integrated circuit conductor, characterized by steps comprising flowing electrical current through an elongated test conductor at least 50 micrometers long, wherein said elongated test conductor is contacted at both ends by wider metal conductors having a width at least 5 times the width of said elongated test conductor, and with said wider metal conductors tapering down to the width of said test conductor.
Claim 26
Dependent Claim
15 words
The method of claim 22 wherein said elongated test conductor is about 800 micrometers long.
Claim 27
Dependent Claim
19 words
The method of claim 23 wherein elongated topographic features are located under, and generally transverse to, said test conductor.
Claim 28
Dependent Claim
22 words
The method of claim 24 wherein said elongated topographic features are formed of conductive material that is insulated from said test conductor.
Claim 29
Dependent Claim
24 words
The method of claim 22 wherein the width of said wider metal conductors is approximately 10 times the width of said elongated test conductor.
Claim 30
Dependent Claim
44 words
The method of claim 22 further comprising the step of measuring the voltage between voltage tap conductors that connect to each of said wider metal conductors at the point at which said wider metal conductors taper down to the width of said test conductor.
Claim 31
Dependent Claim
18 words
The method of claim 22 wherein said elongated test conductor has a width of less than 10 micrometers.
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USRE32625E
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-11-22 | 1997-05-24 | 1997-11-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-11-22 | 2001-05-24 | 2001-11-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-11-22 | 2005-05-24 | 2005-11-23 | $7700.00 | Window Closed / Lapsed |