Computer system module assembly

Claim 1

Assembly of a semiconductor device to a printed circuit board, comprising: an unpackaged semiconductor device generating heat when operating; a printed circuit board having two faces; a first conductive layer disposed on one face of the PCB having conductive paths for making multiple connections to the semiconductor device; a second conductive layer disposed on the opposite face of the PCB; a heat sink for dissipating heat generated by the semiconductor device when operating; wherein the heat sink comprises: a flat, thin plate of thermally conductive material having an area substantially larger than the semiconductor device; a button extending from a surface of the plate and having an area approximately equal to that of the semiconductor device; wherein: the unpackaged semiconductor device is mounted to the button; the PCB has a through hole extending from one face to the opposite face; the semiconductor device, mounted to the heat sink, is inserted through the through hole from the opposite face of the PCB towards the one face of the PCB, and is connected to the first conductive layer; the surface of the plate is in contact with and electrically connected to the second conductive layer; the heat sink forms a biasing connection for the semiconductor device mounted to the button; when the heat sink and device mounted thereto are assembled to the PCB, the button extends in the through hole partially towards the one face of the PCB; and when the sink and device mounted thereto are assembled to the PCB, the semiconductor device extends from within the through hole to above the one face of the PCB.