Optical module with tolerant wave soldered joints

Claim 2

An optical module for providing bidirectional communication with fiber optic means, comprising: a housing including a first and second receptacle for connection to said fiber optic means; a first optical sub-assembly having multiple solder-wettable conductive leads for receiving electrical signals, for converting the electrical signals into optical signals and positioned to communicate with said fiber optic means connected in the first receptacle for transmitting the optical signals to said fiber optic means; a second optical sub-assembly positioned for receiving a optical signals from said fiber optic means connected in the second receptacle for converting the optical signals into electrical signals and having multiple solder-wettable conductive leads for transmitting the electrical signals; electronic circuit means for processing the electrical signals transmitted by the second optical sub-assembly and for transmitting electrical signals to the first optical sub-assembly; an electrical interconnection member located within said housing adjacent said first and second optical sub-assemblies on a side of the optical sub-assembly from which the leads extend, for electrical interconnection between said optical sub-assemblies and said electronic circuit means; a flexible ribbon cable for each said optical sub-assembly for transmitting signals between the optical sub-assembly and said electronic circuit means, each said cable including: at least two passages at one end of each cable through each of which a respective lead of the respective optical sub-assembly is inserted; solder wettable lands proximate said passages and connected to conductors of the flexible ribbon cable for soldered connection between the lands and the leads; soldering bridge means communicating with the lands and the leads for establishing a desired solder joint configuration; solder joints connecting between said leads and said lands and enclosing said soldering bridge means; and cable connection means at a distal end of each cable for connecting the conductors of the cable to conductors of the electrical interconnection member for said signal transmission.

Claim 3

The optical module of claim 1, in which the soldering bridge means includes solder wettable projections extending into the passage and integrally connected to the land for securely connecting the solder joint to the land.

Claim 4

The optical module of claim 1 in which: the passages are approximately round apertures through the ribbon cable and into which soldering bridge means project; and the diameters of the apertures are more than 0.15 mm larger than the diameter of the leads which are inserted into them.

Claim 5

The optical module of claim 1 in which the soldering bridge means includes, deformable projections extending from the land partially into the passage so that regardless of the position of the lead in the passage the desired joint configuration will be produced.

Claim 6

The optical module of claim 1 in which, the conductors, the land and the soldering bridge means are part of a conductive film layer from which the electrical circuit of the interconnect structure is produced; and the thickness of the conductive layer is less than 0.3 times the diameter of the lead.

Claim 7

A process for manufacturing an optical module for providing bidirectional communication with fiber optic means, comprising the steps: forming a two-part metal housing including a first and second receptacle for connection to said fiber optic means; positioning a first optical sub-assembly having solder-wettable conductive leads extending from an end of the sub-assembly into the housing, for transmitting an optical signal to said fiber optic means when connected in the first receptacle; positioning a second optical sub-assembly having solder-wettable conductive leads extending from one end of the sub-assembly into the housing, for receiving an optical signal from said fiber optic means when connected in the second receptacle; positioning an electrical interconnection member within said housing and adjacent said first and second optical sub-assembly on the side of the sub-assemblies from which the leads extend, for electrical interconnection between elements of said optical module; positioning electronic circuit means for processing the electrical signals transmitted by the second optical sub-assembly and for transmitting an electrical signal to the first optical sub-assembly in the housing on the electrical interconnection member; providing a layer of conductive film; selectively coating the conductive film with photoresist to provide conductive paths to form an electric circuit; selectively coating the conductive film with photoresist to provide conductive lands connected to the conductive paths and encircling passages for soldered connection between the lands and solder-wettable leads inserted into the passages; selectively coating the conductive film with photoresist to provide soldering bridge means extending from the lands and projecting into the passage for producing a desired solder joint configuration between the lands and leads; etching to remove areas of the conductive film which are not protected by the photoresist in order to provide said conductive paths, conductive lands and soldering bridges and to provide passages through the conductive film proximate to the conductive lands; removing the photoresist from the conductive film; providing coverings of dielectric material integral with each major surface of the conductive film for covering conductive paths of said electrical interconnect structure and to provide for producing said desired solder joint configurations; providing windows in the covering for the passages, conductive lands and soldering bridge means for soldering the leads to the lands; inserting solder wettable, conductive leads of a respective optical sub-assembly into the passages; wave soldering the leads to the lands enclosing said soldering bridge means in the resulting solder joint of desired configuration, and connecting exposed conductors at another end of the conductive film to pads on the electrical interconnect structure.

Claim 8

A process for manufacturing an optical module for providing bidirectional communication with fiber optic means, comprising the steps: forming a two-part metal housing including a first and second receptacle for connection to said fiber optic means; positioning a first optical sub-assembly having solder-wettable conductive leads extending from an end of the sub-assembly into the housing, for transmitting an optical signal to said fiber optic means when connected in the first receptacle; positioning a second optical sub-assembly having solder-wettable conductive leads extending from one end of the sub-assembly into the housing, for receiving an optical signal from said fiber optic means when connected in the second receptacle; positioning an electrical interconnection member within said housing and adjacent said first and second optical sub-assembly on the side of the sub-assemblies from which the leads extend, for electrical interconnection between elements of said optical module; positioning electronic circuit means for processing the electrical signals transmitted by the second optical sub-assembly and for transmitting an electrical signal to the first optical sub-assembly in the housing on the electrical interconnection member; providing a layer of conductive film; selectively coating the conductive film with photoresist to provide conductive paths to form an electric circuit; selectively coating the conductive film with photoresist to provide conductive lands connected to the conductive paths and encircling passages for soldered connection between the lands and solder-wettable leads inserted into the passages; selectively coating the conductive film with photoresist to provide soldering bridge means extending from the lands and projecting into the passage for producing a desired solder joint configuration between the lands and leads; etching to remove areas of the conductive film which are not protected by the photoresist in order to provide said conductive paths, conductive lands and soldering bridges and to provide passages through the conductive film proximate to the conductive lands; removing the photoresist from the conductive film; providing coverings of dielectric material integral with each major surface of the conductive film for covering conductive paths of said electrical interconnect structure and to provide for producing said desired solder joint configurations; providing windows in the covering for the passages, conductive lands and soldering bridge means for soldering the leads to the lands; inserting solder wettable, conductive leads of a respective optical sub-assembly into the passages; wave soldering the leads to the lands enclosing said soldering bridge means in the resulting solder joint of desired configuration, and connecting exposed conductors at another end of the conductive film to pads on the electrical interconnect structure.

Claim 9

The process of claim 6, in which the centers of a pair of apertures are spaced less than 2 mm apart.