US5297618A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for removing a heatsink from an electronic module or package
Assignee: International Business Machines Corp
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Filing: 1992-12-31
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Granted: 1994-03-29
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Expires: 2012-12-31
Abstract
Abstract A heatsink is provided which can be removably secured in a heat transfer relationship to an electronic module or package by an epoxy type adhesive. A screw is provided through one end of the heatsink directly over an edge of the module sealing cap. To remove the heatsink from the module, the screw is turned down to contact the cap. Continued turning causes a prying force between the cap and the module whereby the heatsink is peeled away and removed from the module. All forces are directed between the cap and the module thereby eliminating harmful stress from being transmitted through the solder ball connections and to a supporting circuit card.
Inventors
- 👤 John R. Behun
- 👤 Joseph A. Benenati
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 17:26
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/60; H10W40/611; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
103 words
A removable heat sink for use on electronic modules or packages, comprising: a heat sink body; a pedestal connected to said heat sink body having a bonding surface suitable for adhesive bonding to an electronic module or package; an adhesive positioned on said pedestal at said bonding surface; at least one cantilevered portion extending from said pedestal; and means for exerting a prying action on said heat sink body at said bonding surface of said pedestal, said means for exerting a prying action being connected to said cantilevered portion and being operable in a direction perpendicular to said bonding surface of said pedestal.
Claim 2
Dependent Claim
103 words
A removable heat sink for use on electronic modules or packages, comprising: a heat sink body; a pedestal connected to said heat sink body having a bonding surface suitable for adhesive bonding to an electronic module or package; an adhesive positioned on said pedestal at said bonding surface; at least one cantilevered portion extending from said pedestal; and means for exerting a prying action on said heat sink body at said bonding surface of said pedestal, said means for exerting a prying action being connected to said cantilevered portion and being operable in a direction perpendicular to said bonding surface of said pedestal.
Claim 3
Dependent Claim
25 words
A removable heatsink as recited in claim 1 wherein said means for exerting said prying action is a screw which extends through said cantilevered portion.
Claim 4
Dependent Claim
26 words
A removable heatsink as recited in claim 1 wherein said means for exerting said prying action is a push rod which extends through said cantilevered portion.
Claim 5
Dependent Claim
18 words
A removable heatsink as recited in claim 1 further comprising cooling fins extending from said heat sink body.
Claim 6
Dependent Claim
114 words
A removable heatsink for use on electronic modules or packages, comprising: a heat sink body; a pedestal connected to said heat sink body having a bonding surface suitable for bonding to an electronic module or package; at least one cantilevered portion extending from said pedestal; cooling fins extending from said heat sink body; and means for exerting a prying action on said heat sink body at said bonding surface of said pedestal, said means exerting a prying action being connected to said cantilevered portion and being operable in a direction perpendicular to said bonding surface of said pedestal, said means for exerting said prying action extends through said cooling fins and said cantilevered portion.
Claim 7
Dependent Claim
114 words
A removable heatsink for use on electronic modules or packages, comprising: a heat sink body; a pedestal connected to said heat sink body having a bonding surface suitable for bonding to an electronic module or package; at least one cantilevered portion extending from said pedestal; cooling fins extending from said heat sink body; and means for exerting a prying action on said heat sink body at said bonding surface of said pedestal, said means exerting a prying action being connected to said cantilevered portion and being operable in a direction perpendicular to said bonding surface of said pedestal, said means for exerting said prying action extends through said cooling fins and said cantilevered portion.
Claim 8
Dependent Claim
140 words
An electronic component, comprising: an electronic module or package; a heat sink comprising a heat sink body, a pedestal connected to said heat sink body having a bonding surface suitable for adhesive bonding to said electronic module or package, at least one cantilevered portion extending from said pedestal, and means for exerting a prying action on said heat sink body at said boding surface of said pedestal, said means for exerting a prying action being connected to said cantilevered portion and being operable in a direction perpendicular to said bonding surface of said pedestal; an adhesive positioned on said bonding surface of said pedestal connecting said heat sink to said to said electronic module or package; cooling fins extending from said heat sink body, said means for exerting said prying action extends through said cooling fins and said cantilevered portion.
Claim 9
Dependent Claim
140 words
An electronic component, comprising: an electronic module or package; a heat sink comprising a heat sink body, a pedestal connected to said heat sink body having a bonding surface suitable for adhesive bonding to said electronic module or package, at least one cantilevered portion extending from said pedestal, and means for exerting a prying action on said heat sink body at said boding surface of said pedestal, said means for exerting a prying action being connected to said cantilevered portion and being operable in a direction perpendicular to said bonding surface of said pedestal; an adhesive positioned on said bonding surface of said pedestal connecting said heat sink to said to said electronic module or package; cooling fins extending from said heat sink body, said means for exerting said prying action extends through said cooling fins and said cantilevered portion.
Claim 10
Dependent Claim
115 words
An electronic component, comprising: an electronic module or package; a heat sink comprising a heat sink body, a pedestal connected to said heat sink body having a bonding surface suitable for adhesive bonding to said electronic module or package, at least one cantilevered portion extending from said pedestal, and means for exerting a prying action on said heat sink body at said bonding surface of said pedestal, said means for exerting a prying action being connected to said cantilevered portion and being operable in a direction perpendicular to said bonding surface of said pedestal; and an adhesive positioned on said bonding surface of said pedestal connecting said heat sink to said electronic module or package.
Claim 11
Dependent Claim
115 words
An electronic component, comprising: an electronic module or package; a heat sink comprising a heat sink body, a pedestal connected to said heat sink body having a bonding surface suitable for adhesive bonding to said electronic module or package, at least one cantilevered portion extending from said pedestal, and means for exerting a prying action on said heat sink body at said bonding surface of said pedestal, said means for exerting a prying action being connected to said cantilevered portion and being operable in a direction perpendicular to said bonding surface of said pedestal; and an adhesive positioned on said bonding surface of said pedestal connecting said heat sink to said electronic module or package.
Claim 12
Dependent Claim
24 words
An electronic component as recited in claim 7 wherein said means for exerting a prying action contacts said electronic module or package during prying.
Claim 13
Dependent Claim
25 words
An electronic component as recited in claim 7 wherein said means for exerting said prying action is a screw which extends through said cantilevered portion.
Claim 14
Dependent Claim
26 words
An electronic component as recited in claim 7 wherein said means for exerting said prying action is a push rod which extends through said cantilevered portion.
Claim 15
Dependent Claim
18 words
An electronic component as recited in claim 7 further comprising cooling fins extending from said heat sink body.
Claim 16
Dependent Claim
14 words
An electronic component as recited in claim 7 wherein said adhesive is an epoxy.
Claim 17
Dependent Claim
20 words
An electronic component as recited in claim 7 wherein said electronic module or package is a solder ball connection module.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-03-28 | 1997-09-27 | 1998-03-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-03-28 | 2001-09-27 | 2002-03-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-03-28 | 2005-09-27 | 2006-03-29 | $7700.00 | Window Closed / Lapsed |