US5324892A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of fabricating an electronic interconnection
Assignee: International Business Machines Corp
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Filing: 1992-08-07
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Granted: 1994-06-28
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Expires: 2012-08-07
Abstract
Abstract Disclosed is a method of fabricating an electronic interconnection structure comprising at least one solder column Joined to an I/O pad of a substrate, the method including the steps of: (a) applying a quantity of solder to the solder column or I/O pad; (b) aligning the solder column with the I/O pad such that there is a quantity of solder between them; (c) heating the structure to cause the solder to melt and bond the column to the I/O pad; and (d) planarizing the solder column to a predetermined height. Also disclosed is the electronic interconnection structure made by the method according to the invention.
Inventors
- 👤 Francois J. Granier
- 👤 Jean-Jacques M. Rieu
- 👤 Philippe Raout
- 👤 Andre Sanchez
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 10:54
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H05K3/3426; H05K3/3431; H05K3/3436; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/1031; H05K2201/10318; H05K2201/10613; H05K2201/10621; H05K2201/10704; H05K2201/10954; H05K2201/10992; H05K2203/00; H05K2203/04; H05K2203/0415; H05K3/36; H05K3/368; H10; H10W; H10W72/00; H10W72/20; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
92 words
A method of fabricating an electronic interconnection structure comprising at least one solder column joined to an I/O pad of a substrate, the method comprising the steps of: (a) applying a quantity of solder to one of the solder column and I/O pad; (b) aligning and contacting the solder column with the I/O pad such that there is a quantity of solder between them; (c) heating the structure to cause the solder to melt and bond the column to the I/O pad; and (d) planarizing the solder column to a predetermined height.
Claim 2
Independent Claim
92 words
A method of fabricating an electronic interconnection structure comprising at least one solder column joined to an I/O pad of a substrate, the method comprising the steps of: (a) applying a quantity of solder to one of the solder column and I/O pad; (b) aligning and contacting the solder column with the I/O pad such that there is a quantity of solder between them; (c) heating the structure to cause the solder to melt and bond the column to the I/O pad; and (d) planarizing the solder column to a predetermined height.
Claim 3
Dependent Claim
21 words
The method of claim 1 wherein there are a plurality of the solder columns which are planarized to a predetermined height.
Claim 4
Dependent Claim
92 words
The method of claim 1 wherein there is a second substrate having at least one I/O pad, the method further comprising: (e) applying a quantity of solder to one of the unjoined end of the solder column and the I/O pad of the substrate; (f) aligning and contacting the unjoined end of the solder column with the connection pad such that there is a quantity of solder between them; and (g) heating the structure to cause the solder in step (e) to melt and bond the solder column to the I/O pad.
Claim 5
Dependent Claim
21 words
The method of claim 1 wherein the solder column has a melting point greater than the melting point of the solder.
Claim 6
Dependent Claim
26 words
The method of claim 3 wherein the solder column has a melting point greater than the melting point of the solders in steps (a) and (e).
Claim 7
Dependent Claim
33 words
The method of claim 5 wherein the solder column has a melting point greater than 250° C. and the solders in steps (a) and (e) have a melting point less than 240° C.
Claim 8
Dependent Claim
26 words
The method of claim 5 wherein the solder in step (a) has a melting point greater than the melting point of the solder in step (e).
Claim 9
Dependent Claim
22 words
The method of claim 3 wherein the first substrate is a ceramic substrate carrier and the second substrate is an organic board.
Claim 10
Independent Claim
160 words
A method of fabricating an electronic interconnection structure comprising at least one solder column Joined to an I/O pad of a substrate, the method comprising the steps of: (a) placing the solder column into a complementary cavity of a furnace fixture, the cavity having approximately the same width but smaller height as the solder column so that the solder column protrudes from the cavity; (b) applying a quantity of solder to one of the solder column and I/O pad; (c) aligning and contacting one end of the solder column with the I/O pad such there is a quantity of solder between them and the other end of the solder column protruding from the fixture; (d) heating the structure to cause the solder to melt and bond the solder column to the I/O pad; and (e) planarizing the solder column even with the surface of the furnace fixture by removing that portion of the solder column that protrudes from the fixture.
Claim 11
Independent Claim
160 words
A method of fabricating an electronic interconnection structure comprising at least one solder column Joined to an I/O pad of a substrate, the method comprising the steps of: (a) placing the solder column into a complementary cavity of a furnace fixture, the cavity having approximately the same width but smaller height as the solder column so that the solder column protrudes from the cavity; (b) applying a quantity of solder to one of the solder column and I/O pad; (c) aligning and contacting one end of the solder column with the I/O pad such there is a quantity of solder between them and the other end of the solder column protruding from the fixture; (d) heating the structure to cause the solder to melt and bond the solder column to the I/O pad; and (e) planarizing the solder column even with the surface of the furnace fixture by removing that portion of the solder column that protrudes from the fixture.
Claim 12
Dependent Claim
22 words
The method of claim 9 wherein there are a plurality of the solder columns which are planarized to the same predetermined height.
Claim 13
Dependent Claim
92 words
The method of claim 9 wherein there is a second substrate having at least one I/O pad, the method further comprising: (f) applying a quantity of solder to one of the unjoined end of the solder column and the I/O pad of the substrate; (g) aligning and contacting the unjoined end of the solder column with the connection pad such that there is a quantity of solder between them; and (h) heating the structure to cause the solder in step (f) to melt and bond the solder column to the I/O pad.
Claim 14
Dependent Claim
21 words
The method of claim 9 wherein the solder column has a melting point greater than the melting point of the solder.
Claim 15
Dependent Claim
26 words
The method of claim 11 wherein the solder column has a melting point greater than the melting point of the solders in steps (b) and (f).
Claim 16
Dependent Claim
33 words
The method of claim 13 wherein the solder column has a melting point greater than 250° C. and the solders in steps (b) and (f) have a melting point less than 240° C.
Claim 17
Dependent Claim
26 words
The method of claim 13 wherein the solder in step (b) has a melting point greater than the melting point of the solder in step f.
Claim 18
Dependent Claim
22 words
The method of claim 11 wherein the first substrate is a ceramic substrate carrier and the second substrate is an organic board.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-06-27 | 1997-12-27 | 1998-06-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-06-27 | 2001-12-27 | 2002-06-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-06-27 | 2005-12-27 | 2006-06-28 | $7700.00 | Window Closed / Lapsed |