US5338971A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electronic device structure with studs locating lead frame on backing plate
Assignee: STMicroelectronics SRL
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Filing: 1992-11-27
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Granted: 1994-08-16
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Expires: 2012-11-27
Abstract
Abstract An electronic device structure which comprises a metal plate, a semiconductor material chip attached to the plate, terminal leads, interconnection wires between the leads and metallized regions of the chip, and a plastic body which encapsulates the whole with the exception of a surface of the plate and part of the leads. This structure has highly reliable means of electrical connection between at least one metallized region and the metal plate which comprise at least one metal beam resting onto the plate and being attached thereto by studs integral with the plate, and at least one wire welded between a metallized region of the chip and the metal beam between the studs. At least a portion of the beam and its connection wire are encapsulated within the plastics body.
Inventors
- 👤 Paolo Casati
- 👤 Marziano Corno
- 👤 Giuseppe Marchisi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 23:23
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W70/00; H10W70/40; H10W70/421; H10W70/456; H10W72/00; H10W72/071; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/50; H10W72/541; H10W72/5445; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/90; H10W72/931; H10W72/932; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 32
Claim 1
Independent Claim
135 words
An electronic device structure, comprising: a plate of thermally and electrically conductive material; a chip having a first surface thereof electrically and thermally connected to said plate, and containing one or more miniature electronic devices and one or more bond pads on a second surface thereof; a plurality of externally accessible conductive leads, each having one end adjacent to said chip; at least one of said leads being widened to define a beam which is electrically and mechanically attached to said plate by a shaped metal connection; wires interconnecting said leads to said bond pads of said chip, at least one said wire being attached to said metal beam; and a plastic body encapsulating said chip, and each of said wires, and at least part of said beam, and at least part of said plate.
Claim 2
Dependent Claim
135 words
An electronic device structure, comprising: a plate of thermally and electrically conductive material; a chip having a first surface thereof electrically and thermally connected to said plate, and containing one or more miniature electronic devices and one or more bond pads on a second surface thereof; a plurality of externally accessible conductive leads, each having one end adjacent to said chip; at least one of said leads being widened to define a beam which is electrically and mechanically attached to said plate by a shaped metal connection; wires interconnecting said leads to said bond pads of said chip, at least one said wire being attached to said metal beam; and a plastic body encapsulating said chip, and each of said wires, and at least part of said beam, and at least part of said plate.
Claim 3
Dependent Claim
25 words
The electronic device structure of claim 1, wherein said shaped metal connection comprises a protrusion of said plate into plural holes in each said beam.
Claim 4
Dependent Claim
21 words
The electronic device structure of claim 1, wherein said metal beam has approximately the same composition and thickness as said leads.
Claim 5
Dependent Claim
36 words
The electronic device structure of claim 1, wherein said plate comprises a first planar surface which is attached to said chip, and a second surface, opposite said first surface, which is not covered by said body.
Claim 6
Dependent Claim
15 words
The electronic device structure of claim 1, wherein each said wire consists essentially of gold.
Claim 7
Dependent Claim
19 words
The electronic device structure of claim 1, wherein only one of said wires is connected to each said beam.
Claim 8
Dependent Claim
23 words
The electronic device structure of claim 1, wherein each said metal beam is attached to said plate by multiple separate shaped metal connections.
Claim 9
Dependent Claim
134 words
An electronic device structure, comprising: a metal plate; a semiconductor chip having a first surface thereof affixed to said plate in electrical and thermal connection therewith, and containing one or more miniature electronic devices and one or more bond pads on a second surface thereof; a plurality of externally accessible metal leads, each having one end adjacent to said chip; at least one of said leads being widened to define a beam which is electrically and mechanically attached to said plate by a shaped metal connection; wires interconnecting said leads to said bond pads of said chip, at least one said wire being attached to said metal beam; and a plastic body encapsulating said chip, and each of said wires, and at least part of said beam, and at least part of said plate.
Claim 10
Dependent Claim
134 words
An electronic device structure, comprising: a metal plate; a semiconductor chip having a first surface thereof affixed to said plate in electrical and thermal connection therewith, and containing one or more miniature electronic devices and one or more bond pads on a second surface thereof; a plurality of externally accessible metal leads, each having one end adjacent to said chip; at least one of said leads being widened to define a beam which is electrically and mechanically attached to said plate by a shaped metal connection; wires interconnecting said leads to said bond pads of said chip, at least one said wire being attached to said metal beam; and a plastic body encapsulating said chip, and each of said wires, and at least part of said beam, and at least part of said plate.
Claim 11
Dependent Claim
25 words
The electronic device structure of claim 8, wherein said shaped metal connection comprises a protrusion of said plate into plural holes in each said beam.
Claim 12
Dependent Claim
21 words
The electronic device structure of claim 8, wherein said metal beam has approximately the same composition and thickness as said leads.
Claim 13
Dependent Claim
19 words
The electronic device structure of claim 8, wherein only one of said wires is connected to each said beam.
Claim 14
Dependent Claim
23 words
The electronic device structure of claim 8, wherein each said metal beam is attached to said plate by multiple separate shaped metal connections.
Claim 15
Dependent Claim
154 words
An electronic device structure, comprising: a body of insulating material; a plurality of metal leads, each having one end inside said body and another end externally accessible; a plurality of wires, each connected to a respective of said leads and totally encapsulated within said body of insulating material; a metal plate which is partially encapsulated within said body, and partially protrudes therefrom; a semiconductor chip having a first surface thereof affixed to said plate in electrical and thermal connection therewith, and containing a plurality of miniature electronic devices in proximity to a second surface thereof, and a plurality of bond pads, electrically connected to ones of said wires, on said second surface; a metal beam which has approximately the same composition and thickness as said leads, and which is electrically and mechanically attached to said plate by a shaped metal connection therebetween, and to which at least one of said wires is directly attached.
Claim 16
Dependent Claim
154 words
An electronic device structure, comprising: a body of insulating material; a plurality of metal leads, each having one end inside said body and another end externally accessible; a plurality of wires, each connected to a respective of said leads and totally encapsulated within said body of insulating material; a metal plate which is partially encapsulated within said body, and partially protrudes therefrom; a semiconductor chip having a first surface thereof affixed to said plate in electrical and thermal connection therewith, and containing a plurality of miniature electronic devices in proximity to a second surface thereof, and a plurality of bond pads, electrically connected to ones of said wires, on said second surface; a metal beam which has approximately the same composition and thickness as said leads, and which is electrically and mechanically attached to said plate by a shaped metal connection therebetween, and to which at least one of said wires is directly attached.
Claim 17
Dependent Claim
25 words
The electronic device structure of claim 13, wherein said shaped metal connection comprises a protrusion of said plate into plural holes in each said beam.
Claim 18
Dependent Claim
15 words
The electronic device structure of claim 13, wherein each said wire consists essentially of gold.
Claim 19
Dependent Claim
19 words
The electronic device structure of claim 13, wherein only one of said wires is connected to each said beam.
Claim 20
Dependent Claim
143 words
An electronic device structure comprising: a metal plate serving support and heat-sink functions; a semiconductor chip having a first surface attached to said plate, and having metallized regions on a second surface thereof; a plurality of externally accessible leads, each having one end adjacent to said chip; wires interconnecting said leads to said metallized regions of said chip; at least one metal beam electrically and mechanically attached to said plate by a shaped metal connection, and at least one wire attached, at one end thereof, to a respective one of said metallized regions of said chip, and, at another end thereof, to said metal beam; and a plastic body encapsulating said chip, and all of said wires, and the ends of said leads which are closest to said chip, and at least part of said beam, and at least part of said plate.
Claim 21
Dependent Claim
143 words
An electronic device structure comprising: a metal plate serving support and heat-sink functions; a semiconductor chip having a first surface attached to said plate, and having metallized regions on a second surface thereof; a plurality of externally accessible leads, each having one end adjacent to said chip; wires interconnecting said leads to said metallized regions of said chip; at least one metal beam electrically and mechanically attached to said plate by a shaped metal connection, and at least one wire attached, at one end thereof, to a respective one of said metallized regions of said chip, and, at another end thereof, to said metal beam; and a plastic body encapsulating said chip, and all of said wires, and the ends of said leads which are closest to said chip, and at least part of said beam, and at least part of said plate.
Claim 22
Dependent Claim
25 words
The electronic device structure of claim 17, wherein said shaped metal connection comprises a protrusion of said plate into plural holes in each said beam.
Claim 23
Dependent Claim
36 words
The electronic device structure of claim 17, wherein said plate comprises a first planar surface which is attached to said chip, and a second surface, opposite said first surface, which is not covered by said body.
Claim 24
Dependent Claim
19 words
The electronic device structure of claim 17, wherein only one of said wires is connected to each said beam.
Claim 25
Dependent Claim
23 words
The electronic device structure of claim 17, wherein each said metal beam is attached to said plate by multiple separate shaped metal connections.
Claim 26
Dependent Claim
32 words
The device structure of claim 17, wherein said shaped metal connection comprises at least one stud formed integrally with said plate, passed through a corresponding hole in said beam, and swaged thereto.
Claim 27
Dependent Claim
22 words
The device structure of claim 17, wherein said beam is extended, at at least one end thereof, to outside said plastic body.
Claim 28
Dependent Claim
23 words
The device structure of claim 17, wherein said beam and terminal leads are elongate flat members formed from a common sheet of metal.
Claim 29
Dependent Claim
22 words
The device structure of claim 24, wherein said beam is extended, at at least one end thereof, to outside said plastic body.
Claim 30
Dependent Claim
32 words
The device structure of claim 24, wherein said shaped metal connection comprises at least one stud formed integrally with said plate, passed through a corresponding hole in said beam, and swaged thereto.
Claim 31
Dependent Claim
22 words
The device structure of claim 26, wherein said beam is extended, at at least one end thereof, to outside said plastic body.
Claim 32
Dependent Claim
46 words
The device structure of claim 26, comprising two of said metal beams lying parallel to each other, and each attached to said plate by two respective studs, with said wires each having an end attached to a respective one of said beams between said studs thereof.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-08-15 | 1998-02-14 | 1998-08-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-08-15 | 2002-02-14 | 2002-08-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-08-15 | 2006-02-14 | 2006-08-16 | $7700.00 | Window Closed / Lapsed |