Method of manufacturing closed cavity LED

Claim 1

A method of manufacturing closed cavity LEDs comprising the steps of: providing a first substrate having a major surface; depositing a plurality of layers of material on the major surface of the first substrate to form an LED, the plurality of layers being deposited with two electrically conductive layers, a first conductive layer of the two electrically conductive layers being formed in overlying relationship adjacent the major surface of the first substrate and on one side of the plurality of layers and a second conductive layer of the two electrically conductive layers being formed on an opposite side of the plurality of layers, the second conductive layer further defining a light emitting area; depositing a light transparent, electrically conductive layer of material on the second conductive layer in overlying relationship to the light emitting area and in electrical contact with the second conductive layer; fixing a protective optically transparent substrate in overlying relationship to the transparent conductive layer; removing the first substrate and exposing the first conductive layer; removing portions of the plurality of layers of material whereby sides of the LED are defined; depositing a layer of dielectric material on the sides of the LED and in overlying relationship on exposed portions of the first conductive layer and the transparent conductive layer; opening first and second contact areas through the layer of dielectric material to the first conductive layer and to the transparent conductive layer of material, respectively; and depositing a layer of electrical contact material over the layer of dielectric material and in the open first and second contact areas in contact with the first conductive layer and the transparent conductive layer of material to form first and second external electrical contacts of the LED and to form a reflector on all sides of the LED, except the light emitting area.

Claim 2

A method of manufacturing closed cavity LEDs comprising the steps of: providing a first substrate having a major surface; depositing a plurality of layers of material on the major surface of the first substrate to form an LED, the plurality of layers being deposited with two electrically conductive layers, a first conductive layer of the two electrically conductive layers being formed in overlying relationship adjacent the major surface of the first substrate and on one side of the plurality of layers and a second conductive layer of the two electrically conductive layers being formed on an opposite side of the plurality of layers, the second conductive layer further defining a light emitting area; depositing a light transparent, electrically conductive layer of material on the second conductive layer in overlying relationship to the light emitting area and in electrical contact with the second conductive layer; fixing a protective optically transparent substrate in overlying relationship to the transparent conductive layer; removing the first substrate and exposing the first conductive layer; removing portions of the plurality of layers of material whereby sides of the LED are defined; depositing a layer of dielectric material on the sides of the LED and in overlying relationship on exposed portions of the first conductive layer and the transparent conductive layer; opening first and second contact areas through the layer of dielectric material to the first conductive layer and to the transparent conductive layer of material, respectively; and depositing a layer of electrical contact material over the layer of dielectric material and in the open first and second contact areas in contact with the first conductive layer and the transparent conductive layer of material to form first and second external electrical contacts of the LED and to form a reflector on all sides of the LED, except the light emitting area.

Claim 17

A method of manufacturing closed cavity LEDs comprising the steps of: providing a first substrate having a major surface; depositing a plurality of layers of material to form an LED including depositing a first conductive layer of a first conductivity type on the major surface of the first substrate, depositing a first cladding layer of the first conductivity type on the first conductive layer, depositing an active layer on the first cladding layer, depositing a second cladding layer of a second conductivity type on the active layer, and depositing a second conductive layer of the second conductivity type on the second cladding layer, the second conductive layer further defining a light emitting area; depositing a light transparent, electrically conductive layer of material on the second conductive layer in overlying relationship to the light emitting area and in electrical contact with the second conductive layer; fixing a protective optically transparent substrate in overlying relationship to the transparent conductive layer; removing the first substrate and exposing the first conductive layer; etching portions of the plurality of layers of material whereby sides of the LED are defined; depositing a layer of dielectric material on the sides of the LED and in overlying relationship on exposed portions of the first conductive layer and the transparent conductive layer; opening first and second contact areas through the layer of dielectric material to the first conductive layer and to the transparent conductive layer of material, respectively; and depositing a layer of electrical contact material over the layer of dielectric material and in the open first and second contact areas in contact with the first conductive layer and the transparent conductive layer of material to form first and second external electrical contacts of the LED and to form a reflector on all sides of the LED, except the light emitting area.

Claim 18

A method of manufacturing closed cavity LEDs comprising the steps of: providing a first substrate having a major surface; depositing a plurality of layers of material to form an LED including depositing a first conductive layer of a first conductivity type on the major surface of the first substrate, depositing a first cladding layer of the first conductivity type on the first conductive layer, depositing an active layer on the first cladding layer, depositing a second cladding layer of a second conductivity type on the active layer, and depositing a second conductive layer of the second conductivity type on the second cladding layer, the second conductive layer further defining a light emitting area; depositing a light transparent, electrically conductive layer of material on the second conductive layer in overlying relationship to the light emitting area and in electrical contact with the second conductive layer; fixing a protective optically transparent substrate in overlying relationship to the transparent conductive layer; removing the first substrate and exposing the first conductive layer; etching portions of the plurality of layers of material whereby sides of the LED are defined; depositing a layer of dielectric material on the sides of the LED and in overlying relationship on exposed portions of the first conductive layer and the transparent conductive layer; opening first and second contact areas through the layer of dielectric material to the first conductive layer and to the transparent conductive layer of material, respectively; and depositing a layer of electrical contact material over the layer of dielectric material and in the open first and second contact areas in contact with the first conductive layer and the transparent conductive layer of material to form first and second external electrical contacts of the LED and to form a reflector on all sides of the LED, except the light emitting area.