US5361272A
Expired / Lapsed
US
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Semiconductor architecture and application thereof
Assignee: Wind River Systems Inc
•
Filing: 1992-09-18
•
Granted: 1994-11-01
•
Expires: 2012-09-18
Abstract
Abstract A new technology in semiconductor electronics is provided wherein basic semiconductor elements (BSEs) are fabricated on the surfaces of hollow, cone-shaped and/or other planar or non-planar substrata. Photosensitive and photoemitting elements are included within each BSE capable of transmitting and receiving signals to and from external sources in a direction that is non-parallel (oblique) to the silicon surface and circuitry plane. Inter-BSE communication are also achieved via fiber optic connectors. In one embodiment, the BSEs may be assembled in an efficient arrangement whereby some numbers of BSEs (for example, six (6)) are located adjacent and surrounding another "polar" BSE, thereby providing for short opto-electronic connections between the polar BSE and its neighbors.
Inventors
- 👤 Vladimir Gorelik
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 19:16
CPC Classifications
G; G02; G02B; G02B6/00; G02B6/24; G02B6/42; G02B6/43; H; H04; H04N; H04N25/00; H01; H01S; H01S5/00; H01S5/02; H01S5/022; H01S5/0225; H01S5/02251; H01S5/023; H01S5/02325; H01S5/40; H01S5/4025
Claims Analysis
Total Claims: 67
Claim 1
Independent Claim
32 words
A semiconductor element assembly comprising: (a) a first non-planar substrate, and (b) a first semiconductor material coupled to said first non-planar substrate, wherein said first semiconductor material has a curved exterior surface.
Claim 2
Dependent Claim
32 words
A semiconductor element assembly comprising: (a) a first non-planar substrate, and (b) a first semiconductor material coupled to said first non-planar substrate, wherein said first semiconductor material has a curved exterior surface.
Claim 3
Dependent Claim
21 words
The semiconductor element assembly of claim 1, further comprising: (c) at least one electronic circuit fabricated on said first semiconductor material.
Claim 4
Dependent Claim
18 words
The semiconductor element assembly of claim 1, wherein said first non-planar substrate is made of a ceramic material.
Claim 5
Dependent Claim
17 words
The semiconductor element assembly of claim 1, wherein said first non-planar substrate is made of pure carbon.
Claim 6
Dependent Claim
20 words
The semiconductor element assembly of claim 1, wherein said first non-planar substrate is made of silicon dioxide (SiO 2 ).
Claim 7
Dependent Claim
24 words
The semiconductor element assembly of claim 1, wherein said first non-planar substrate is doped to match the lattice structure of said first semiconductor material.
Claim 8
Dependent Claim
15 words
The semiconductor element assembly of claim 1, wherein said first non-planar substrate is substantially cone-shaped.
Claim 9
Dependent Claim
18 words
The semiconductor element assembly of claim 1, wherein said first non-planar substrate includes a cavity within its interior.
Claim 10
Dependent Claim
25 words
The semiconductor element assembly of claim 8, further comprising: (c) a power supply means within said cavity for providing power to said first non-planar substrate.
Claim 11
Dependent Claim
41 words
The semiconductor element assembly of claim 9, further comprising: (d) coolant conduit means travelling through said power supply means and abutting said first non-planar substrate for cooling said semiconductor element assembly, said coolant conduit means adapted for containing a fluid coolant.
Claim 12
Dependent Claim
15 words
The semiconductor element assembly of claim 1, wherein said first non-planar substrate is substantially spherical.
Claim 13
Dependent Claim
24 words
The semiconductor element assembly of claim 1, wherein said first non-planar substrate comprises a three-dimensional surface connecting two circles residing in different parallel planes.
Claim 14
Dependent Claim
20 words
The semiconductor element assembly of claim 1, wherein said first semiconductor material comprises a first semiconductor layer composed of GaAs.
Claim 15
Dependent Claim
19 words
The semiconductor element assembly of claim 13, wherein said GaAs layer is in the range of 50-200 Angstroms thick.
Claim 16
Dependent Claim
29 words
The semiconductor element assembly of claim 13, wherein said first semiconductor material further comprises a second semiconductor layer composed of an element from the following group: Si or GaAs.
Claim 17
Dependent Claim
35 words
The semiconductor element assembly of claim 1, further comprising: (c) transmitting means coupled to said first semiconductor material for transmitting signals from said first semiconductor material to a destination external to said first semiconductor material.
Claim 18
Dependent Claim
14 words
The semiconductor element assembly of claim 16, wherein said transmitted signals comprise light signals.
Claim 19
Dependent Claim
15 words
The semiconductor element assembly of claim 16, wherein said transmitting means comprises an edge-emitting laser.
Claim 20
Dependent Claim
15 words
The semiconductor element assembly of claim 16, wherein said transmitting means comprises a surface-emitting laser.
Claim 21
Dependent Claim
16 words
The semiconductor element assembly of claim 19, wherein said surface-emitting laser includes a cone-shaped beam splitter.
Claim 22
Dependent Claim
44 words
The semiconductor element assembly of claim 1, further comprising: (c) receiving means coupled to said first semiconductor material for receiving signals from a source external to said first semiconductor material to said first semiconductor material, and providing said signals to said first semiconductor material.
Claim 23
Dependent Claim
14 words
The semiconductor element assembly of claim 21, wherein said received signals comprise light signals.
Claim 24
Dependent Claim
15 words
The semiconductor element assembly of claim 21, wherein said receiving means comprises a photo-sensitive element.
Claim 25
Dependent Claim
67 words
The semiconductor element assembly of claim 1, further comprising: (c) transmitting means coupled to said first semiconductor material for transmitting first signals from said first semiconductor material to a receiver associated with another semiconductor element, and (d) receiving means coupled to said first semiconductor material for receiving second signals from a transmitter associated with another semiconductor element, and providing said second signals to said first semiconductor material.
Claim 26
Dependent Claim
23 words
The semiconductor element assembly of claim 24, wherein said transmitting means further comprises a mirror for reflecting said first signals onto said receiver.
Claim 27
Dependent Claim
45 words
The semiconductor element assembly of claim 1, further comprising: (c) a second non-planar substrate, (d) a second semiconductor material coupled to said second non-planar substrate, and (e) a plurality of interconnector means for providing communications between said first semiconductor material and said second semiconductor material.
Claim 28
Dependent Claim
24 words
The semiconductor element assembly of claim 26, wherein at least one of said plurality of interconnector means comprise a plurality of fiber optic interconnectors.
Claim 29
Dependent Claim
79 words
The semiconductor element assembly of claim 26, wherein each of said plurality of interconnector means comprises: (i) a first terminator means coupled to said first semiconductor material for transmitting signals to and receiving signals from said second semiconductor material, (ii) a second terminator means coupled to said second semiconductor material for transmitting signals to and receiving signals from said first semiconductor material, and (iii) connection means for transmitting signals between said first terminator means and said second terminator means.
Claim 30
Dependent Claim
16 words
The semiconductor element assembly of claim 28, wherein said connection means comprises a fiber optic cable.
Claim 31
Dependent Claim
52 words
The semiconductor element assembly of claim 29, wherein said first terminator means and said second terminator means each comprise: (A) at least one output laser amplifier for amplifying signals transmitted to said first semiconductor material, and (B) at least one input laser amplifier for amplifying signals transmitted from said second semiconductor material.
Claim 32
Dependent Claim
33 words
The semiconductor element assembly of claim 26, further comprising: (c) retina means for receiving visual information, wherein said retina means further provides signals corresponding to said visual information to said first semiconductor material.
Claim 33
Dependent Claim
20 words
The semiconductor element assembly of claim 31, further comprising: (d) mirror means for reflecting said visual information onto said retina.
Claim 34
Dependent Claim
21 words
The semiconductor element assembly of claim 31, wherein each of said plurality of semiconductor elements includes circuitry to process said signals.
Claim 35
Dependent Claim
57 words
A semiconductor element assembly comprising (a) a first non-planar substrate, wherein said first non-planar substrate includes a cavity within its interior, (b) a cooling means located within said cavity for cooling said first non-planar substrate, and (c) a first semiconductor material coupled to said first non-planar substrate, wherein said first semiconductor material has a curved exterior surface.
Claim 36
Dependent Claim
57 words
A semiconductor element assembly comprising (a) a first non-planar substrate, wherein said first non-planar substrate includes a cavity within its interior, (b) a cooling means located within said cavity for cooling said first non-planar substrate, and (c) a first semiconductor material coupled to said first non-planar substrate, wherein said first semiconductor material has a curved exterior surface.
Claim 37
Dependent Claim
21 words
The semiconductor element assembly of claim 34, further comprising: (d) at least one electronic circuit fabricated on said first semiconductor material.
Claim 38
Dependent Claim
18 words
The semiconductor element assembly of claim 34, wherein said first non-planar substrate is made of a ceramic material.
Claim 39
Dependent Claim
17 words
The semiconductor element assembly of claim 34, wherein said first non-planar substrate is made of pure carbon.
Claim 40
Dependent Claim
21 words
The semiconductor element assembly of claim 34, wherein said first non-planar substrate is made of silicon dioxide (SiO 2 ) .
Claim 41
Dependent Claim
24 words
The semiconductor element assembly of claim 34, wherein said first non-planar substrate is doped to match the lattice structure of said first semiconductor material.
Claim 42
Dependent Claim
15 words
The semiconductor element assembly of claim 34, wherein said first non-planar substrate is substantially cone-shaped.
Claim 43
Dependent Claim
25 words
The semiconductor element assembly of claim 34, further comprising: (d) a power supply means within said cavity for providing power to said first non-planar substrate.
Claim 44
Dependent Claim
41 words
The semiconductor element assembly of claim 41, further comprising: (e) coolant conduit means travelling through said power supply means and abutting said first non-planar substrate for cooling said semiconductor element assembly, said coolant conduit means adapted for containing a fluid coolant.
Claim 45
Dependent Claim
15 words
The semiconductor element assembly of claim 34, wherein said first non-planar substrate is substantially spherical.
Claim 46
Dependent Claim
24 words
The semiconductor element assembly of claim 34, wherein said first non-planar substrate comprises a three-dimensional surface connecting two circles residing in different parallel planes.
Claim 47
Dependent Claim
20 words
The semiconductor element assembly of claim 34, wherein said first semiconductor material comprises a first semiconductor layer composed of GaAs.
Claim 48
Dependent Claim
19 words
The semiconductor element assembly of claim 45, wherein said GaAs layer is in the range of 50-200 Angstroms thick.
Claim 49
Dependent Claim
29 words
The semiconductor element assembly of claim 45, wherein said first semiconductor material further comprises a second semiconductor layer composed of an element from the following group: Si or GaAs.
Claim 50
Dependent Claim
35 words
The semiconductor element assembly of claim 34, further comprising: (d) transmitting means coupled to said first semiconductor material for transmitting signals from said first semiconductor material to a destination external to said first semiconductor material.
Claim 51
Dependent Claim
14 words
The semiconductor element assembly of claim 48, wherein said transmitted signals comprise light signals.
Claim 52
Dependent Claim
15 words
The semiconductor element assembly of claim 48, wherein said transmitting means comprises an edge-emitting laser.
Claim 53
Dependent Claim
15 words
The semiconductor element assembly of claim 48, wherein said transmitting means comprises a surface-emitting laser.
Claim 54
Dependent Claim
16 words
The semiconductor element assembly of claim 51, wherein said surface-emitting laser includes a cone-shaped beam splitter.
Claim 55
Dependent Claim
44 words
The semiconductor element assembly of claim 34, further comprising: (d) receiving means coupled to said first semiconductor material for receiving signals from a source external to said first semiconductor material to said first semiconductor material, and providing said signals to said first semiconductor material.
Claim 56
Dependent Claim
14 words
The semiconductor element assembly of claim 53, wherein said received signals comprise light signals.
Claim 57
Dependent Claim
15 words
The semiconductor element assembly of claim 53, wherein said receiving means comprises a photo-sensitive element.
Claim 58
Dependent Claim
67 words
The semiconductor element assembly of claim 34, further comprising: (d) transmitting means coupled to said first semiconductor material for transmitting first signals from said first semiconductor material to a receiver associated with another semiconductor element, and (e) receiving means coupled to said first semiconductor material for receiving second signals from a transmitter associated with another semiconductor element, and providing said second signals to said first semiconductor material.
Claim 59
Dependent Claim
23 words
The semiconductor element assembly of claim 56, wherein said transmitting means further comprises a mirror for reflecting said first signals onto said receiver.
Claim 60
Dependent Claim
45 words
The semiconductor element assembly of claim 34, further comprising: (d) a second non-planar substrate, (e) a second semiconductor material coupled to said second non-planar substrate, and (f) a plurality of interconnector means for providing communications between said first semiconductor material and said second semiconductor material.
Claim 61
Dependent Claim
24 words
The semiconductor element assembly of claim 58, wherein at least one of said plurality of interconnector means comprise a plurality of fiber optic interconnectors.
Claim 62
Dependent Claim
79 words
The semiconductor element assembly of claim 58, wherein each of said plurality of interconnector means comprises: (i) a first terminator means coupled to said second semiconductor material for transmitting signals to and receiving signals from said first semiconductor material, (ii) a second terminator means coupled to said first semiconductor material for transmitting signals to and receiving signals from said second semiconductor material, and (iii) connection means for transmitting signals between said first terminator means and said second terminator means.
Claim 63
Dependent Claim
16 words
The semiconductor element assembly of claim 60, wherein said connection means comprises a fiber optic cable.
Claim 64
Dependent Claim
52 words
The semiconductor element assembly of claim 61, wherein said first terminator means and said second terminator means each comprise: (A) at least one output laser amplifier for amplifying signals transmitted to said first semiconductor material, and (B) at least one input laser amplifier for amplifying signals transmitted from said second semiconductor material.
Claim 65
Dependent Claim
33 words
The semiconductor element assembly of claim 58, further comprising: (d) retina means for receiving visual information, wherein said retina means further provides signals corresponding to said visual information to said first semiconductor material.
Claim 66
Dependent Claim
20 words
The semiconductor element assembly of claim 63, further comprising: (e) mirror means for reflecting said visual information onto said retina.
Claim 67
Dependent Claim
21 words
The semiconductor element assembly of claim 63, wherein each of said plurality of semiconductor elements includes circuitry to process said signals.
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| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1997-10-31 | 1998-05-02 | 1998-11-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-10-31 | 2002-05-02 | 2002-11-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-10-31 | 2006-05-02 | 2006-11-01 | $7700.00 | Window Closed / Lapsed |