Patent US1668022A successfully refreshed from Google Patents.
US5407511A
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Process for forming a sintered conductor circuit board
Assignee: Panasonic Holdings Corp
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Filing: 1994-03-17
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Granted: 1995-04-18
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Expires: 2014-03-17
Abstract
Abstract A circuit board that is made compact or highly dense and can be prepared using no chemical etching is obtained by patternwise printing a sinterable conductor on a releasing substrate, sintering the conductor by heating at a given temperature, and transferring the sintered conductor to a resin support. A plurality of sintered conductors each prepared by the above process may be laminated to give a multi-layered circuit board.
Inventors
- 👤 Seiichi Nakatani
- 👤 Masahide Tsukamoto
- 👤 Mikinari Shimada
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 03:05
CPC Classifications
C; C04; C04B; C04B35/00; C04B35/515; C04B35/58; C04B35/583; H; H05; H05K; H05K3/00; H05K3/10; H05K3/20; H05K3/207; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4069; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/098; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/09; H05K1/092; H05K1/095; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0388; H05K2201/0394; H05K2203/00; H05K2203/01; H05K2203/0147; H05K2203/016; H05K2203/14; H05K2203/1453; H05K2203/1461; H05K3/46; H05K3/4611; H05K3/4614; H05K3/462
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
64 words
A process for fabricating a sintered conductor circuit board, comprising the steps of patternwise applying a sinterable conductor paste to a releasing substrate to form a sinterable conductor pattern, sintering the sinterable conductor pattern at a temperature of from 600° C. to 1,000° C. to form a sintered conductor pattern on the releasing substrate, and transferring the sintered conductor pattern to a resin support.
Claim 2
Dependent Claim
64 words
A process for fabricating a sintered conductor circuit board, comprising the steps of patternwise applying a sinterable conductor paste to a releasing substrate to form a sinterable conductor pattern, sintering the sinterable conductor pattern at a temperature of from 600° C. to 1,000° C. to form a sintered conductor pattern on the releasing substrate, and transferring the sintered conductor pattern to a resin support.
Claim 3
Dependent Claim
22 words
A process for fabricating a sintered conductor circuit board according to claim 1, wherein said releasing substrate comprises hexagonal boron nitride (h-BN).
Claim 4
Dependent Claim
98 words
A process for fabricating a double-sided sintered conductor circuit board, comprising the steps of patternwise applying a sinterable conductor paste to a releasing substrate, to form a sinterable conductor pattern, sintering the sinterable conductor pattern at a temperature of from 600° C. to 1,000° C. to form a sintered conductor pattern on the releasing substrate, and then transferring the sintered conductor pattern to both sides of a resin support having a hole made therein, said hole being filled with a conductive connecting material after said sintered conductor pattern has been transferred to one side of said resin support.
Claim 5
Dependent Claim
98 words
A process for fabricating a double-sided sintered conductor circuit board, comprising the steps of patternwise applying a sinterable conductor paste to a releasing substrate, to form a sinterable conductor pattern, sintering the sinterable conductor pattern at a temperature of from 600° C. to 1,000° C. to form a sintered conductor pattern on the releasing substrate, and then transferring the sintered conductor pattern to both sides of a resin support having a hole made therein, said hole being filled with a conductive connecting material after said sintered conductor pattern has been transferred to one side of said resin support.
Claim 6
Dependent Claim
41 words
A process for fabricating a double-sided sintered conductor circuit board according to claim 3, wherein said releasing substrate is provided with a recess in such a way that part of said sintered conductor come into said hole of said resin support.
Claim 7
Dependent Claim
23 words
A process for fabricating a double-sided sintered conductor circuit board according to claim 3, wherein said releasing substrate comprises hexagonal boron nitride (h-BN).
Claim 8
Dependent Claim
124 words
A process for fabricating a multi-layered sintered conductor circuit board, comprising the steps of patternwise applying a sinterable conductor paste to a releasing substrate, to form a sinterable conductor pattern, sintering the sinterable conductor pattern at a temperature of from 600° C. to 1,000° C. to form a sintered conductor pattern on the releasing substrate, transferring the sintered conductor pattern to one side of a resin support having a hole made therein to form a sintered conductor circuit board, filling said hole of said resin substrate of said circuit board with a conductive connecting material, and laminating to the resulting sintered conductor circuit board at least one other sintered conductor circuit board fabricated by repeating said steps of fabricating said sintered conductor circuit board.
Claim 9
Dependent Claim
124 words
A process for fabricating a multi-layered sintered conductor circuit board, comprising the steps of patternwise applying a sinterable conductor paste to a releasing substrate, to form a sinterable conductor pattern, sintering the sinterable conductor pattern at a temperature of from 600° C. to 1,000° C. to form a sintered conductor pattern on the releasing substrate, transferring the sintered conductor pattern to one side of a resin support having a hole made therein to form a sintered conductor circuit board, filling said hole of said resin substrate of said circuit board with a conductive connecting material, and laminating to the resulting sintered conductor circuit board at least one other sintered conductor circuit board fabricated by repeating said steps of fabricating said sintered conductor circuit board.
Claim 10
Dependent Claim
41 words
A process for fabricating a multi-layered sintered conductor circuit board according to claim 6, wherein said releasing substrate is provided with a recess in such a way that part of said sintered conductor come into said hole of said resin support.
Claim 11
Dependent Claim
22 words
A process for fabricating a sintered conductor circuit board according to claim 6, wherein said releasing substrate comprises hexagonal boron nitride (h-BN).
Claim 12
Dependent Claim
23 words
A process for fabricating a double-sided sintered conductor circuit board according to claim 4, wherein said releasing substrate comprises hexagonal boron nitride (h-BN).
Claim 13
Dependent Claim
22 words
A process for fabricating a sintered conductor circuit board according to claim 7, wherein said releasing substrate comprises hexagonal boron nitride (h-BN).
References Cited (Backward Citations)
US3264402A
Cited
US4164071A
Cited
US4465727A
Cited
US4751126A
Cited
US4581098A
Cited
US4584039A
Cited
US4914260A
Cited
US5162240A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-04-17 | 1998-10-17 | 1999-04-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-04-17 | 2002-10-17 | 2003-04-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-04-17 | 2006-10-17 | 2007-04-18 | $7700.00 | Window Closed / Lapsed |