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US5444475A Expired / Lapsed US ⏱️ 0.0 years remaining

Thermal recording head

Assignee: Ricoh Printing Systems Ltd
•
Filing: 1993-07-06
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Granted: 1995-08-22
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Expires: 2013-07-06
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Abstract

Abstract A thin-film thermal recording head, used in a facsimile machine or a thermal printer, including heat resistors formed from only a Cr-Si-SiO or Ta-Si-SiO alloy thin-film resistor layer and a chromium, molybdenum, nickel, or tungsten thin-film conductor layer. The heat resistor is formed on a substrate having a linear thermal expansion coefficient from room temperature to 300 DEG C. of 5x10-8/ DEG C. or less. The heat resistor is also described having a thin anti- abrasion layer with thickness of 0.5 mu m or less. The thin-film thermal recording head is also described in monolithic form with a portion of the heat resistor formed to directly contact an output electrode of a drive LSI circuit. In this case, a double-layer thermal-insulation layer can be formed between the substrate and the portion of the heat resistor that contacts and heats heat-sensitive recording paper. The two layers of the thermal-insulation layer are formed from a heat-resistant resin and an inorganic insulator.

Inventors

  • 👤 Masao Mitani

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-06 22:25
CPC Classifications
B; B41; B41J; B41J2/00; B41J2/315; B41J2/32; B41J2/335; B41J2/33505; B41J2/33515; B41J2/3353; B41J2/33535; B41J2/3355; B41J2/33555; B41J2/3357; B41J2/3358

Claims Analysis

Total Claims: 3
Claim 1
Independent Claim 349 words
A thermal recording head for a printer for thermally recording characters on a heat-sensitive recording medium, comprising: a heatsink with a connector attached thereto, the connector containing a plurality of signal lines; a substrate provided on the heatsink; driving means provided on the substrate, the driving means being connected to the connector by one connection for each of the plurality of signal lines, the driving means generating a pulsed electric current and outputting the pulsed electric current at a collector electrode; a heat-resistant resin layer provided on the substrate a distance from the collector electrode, the heat-resistant resin layer having a surface facing opposite the substrate defining an elevated area: an inorganic thermal insulation layer made from a material with a linear thermal expansion coefficient of less than 5×10 -6 °/C. from 20° to 300 ° C., the inorganic thermal insulation layer covering at least the elevated area of the heat-resistant resin layer and the distance to the collector electrode, a combined thickness of the heat-resistant resin layer and the inorganic thermal insulation layer being thicker at the elevated area than at the collector electrode; a thin-film resistor layer provided to the inorganic insulation layer, the thin-film resistor layer being a thin-film layer that is 500 to 1,000 Å thick and made from a material selected from a group consisting of a Cr--Si--SiO alloy and a Ta--Si--SiO alloy, the thin-film resistor layer having a heating portion substantially at the elevated area, the thin-film resistor layer being in direct contact with the collector electrode, the thin-film resistor layer being energized by the pulsed electric current, the heating portion heating in pulses according to the pulsed electric current; a first conductor layer provided to the thin-film resistor layer except at the heating portion, the first conductor layer serving as a conductor for supplying the pulsed electric current to the thin-film resistor layer; and an anti-abrasion layer provided 1 μm or less thick to the heating portion for forming direct abutment contact with the heat-sensitive recording medium and transmitting the pulsed heat from the heating portion thereto for forming an image thereon.
Claim 2
Dependent Claim 349 words
A thermal recording head for a printer for thermally recording characters on a heat-sensitive recording medium, comprising: a heatsink with a connector attached thereto, the connector containing a plurality of signal lines; a substrate provided on the heatsink; driving means provided on the substrate, the driving means being connected to the connector by one connection for each of the plurality of signal lines, the driving means generating a pulsed electric current and outputting the pulsed electric current at a collector electrode; a heat-resistant resin layer provided on the substrate a distance from the collector electrode, the heat-resistant resin layer having a surface facing opposite the substrate defining an elevated area: an inorganic thermal insulation layer made from a material with a linear thermal expansion coefficient of less than 5×10 -6 °/C. from 20° to 300 ° C., the inorganic thermal insulation layer covering at least the elevated area of the heat-resistant resin layer and the distance to the collector electrode, a combined thickness of the heat-resistant resin layer and the inorganic thermal insulation layer being thicker at the elevated area than at the collector electrode; a thin-film resistor layer provided to the inorganic insulation layer, the thin-film resistor layer being a thin-film layer that is 500 to 1,000 Å thick and made from a material selected from a group consisting of a Cr--Si--SiO alloy and a Ta--Si--SiO alloy, the thin-film resistor layer having a heating portion substantially at the elevated area, the thin-film resistor layer being in direct contact with the collector electrode, the thin-film resistor layer being energized by the pulsed electric current, the heating portion heating in pulses according to the pulsed electric current; a first conductor layer provided to the thin-film resistor layer except at the heating portion, the first conductor layer serving as a conductor for supplying the pulsed electric current to the thin-film resistor layer; and an anti-abrasion layer provided 1 μm or less thick to the heating portion for forming direct abutment contact with the heat-sensitive recording medium and transmitting the pulsed heat from the heating portion thereto for forming an image thereon.
Claim 3
Dependent Claim 22 words
The thermal head as claimed in claim 1, wherein the heatsink is 4 mm wide and made from a Fe-42% Ni alloy.

References Cited (Backward Citations)

JPS56164876A Cited
JPS5761582A Cited
JPS6112357A Cited
US4680593A Cited
JPS61290067A Cited
US4868584A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1998-08-21 1999-02-20 1999-08-22 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2002-08-21 2003-02-20 2003-08-22 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2006-08-21 2007-02-20 2007-08-22 $7700.00 Window Closed / Lapsed

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