US5455195A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for obtaining metallurgical stability in integrated circuit conductive bonds
Assignee: Texas Instruments Inc
•
Filing: 1994-05-06
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Granted: 1995-10-03
•
Expires: 2014-05-06
Abstract
Abstract A method for electrically connecting integrated circuit copper-gold ball bond that connect a bond wire (18) with a bond pad (14) forms a palladium layer (16) in the electrical connection between the bond wire (18) and the bond pad (14). The connection avoids excessive stresses that arise from intermetallic formations between the bond wire (18) and the bond pad (14).
Inventors
- 👤 Thomas H. Ramsey
- 👤 Rafael C. Alfaro
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 14:11
CPC Classifications
B; B23; B23K; B23K20/00; B23K20/002; B23K20/004; B23K20/005; B23K20/007; H; H10; H10W; H10W72/00; H10W72/01; H10W72/019; H10W72/015; H10W72/01551; H10W72/071; H10W72/075; H10W72/07551; H10W72/07555; H10W72/50; H10W72/531; H10W72/536; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/5525; H10W72/5528; H10W72/59; H10W72/90; H10W72/921; H10W72/923; H10W72/951; H10W72/952; Y; Y10; Y10S; Y10S228/00; Y10S228/904
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
47 words
A method for electrically associating a ball bond wire with an aluminum pad, comprising the steps of: forming a palladium layer on an aluminum bond pad; and connecting the aluminum ball bond wire with the palladium layer to electrically connect the bond pad with the bond wire.
Claim 2
Independent Claim
47 words
A method for electrically associating a ball bond wire with an aluminum pad, comprising the steps of: forming a palladium layer on an aluminum bond pad; and connecting the aluminum ball bond wire with the palladium layer to electrically connect the bond pad with the bond wire.
Claim 3
Dependent Claim
23 words
The method of claim 1, further comprising the step of forming the palladium layer to a thickness of between 1000 and 5000 Å.
Claim 4
Dependent Claim
36 words
The method of claim 1, wherein said connecting step comprises the step of connecting a gold ball bond wire with the palladium layer to electrically connect a gold ball bond wire to the aluminum bond pad.
Claim 5
Dependent Claim
40 words
The method of claim 1, wherein said connecting step comprises the step of connecting a copper ball bond wire with the palladium layer to form an electrical connection between the top of ball bond wire and the aluminum bond pad.
Claim 6
Independent Claim
48 words
A method for electrically associating a ball bond wire with an aluminum bond pad, comprising the steps of: forming a chromium layer on an aluminum bond pad; and connecting the aluminum ball bond wire with the chromium to electrically connect the bond pad with the ball bond wire.
Claim 7
Independent Claim
48 words
A method for electrically associating a ball bond wire with an aluminum bond pad, comprising the steps of: forming a chromium layer on an aluminum bond pad; and connecting the aluminum ball bond wire with the chromium to electrically connect the bond pad with the ball bond wire.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-10-02 | 1999-04-03 | 1999-10-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-10-02 | 2003-04-03 | 2003-10-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-10-02 | 2007-04-03 | 2007-10-03 | $7700.00 | Window Closed / Lapsed |