US5476818A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor structure and method of manufacture
Assignee: Motorola Solutions Inc
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Filing: 1994-08-19
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Granted: 1995-12-19
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Expires: 2014-08-19
Abstract
Abstract A semiconductor structure (8) comprising a semiconductor chip support structure (9), a circuit board substrate (40) with circuit board substrate probes (36) extending therefrom and a method for fabricating the semiconductor structure (8). The semiconductor chip support structure (9) includes, for example, clips (43, 53) to replaceably mount semiconductor chips (47, 48) to the semiconductor chip support structure (9). The circuit board substrate (40) is mated with the semiconductor chip support structure (9) so that the circuit board substrate probes (36) contact bonding pads (49) on the semiconductor chips (47, 48). If a semiconductor chip (47, 48) becomes damaged, the circuit board substrate (40) may be separated from the semiconductor chip support structure (9) and the damaged semiconductor chip (47, 48) replaced with a good semiconductor chip (47, 48).
Inventors
- 👤 Arnold W. Yanof
- 👤 William Dauksher
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 13:57
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/20; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/153; H10W78/00; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W70/654; H10W70/656; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/251; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49146
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
102 words
A method for manufacturing a semiconductor module, comprising the steps of: providing a semiconductor chip support having a circuit board substrate mount; providing a circuit board substrate having at least one probe extending therefrom; replaceably mounting at least one semiconductor chip to the semiconductor chip support, wherein solder is absent between the at least one semiconductor chip and the semiconductor chip support and the at least one semiconductor chip has at least one conductive pad disposed thereon; mating the at least one probe to the at least one conductive pad; and securing the circuit board substrate to the circuit board substrate mount.
Claim 2
Independent Claim
102 words
A method for manufacturing a semiconductor module, comprising the steps of: providing a semiconductor chip support having a circuit board substrate mount; providing a circuit board substrate having at least one probe extending therefrom; replaceably mounting at least one semiconductor chip to the semiconductor chip support, wherein solder is absent between the at least one semiconductor chip and the semiconductor chip support and the at least one semiconductor chip has at least one conductive pad disposed thereon; mating the at least one probe to the at least one conductive pad; and securing the circuit board substrate to the circuit board substrate mount.
Claim 3
Dependent Claim
115 words
The method of claim 1, wherein the step of providing a circuit board substrate comprises the steps of: providing a support structure having a first surface and at least one contact pad; forming a first layer of resist over the first surface and the at least one contact pad; forming at least one opening through the first layer of resist, the at least one opening having a longitudinal axis that makes an acute angle with the first surface; filling the at least one opening with a conductive material; and removing at least a portion of the first layer of resist adjacent the conductive material, wherein the conductive material serves as the at least one probe.
Claim 4
Dependent Claim
53 words
The method of claim 1, wherein the step of providing a semiconductor chip support includes providing the semiconductor chip support having a major surface and at least one recess extending from the major surface into the semiconductor chip support, the at least one recess adapted to accept the at least one semiconductor chip.
Claim 5
Dependent Claim
146 words
The method of claim 3, wherein the step of providing a semiconductor chip support includes providing the semiconductor chip support having at least one recess, wherein the at least one recess has lateral boundaries corresponding to lateral boundaries of the at least one semiconductor chip and an area of the at least one recess is less than an area of the at least one semiconductor chip and the step of replaceably mounting at least one semiconductor chip to the semiconductor chip support further comprises the steps of: expanding the at least one recess to have an area greater than the area of the at least one semiconductor chip; placing the at least one semiconductor chip in the at least one recess; and contracting the at least one recess, wherein the lateral boundaries of the at least one chip contact the lateral boundaries of the semiconductor chip.
Claim 6
Dependent Claim
29 words
The method of claim 4, wherein the step of providing the semiconductor chip support having at least one recess includes providing the at least one recess having a floor.
Claim 7
Dependent Claim
39 words
The method of claim 4, wherein the step of expanding the at least one recess includes heating the at least one recess and the step of contracting the at least one recess includes cooling the at least one recess.
Claim 8
Dependent Claim
35 words
The method of claim 1, wherein the step of providing a semiconductor chip support includes providing the semiconductor chip support comprising an adhesive film, wherein a first side of the adhesive film contacts a substrate.
Claim 9
Dependent Claim
40 words
The method of claim 7, wherein the step of replaceably mounting at least one semiconductor chip to the semiconductor chip support includes placing the at least one semiconductor chip on a portion of a second side of the adhesive film.
Claim 10
Dependent Claim
111 words
The method of claim 1, further including the step of replacing the at least one semiconductor chip by separating the circuit board substrate from the circuit board substrate mount; removing the at least one semiconductor chip from the semiconductor chip support; replaceably mounting another semiconductor chip to the semiconductor chip support, wherein solder is absent between the at least one semiconductor chip and the semiconductor chip support and the another semiconductor chip has at least one conductive pad disposed thereon; mating the at least one probe to the at least one conductive pad disposed on the another semiconductor chip; and securing the circuit board substrate to the circuit board substrate mount.
Claim 11
Dependent Claim
50 words
The method of claim 1, wherein the step of providing a semiconductor chip support includes providing the semiconductor chip support having a clip and the step of replaceably mounting at least one semiconductor chip to the semiconductor chip support includes mating the at least one semiconductor support with the clip.
Claim 12
Independent Claim
190 words
A method for manufacturing a semiconductor structure, comprising the steps of: providing a circuit board substrate, the steps for forming the circuit board substrate comprising: providing a support structure having a first surface and at least one contact pad; forming a first layer of resist over the first surface and the at least one contact pad; forming at least one opening through the first layer of resist, the at least one opening having a longitudinal axis that makes an acute angle with the first surface; filling the at least one opening with a conductive material; and removing at least a portion of the first layer of resist adjacent the conductive material, wherein the conductive material serves as a probe and the support structure serves as the circuit board substrate; providing a semiconductor chip support structure; replaceably mounting a semiconductor chip to the semiconductor chip support structure, wherein solder is absent between the at least one semiconductor chip and the semiconductor chip support and the semiconductor chip has a bonding pad on a surface; and mating the circuit board substrate to the support structure, wherein the probe contacts the bonding pad.
Claim 13
Independent Claim
190 words
A method for manufacturing a semiconductor structure, comprising the steps of: providing a circuit board substrate, the steps for forming the circuit board substrate comprising: providing a support structure having a first surface and at least one contact pad; forming a first layer of resist over the first surface and the at least one contact pad; forming at least one opening through the first layer of resist, the at least one opening having a longitudinal axis that makes an acute angle with the first surface; filling the at least one opening with a conductive material; and removing at least a portion of the first layer of resist adjacent the conductive material, wherein the conductive material serves as a probe and the support structure serves as the circuit board substrate; providing a semiconductor chip support structure; replaceably mounting a semiconductor chip to the semiconductor chip support structure, wherein solder is absent between the at least one semiconductor chip and the semiconductor chip support and the semiconductor chip has a bonding pad on a surface; and mating the circuit board substrate to the support structure, wherein the probe contacts the bonding pad.
Claim 14
Dependent Claim
146 words
The method of claim 11, wherein the step of providing a circuit board substrate further comprises the steps of forming at least one opening through the first layer of resist and filling the at least one opening with a conductive material comprise the steps of: exposing a portion of the first layer of resist with radiation; removing the exposed portion of the first layer of resist to form a first opening; filling the first opening with a first conductive material; forming a second layer of resist on the first layer of resist and the conductive material; exposing a portion of the second layer of resist, wherein the portion of the second layer of resist overlaps an edge of the conductive material; removing the exposed portion of the second layer of resist to form a second opening; and filling the second opening with a second conductive material.
Claim 15
Dependent Claim
70 words
The method of claim 11, wherein the step of providing a semiconductor chip support structure includes providing the semiconductor chip support structure having a recess and the step of replaceably mounting a semiconductor chip to the semiconductor chip support structure comprises the steps of: expanding the recess; placing the semiconductor chip in the expanded recess; and contracting the recess, wherein edges of the recess grip edges of the semiconductor chip.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-12-18 | 1999-06-19 | 1999-12-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-12-18 | 2003-06-19 | 2003-12-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-12-18 | 2007-06-19 | 2007-12-19 | $7700.00 | Window Closed / Lapsed |