US5477084A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Microelectronic device packaging containing a liquid and method
Assignee: Apple Inc
•
Filing: 1995-01-03
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Granted: 1995-12-19
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Expires: 2015-01-03
Abstract
Abstract A method for manufacturing a liquid-containing microelectronic device package. The method includes steps of providing (32) a base (16) including a microelectronic device (22) and a seal area disposed peripherally about the base (16), providing (34) a lid (12) and providing (34) a sealant (14) disposed between the base (16) and lid (12). The method also includes steps of immersing (36) the base (16), sealant (14) and lid (12) in a liquid (24) having a temperature above a sealant activation temperature and maintaining (38) the base (16), sealant (14) and lid (12) in the liquid (24) for a time sufficient to allow the liquid (24) to enter between the base (16) and lid (12) and to heat and thereby activate the sealant (14). The method further includes removing (40) the base (16), lid (12) and sealant (14) from the liquid (24) to provide a sealed, liquid-containing microelectronic device package (10).
Inventors
- 👤 Brian A. Webb
- 👤 Robert M. Wentworth
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 19:46
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/40; H10W76/42; H10W76/45; H10W40/00; H10W40/70; H10W76/01; H10W76/05; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49146
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
80 words
A microelectronic device package containing a liquid, including in combination: a base; a microelectronic device mounted on the base; a lid to cover the microelectronic device; a sealant disposed between the base and the lid, the sealant securing the lid to the base to form a hollow, sealed cavity therebetween, the sealant having an activation temperature; and a liquid disposed in the sealed cavity, the liquid comprising a mixture of perfluorocarbons having a boiling point which exceeds the activation temperature.
Claim 2
Dependent Claim
80 words
A microelectronic device package containing a liquid, including in combination: a base; a microelectronic device mounted on the base; a lid to cover the microelectronic device; a sealant disposed between the base and the lid, the sealant securing the lid to the base to form a hollow, sealed cavity therebetween, the sealant having an activation temperature; and a liquid disposed in the sealed cavity, the liquid comprising a mixture of perfluorocarbons having a boiling point which exceeds the activation temperature.
Claim 3
Dependent Claim
33 words
A device package as claimed in claim 1, wherein the sealant comprises a thermally-activated epoxy compound having an activation temperature comprising a setting temperature which is below the boiling point of the liquid.
Claim 4
Dependent Claim
12 words
A device as claimed in claim 1, wherein the base comprises alumina.
Claim 5
Dependent Claim
28 words
A device as claimed in claim 1, wherein the liquid comprises a mixture of perfluorocarbons having a boiling point of more than one hundred twenty five degrees Celsius.
Claim 6
Dependent Claim
38 words
A device as claimed in claim 1, wherein the lid comprises a stamped metal lid having a dimple extending upward from the base, the dimple for providing a pocket of gas having a predetermined volume above the liquid.
Claim 7
Dependent Claim
15 words
A device as claimed in claim 1, wherein the lid comprises a stamped metal lid.
Claim 8
Dependent Claim
38 words
A device as claimed in claim 1, wherein the lid includes the sealant disposed about a periphery of the lid, the sealant comprising a thermally-activated epoxy compound having a setting temperature below the boiling point of the liquid.
Claim 9
Dependent Claim
27 words
A device as claimed in claim 1 wherein the sealant comprises a low temperature solder having a melting point, wherein the activation temperature equals the melting point.
Claim 10
Dependent Claim
26 words
A device as claimed in claim 1 wherein the sealant comprises a thermoplastic material having a melting point, wherein the activation temperature equals the melting point.
Claim 11
Dependent Claim
16 words
A device as claimed in claim 1 wherein the liquid only partially fills the sealed cavity.
Claim 12
Dependent Claim
70 words
A liquid-filled semiconductor device package comprising: a base having a semiconductor device mounted on one surface; a lid covering the semiconductor device; a sealing layer securing the lid to the base to form a sealed cavity surrounding the semiconductor device, the sealing layer having an activation temperature; and a dielectric liquid at least covering the semiconductor device, the dielectric liquid having a boiling point in excess of the activation temperature.
Claim 13
Dependent Claim
70 words
A liquid-filled semiconductor device package comprising: a base having a semiconductor device mounted on one surface; a lid covering the semiconductor device; a sealing layer securing the lid to the base to form a sealed cavity surrounding the semiconductor device, the sealing layer having an activation temperature; and a dielectric liquid at least covering the semiconductor device, the dielectric liquid having a boiling point in excess of the activation temperature.
Claim 14
Dependent Claim
16 words
A device package as claimed in claim 11 wherein the sealing layer comprises a thermosetting material.
Claim 15
Dependent Claim
19 words
A device package as claimed in claim 11 wherein the dielectric liquid comprises a mixture of perfluorinated carbon compounds.
Claim 16
Dependent Claim
28 words
A device package as claimed in claim 13 wherein the dielectric liquid comprises a mixture of perfluorinated carbon compounds having between five and eighteen carbon atoms per molecule.
Claim 17
Dependent Claim
14 words
A device package as claimed in claim 11 wherein the lid comprises a ceramic.
Claim 18
Dependent Claim
39 words
A device package as claimed in claim 11 wherein the lid comprises a stamped metal lid having a dimple extending away from the base, the dimple providing a pocket of gas having a predetermined volume above the dielectric liquid.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-12-18 | 1999-06-19 | 1999-12-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-12-18 | 2003-06-19 | 2003-12-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-12-18 | 2007-06-19 | 2007-12-19 | $7700.00 | Window Closed / Lapsed |