US5525205A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for forming circuit with laser
Assignee: Polyplastics Co Ltd
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Filing: 1994-08-19
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Granted: 1996-06-11
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Expires: 2014-08-19
Abstract
Abstract A process for forming an electrical circuit component includes forming an initial metal layer on a surface of a synthetic plastics substrate, and irradiating the initial metal layer with laser light along a closed path so as to remove the initial metal layer therealong. The closed path irradiated by the laser light thereby establishes an insulating region covered by a first portion of the initial metal layer which is bounded by the closed path, and a conducting region covered by a second portion of the initial metal layer which surrounds the closed path and the insulating region established thereby. A further metal layer is then formed over the second portion of the initial metal layer of the conducting region. The first portion of the initial metal layer of the insulating region may thus be removed to thereby expose a corresponding surface portion of the synthetic plastics substrate.
Inventors
- 👤 Takayuki Miyashita
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 20:46
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/108; H05K3/02; H05K3/027; H05K1/00; H05K1/02; H05K1/0284; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09118; H05K2201/09209; H05K2201/0929; H05K2201/09363; H05K2203/00; H05K2203/10; H05K2203/107; H05K2203/13; H05K2203/1333; H05K2203/135; H05K3/18; H05K3/181; H05K3/22; H05K3/24; H05K3/241; H05K3/38; H05K3/388; Y; Y10; Y10S; Y10S205/00; Y10S205/917; Y10S205/918
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
143 words
A process for forming an electrical circuit component comprising the steps of: (a) forming an initial metal layer on a surface of a synthetic plastics substrate; (b) irradiating the initial metal layer with laser light along a closed path so as to remove the initial metal layer therealong and establish (i) an insulating region covered by a first portion of said initial metal layer which is bounded by said closed path, and (ii) a conducting region covered by a second portion of said initial metal layer which surrounds said closed path and said insulating region established thereby; (c) electroplating a further metal layer over said second portion of said initial metal layer of said conducting region; and (d) removing said first portion of said initial metal layer of said insulating region to thereby expose a corresponding surface portion of said synthetic plastics substrate.
Claim 2
Dependent Claim
143 words
A process for forming an electrical circuit component comprising the steps of: (a) forming an initial metal layer on a surface of a synthetic plastics substrate; (b) irradiating the initial metal layer with laser light along a closed path so as to remove the initial metal layer therealong and establish (i) an insulating region covered by a first portion of said initial metal layer which is bounded by said closed path, and (ii) a conducting region covered by a second portion of said initial metal layer which surrounds said closed path and said insulating region established thereby; (c) electroplating a further metal layer over said second portion of said initial metal layer of said conducting region; and (d) removing said first portion of said initial metal layer of said insulating region to thereby expose a corresponding surface portion of said synthetic plastics substrate.
Claim 3
Dependent Claim
24 words
The process of claim 1, wherein step (a) is practiced to form said initial metal layer having a thickness from 0.2 to 2 μm.
Claim 4
Dependent Claim
24 words
The process of claim 1, wherein step (a) is practiced to form said initial metal layer having a thickness from 0.3 to 1 μm.
Claim 5
Dependent Claim
67 words
The process of claim 1, wherein step (d) includes the sequential steps of: coating the further metal layer formed over said second portion of said initial metal layer with a resist material; etching said first portion of said initial metal layer so as to remove said first portion of said initial metal layer from said insulating region, and removing the resist material from the further metal layer.
Claim 6
Dependent Claim
25 words
The process of claim 1, wherein the surface of the synthetic plastics substrate on which the initial metal layer is formed has three-dimensional surface contours.
Claim 7
Dependent Claim
29 words
The process of claim 1, wherein the initial metal layer is formed on the surface of the synthetic plastics substrate by electroless plating, sputtering, vacuum evaporation or ion plating.
Claim 8
Dependent Claim
34 words
The process of claim 1 or 2, wherein said second portion of said initial metal layer and said further metal layer on said conductive region collectively have a thickness from 10 to 100 μm.
Claim 9
Dependent Claim
13 words
The process of claim 1, wherein step (d) is practiced after step (c).
References Cited (Backward Citations)
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JPS6483391A
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Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-06-11 | 1999-12-11 | 2000-06-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-06-11 | 2003-12-11 | 2004-06-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-06-11 | 2007-12-11 | 2008-06-11 | $7700.00 | Window Closed / Lapsed |