US5554065A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Vertically stacked planarization machine
Assignee: Individual
•
Filing: 1995-06-07
•
Granted: 1996-09-10
•
Expires: 2015-06-07
Abstract
Abstract A vertically stacked planarization machine includes two or more vertically stacked individual platens on which wafers are polished. The wafers are held by wafer holders which may rotate the wafers. The individual platens are also orbited in order to polish the wafers. The platens may have a top and bottom polishing pad for polishing multiple wafers. A single wafer holder, using hydraulic or pneumatic means, between two platens will hold and exert pressure on both a downward wafer and an upward wafer. The pressure exerted onto the top and bottom wafers by the dual wafer holder is designed to be equal to prevent any bowing of the platen. The platens are supported by three vertical members positioned at 120 degree intervals around the circumference of the platens to form a platen stack. Transport elevators are used to carry the wafers to and from the wafer holders and the platens. A polishing pad conditioner is also transported to the polishing pads within the stack periodically by use of a transport elevator in order to unglaze the polishing pad. In order to increase capacity, a single polishing machine may include more than one vertical stack of platens. A cam contains the stack and will drive the stack, during polishing, into an orbital motion. Each of the components of the stack is detachable for servicing and repair. A stack, in its entirety, may also be removed from the polishing machine for servicing.
Inventors
- 👤 Richmond B. Clover
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 03:24
CPC Classifications
B; B24; B24B; B24B53/00; B24B53/017; B24B27/00; B24B27/0023; B24B37/00; B24B37/04
Claims Analysis
Total Claims: 32
Claim 1
Independent Claim
70 words
A vertically stacked planarization machine for polishing wafers including: a. a plurality of vertically stacked platens coupled together, thereby forming a platen stack, each vertically stacked platen including a polishing surface; b. means for orbiting the platen stack coupled to each of the vertically stacked platens within the platen stack; and c. means for holding a wafer in contact with the polishing surface of one of the vertically stacked platens.
Claim 2
Dependent Claim
70 words
A vertically stacked planarization machine for polishing wafers including: a. a plurality of vertically stacked platens coupled together, thereby forming a platen stack, each vertically stacked platen including a polishing surface; b. means for orbiting the platen stack coupled to each of the vertically stacked platens within the platen stack; and c. means for holding a wafer in contact with the polishing surface of one of the vertically stacked platens.
Claim 3
Dependent Claim
25 words
The vertically stacked planarization machine as claimed in claim 1 further comprising a means for transporting the wafer to and from the means for holding.
Claim 4
Dependent Claim
24 words
The vertically stacked planarization machine as claimed in claim 2 further comprising a means for conditioning the polishing surface of the vertically stacked platen.
Claim 5
Dependent Claim
29 words
The vertically stacked planarization machine as claimed in claim 2 wherein the means for orbiting the platen stack includes a cam having a motor for driving the platen stack.
Claim 6
Dependent Claim
29 words
The vertically stacked planarization machine as claimed in claim 2 wherein a wafer is transported by the means for transporting from a wafer cassette to the means for holding.
Claim 7
Dependent Claim
23 words
The vertically stacked planarization machine as claimed in claim 5 wherein the means for holding is removable from inside the vertically stacked platens.
Claim 8
Dependent Claim
31 words
The vertically stacked planarization machine as claimed in claim 6 wherein the means for transporting utilizes air and vacuum pressure to move the wafer to and from the means for holding.
Claim 9
Dependent Claim
36 words
The vertically stacked planarization machine as claimed in claim 1 wherein the means for holding comprises a wafer holder for holding the wafer in contact with the polishing surface of one of the vertically stacked platens.
Claim 10
Dependent Claim
29 words
The vertically stacked planarization machine as claimed in claim 8 wherein at least one of the vertically stacked platens includes a top polishing surface and a bottom polishing surface.
Claim 11
Dependent Claim
47 words
The vertically stacked planarization machine as claimed in claim 9 wherein the means for holding comprises a dual wafer holder for holding a top wafer against a top polishing surface of a first platen and a bottom wafer against a bottom polishing surface of a second platen.
Claim 12
Dependent Claim
26 words
The vertically stacked planarization machine as claimed in claim 10 wherein the dual wafer holder exerts equal pressure on the top wafer and the bottom wafer.
Claim 13
Dependent Claim
28 words
The vertically stacked planarization machine as claimed in claim 8 wherein the wafer holder further comprises hydraulic means for holding the wafer in contact with the polishing surface.
Claim 14
Dependent Claim
28 words
The vertically stacked planarization machine as claimed in claim 8 wherein the wafer holder further comprises pneumatic means for holding the wafer in contact with the polishing surface.
Claim 15
Dependent Claim
21 words
The vertically stacked planarization machine as claimed in claim 8 wherein the wafer holder further comprises means for rotating the wafer.
Claim 16
Dependent Claim
24 words
The vertically stacked planarization machine as claimed in claim 14 wherein the means for rotating the wafer provides a continuous rotation to the wafer.
Claim 17
Dependent Claim
22 words
The vertically stacked planarization machine as claimed in claim 14 wherein the means for rotating provides a stepped rotation to the wafer.
Claim 18
Dependent Claim
92 words
A polishing machine for polishing wafers comprising: a. a plurality of platen stacks each configured for stackably coupling to another one of the platen stacks and each including: i. a plurality of vertically stacked platens coupled together, each stacked platen including a polishing surface; and ii. means for orbiting the platen stack coupled to each of the vertically stacked platens; b. means for holding a wafer in contact with a polishing surface of one of the vertically stacked platens; and c. means for transporting wafers to and from the means for holding.
Claim 19
Dependent Claim
92 words
A polishing machine for polishing wafers comprising: a. a plurality of platen stacks each configured for stackably coupling to another one of the platen stacks and each including: i. a plurality of vertically stacked platens coupled together, each stacked platen including a polishing surface; and ii. means for orbiting the platen stack coupled to each of the vertically stacked platens; b. means for holding a wafer in contact with a polishing surface of one of the vertically stacked platens; and c. means for transporting wafers to and from the means for holding.
Claim 20
Dependent Claim
39 words
The polishing machine as claimed in claim 17 further comprising an outer housing for covering and protecting the platen stacks wherein the outer housing includes an opening through which wafers are passed to and from the means for transporting.
Claim 21
Dependent Claim
20 words
The polishing machine as claimed in claim 18 wherein each of the platen stacks is removable from the polishing machine.
Claim 22
Dependent Claim
27 words
The polishing machine as claimed in claim 17 wherein the means for orbiting the platen stack includes a cam having a motor for driving the platen stack.
Claim 23
Dependent Claim
52 words
The polishing machine as claimed in claim 17 wherein the means for orbiting for a predetermined number of the platen stacks will orbit the platen stacks in a clockwise direction and the means for orbiting for a remainder of the platen stacks will orbit the platen stacks in a counter clockwise direction.
Claim 24
Dependent Claim
28 words
The polishing machine as claimed in claim 17 further comprising a means for conditioning the polishing surface of the vertically stacked platens of each of the platen stacks.
Claim 25
Dependent Claim
34 words
The polishing machine as claimed in claim 17 wherein the means for holding comprises a wafer holder for holding the wafer in contact with the polishing surface of one of the vertically stacked platens.
Claim 26
Dependent Claim
26 words
The polishing machine as claimed in claim 23 wherein the wafer holder further comprises hydraulic means for holding the wafer in contact with the polishing surface.
Claim 27
Dependent Claim
26 words
The polishing machine as claimed in claim 23 wherein the wafer holder further comprises pneumatic means for holding the wafer in contact with the polishing surface.
Claim 28
Dependent Claim
19 words
The polishing machine as claimed in claim 23 wherein the wafer holder further comprises means for rotating the wafer.
Claim 29
Dependent Claim
27 words
The polishing machine as claimed in claim 17 wherein at least one of the vertically stacked platens includes a top polishing surface and a bottom polishing surface.
Claim 30
Dependent Claim
45 words
The polishing machine as claimed in claim 27 wherein the means for holding comprises a dual wafer holder for holding the top wafer against the top polishing surface of a first platen and a bottom wafer against the bottom polishing surface of a second platen.
Claim 31
Dependent Claim
24 words
The polishing machine as claimed in claim 28 wherein the dual wafer holder exerts equal pressure on the top wafer and the bottom wafer.
Claim 32
Dependent Claim
29 words
The polishing machine as claimed in claim 17 wherein the means for transporting utilizes air and vacuum pressure to move the wafer to and from the means for holding.
References Cited (Backward Citations)
US4481741A
Cited
US5240557A
Cited
US5329732A
Cited
US5216843A
Cited
US5232875A
Cited
US5435772A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-09-10 | 2000-03-11 | 2000-09-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-09-10 | 2004-03-11 | 2004-09-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-09-10 | 2008-03-11 | 2008-09-10 | $7700.00 | Window Closed / Lapsed |