← Back to Patent Explorer
US5557504A Expired / Lapsed US ⏱️ 0.0 years remaining

Surface mountable integrated circuit package with detachable module

Assignee: STMicroelectronics lnc USA
•
Filing: 1995-06-21
•
Granted: 1996-09-17
•
Expires: 2015-06-21
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract A molded integrated circuit package system of the type suitable for surface mounting is disclosed. The system includes a chip package having leads along its sides that are of the surface-mountable type, and having a plurality of connectors at its ends. A module is provided which contains components that are sensitive to solder temperatures or the chemicals used in the soldering process; examples of such components include batteries and quartz crystal resonators. The module has connectors extending therefrom that mate with the connectors on the chip package, such that the module may be removably connected to the chip package after the surface mounting of the chip package to a circuit board. Mechanical connection may be provided by snap members extending from the module which engage surfaces of the chip package when mounted thereto. Lockout tabs are provided on the chip package and the module to prevent improper mounting and electrical connection.

Inventors

  • 👤 Harry M. Siegel
  • 👤 Michael J. Hundt
  • 👤 Krishnan Kelappan

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 13:14
CPC Classifications
H; H10; H10W; H10W42/00; H01; H01M; H01M50/00; H01M50/20; H01M50/204; H01M50/207; H01M50/216; H05; H05K; H05K7/00; H05K7/02; H05K7/023; H05K7/10; H05K7/1092; Y; Y02; Y02E; Y02E60/00; Y02E60/10

Claims Analysis

Total Claims: 24
Claim 1
Independent Claim 113 words
A system for packaging integrated circuit components, comprising: a chip package, comprising: a body containing a semiconductor device; a plurality of leads extending from said body, said leads in electrical connection with the semiconductor device, and of the type suitable for surface mounting to a circuit board; and first and second terminals in electrical connection with the semiconductor device, and extending from said body; and a component module disposed over said chip package, comprising: an auxiliary body containing an auxiliary component; and first and second connectors in electrical connection with the auxiliary component, and extending from said auxiliary body to electrically connect with said first and second terminals, respectively, of said chip package.
Claim 2
Independent Claim 113 words
A system for packaging integrated circuit components, comprising: a chip package, comprising: a body containing a semiconductor device; a plurality of leads extending from said body, said leads in electrical connection with the semiconductor device, and of the type suitable for surface mounting to a circuit board; and first and second terminals in electrical connection with the semiconductor device, and extending from said body; and a component module disposed over said chip package, comprising: an auxiliary body containing an auxiliary component; and first and second connectors in electrical connection with the auxiliary component, and extending from said auxiliary body to electrically connect with said first and second terminals, respectively, of said chip package.
Claim 3
Dependent Claim 15 words
The system of claim 1, wherein the body of said chip package comprises molded plastic.
Claim 4
Dependent Claim 12 words
The system of claim 1, wherein said auxiliary component comprises a battery.
Claim 5
Dependent Claim 65 words
The system of claim 1, wherein the body of said chip package comprises a lockout tab extending therefrom; and wherein the body of said component module comprises a lockout tab extending therefrom at a location corresponding to the lockout tab extending from body of said chip package if the first connector of the component module is mated with the second terminal of the chip package.
Claim 6
Dependent Claim 21 words
The system of claim 1, wherein said first and second connectors are removably mated with said first and second terminals, respectively.
Claim 7
Dependent Claim 23 words
The system of claim 1, wherein said first and second terminals are disposed at opposite ends of said chip package from one another.
Claim 8
Dependent Claim 36 words
The system of claim 1, wherein said first and second terminals each comprise: a conductive tab extending from a lead frame within the body of said chip package; and a connector mounted to said conductive tab.
Claim 9
Dependent Claim 35 words
The system of claim 1, wherein the body of said component module further comprises: a plurality of snap members extending from a bottom surface to mate with surfaces of the body of said chip package.
Claim 10
Dependent Claim 40 words
The system of claim 8, wherein the mating surfaces of said plurality of snap members and the body of said chip package cooperate with one another to produce an audible sound when said component module mates with said chip package.
Claim 11
Independent Claim 95 words
A system for packaging integrated circuit components, comprising: a chip package, comprising: a body containing a semiconductor device; a plurality of leads extending from said body, said leads in electrical connection therefrom, and of the type suitable for surface mounting to a circuit board; and first, second, third and fourth terminals extending from the body of said chip package; and a component module disposed over said chip package, comprising: a body containing an auxiliary component; and first, second, third and fourth connectors extending from said body and mating with said third and fourth terminals, respectively.
Claim 12
Independent Claim 95 words
A system for packaging integrated circuit components, comprising: a chip package, comprising: a body containing a semiconductor device; a plurality of leads extending from said body, said leads in electrical connection therefrom, and of the type suitable for surface mounting to a circuit board; and first, second, third and fourth terminals extending from the body of said chip package; and a component module disposed over said chip package, comprising: a body containing an auxiliary component; and first, second, third and fourth connectors extending from said body and mating with said third and fourth terminals, respectively.
Claim 13
Dependent Claim 38 words
The system of claim 10, wherein said auxiliary component is a battery, electrically connected to said first and second connectors; and wherein said component module also contains a crystal resonator electrically connected to said third and fourth connectors.
Claim 14
Dependent Claim 42 words
A component module adapted to be mounted to a chip package, comprising; an auxiliary component; a body housing said auxiliary component; and first and second connectors extending from said body, said first and second connectors in electrical connection with said auxiliary component.
Claim 15
Dependent Claim 42 words
A component module adapted to be mounted to a chip package, comprising; an auxiliary component; a body housing said auxiliary component; and first and second connectors extending from said body, said first and second connectors in electrical connection with said auxiliary component.
Claim 16
Dependent Claim 30 words
The component module of claim 12, further comprising: a plurality of snap members extending from said body, said snap members adapted to snap around the body of the chip package.
Claim 17
Dependent Claim 44 words
The component module of claim 12, wherein said body comprises: a base, having a location therein for receiving said auxiliary component, from which said first and second connectors extend; and a cover, disposed around said base, to provide mechanical protection for the auxiliary component.
Claim 18
Dependent Claim 38 words
The component module of claim 12, wherein said first auxiliary component is a battery; and further comprising: third and fourth connectors; and a crystal resonator disposed within said body in electrical connection with said third and fourth connectors.
Claim 19
Dependent Claim 44 words
The component module of claim 12, further comprising: a lockout tab extending from the bottom of said body at a first location; wherein said body does not have a second lockout tab at a second location symmetric to said first location about an axis.
Claim 20
Dependent Claim 111 words
A package for an integrated circuit, comprising: a molded body containing the integrated circuit; a plurality of leads extending from a plurality of sides of said molded body, said plurality of leads in electrical connection with the integrated circuit and of the surface-mountable type; and first and second conductive tabs, extending from said molded body, and in electrical connection with the integrated circuit, said first and second conductive tabs extending from a side of said molded body from which none of said plurality of leads extend, and adapted to receive a connector from the side of the body opposite that to which said plurality of leads extend for surface mount connection.
Claim 21
Dependent Claim 111 words
A package for an integrated circuit, comprising: a molded body containing the integrated circuit; a plurality of leads extending from a plurality of sides of said molded body, said plurality of leads in electrical connection with the integrated circuit and of the surface-mountable type; and first and second conductive tabs, extending from said molded body, and in electrical connection with the integrated circuit, said first and second conductive tabs extending from a side of said molded body from which none of said plurality of leads extend, and adapted to receive a connector from the side of the body opposite that to which said plurality of leads extend for surface mount connection.
Claim 22
Dependent Claim 30 words
The package of claim 17, wherein said plurality of leads are formed from a lead frame; and wherein said first and second conductive tabs are extensions of said lead frame.
Claim 23
Dependent Claim 73 words
The package of claim 17, further comprising: third and fourth conductive tabs, extending from said molded body, and in electrical connection with the integrated circuit, said third and fourth conductive tabs extending from a side of said molded body from which none of said plurality of leads extend, and adapted to receive a connector from the side of the body opposite that to which said plurality of leads extend for surface mount connection.
Claim 24
Dependent Claim 41 words
The package of claim 17, further comprising: a lockout tab extending from said molded body at a first location, said molded body having a second location symmetric about an axis from said first location at which no lockout tab is located.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1999-09-17 2000-03-18 2000-09-17 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2003-09-17 2004-03-18 2004-09-17 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2007-09-17 2008-03-18 2008-09-17 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag