US5569964A
Expired / Lapsed
US
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Semiconductor device
Assignee: Toshiba Corp
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Filing: 1994-12-23
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Granted: 1996-10-29
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Expires: 2014-12-23
Abstract
Abstract A semiconductor chip has a shape of a quadrangle. Bumps are arranged in a staggered fashion along at least one side of the semiconductor chip, and include first bumps and second bumps arranged inside the first bumps. If each of the first bumps has a maximum width Bw1 and each of the second bumps has a maximum width Bw2 in a direction parallel to at least one side of the semiconductor chip, Bw2>Bw1. If each of the first bumps has a maximum length Bd1 and each of the second bumps has a maximum length Bd2 in a direction perpendicular to at least one side of the semiconductor chip, Bd1>Bd2.
Inventors
- 👤 Kimihiro Ikebe
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 19:15
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/20; H10W70/00; H10W70/40; H10W70/453; H10W72/251
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
90 words
A semiconductor device comprising: a semiconductor chip having a plurality of linear sides; and bumps arranged in a staggered fashion along at least one side of said semiconductor chip, said bumps including first bumps and second bumps arranged inside the first bumps, each of said first bumps having a maximum width Bw1 in a direction parallel to said at least one side and each of said second bumps having a maximum width Bw2 in said parallel direction, all of the first and second bumps satisfying a condition in which Bw2>Bw1.
Claim 2
Dependent Claim
90 words
A semiconductor device comprising: a semiconductor chip having a plurality of linear sides; and bumps arranged in a staggered fashion along at least one side of said semiconductor chip, said bumps including first bumps and second bumps arranged inside the first bumps, each of said first bumps having a maximum width Bw1 in a direction parallel to said at least one side and each of said second bumps having a maximum width Bw2 in said parallel direction, all of the first and second bumps satisfying a condition in which Bw2>Bw1.
Claim 3
Dependent Claim
22 words
The semiconductor device according to claim 1, wherein said semiconductor chip has a shape of one of a square and a rectangle.
Claim 4
Dependent Claim
23 words
The semiconductor device according to claim 1, wherein said bumps are arranged in a staggered fashion along all sides of said semiconductor chip.
Claim 5
Dependent Claim
45 words
The semiconductor device according to claim 1, wherein each of said bumps has a shape of one of a square and a rectangle, and at least one side of each of said bumps is parallel to said at least one side of said semiconductor chip.
Claim 6
Dependent Claim
34 words
The semiconductor device according to claim 1, wherein each of said bumps has a shape of a pentagon having three right angles and being symmetrical on an axis intersecting one of the right angles.
Claim 7
Dependent Claim
56 words
The semiconductor device according to claim 1, wherein each of said first bumps has a maximum length Bd1 in a direction perpendicular to said at least one side and each of said second bumps has a maximum length Bd2 in said perpendicular direction, all of the first and second bumps satisfying a condition in which Bd1>Bd2.
Claim 8
Dependent Claim
14 words
The semiconductor device according to claim 1, wherein said bumps are formed by gold.
Claim 9
Dependent Claim
102 words
The semiconductor device according to claim 1, further comprising: an insulation tape having a quadrangular device hole; and leads formed on said insulation tape, one end of each of said leads extending into the device hole, said leads having long and short leads with respect to a distance between a predetermined side of the device hole and respective ends of said long and short leads, said long and short leads being arranged alternately, wherein said semiconductor chip is located within the device hole, said short leads are connected to the first bumps, and said long leads are connected to the second bumps.
Claim 10
Dependent Claim
21 words
The semiconductor device according to claim 8, wherein said device hole has a same shape as that of said semiconductor chip.
Claim 11
Dependent Claim
19 words
The semiconductor device according to claim 8, wherein said leads are arranged on said insulation tape at regular intervals.
Claim 12
Dependent Claim
32 words
The semiconductor device according to claim 8, wherein each of said leads has a width Lw, all of said leads satisfying a condition in which Lw<Bw1 and a condition in which Lw<Bw2.
Claim 13
Dependent Claim
21 words
The semiconductor device according to claim 8, wherein halfway points of adjacent leads are spaced by a distance Lp, and 2×Lp≦(Bw1+Bw2).
Claim 14
Dependent Claim
41 words
The semiconductor device according to claim 8, wherein, when said first bumps has a maximum length Bd1 and said second bumps has a maximum length Bd2 in the direction perpendicular to said at least one side of said semiconductor chip, Bd1>Bd2.
Claim 15
Dependent Claim
22 words
The semiconductor device according to claim 8, wherein said insulation tape is formed by polyimide, and said leads are formed by copper.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-10-29 | 2000-04-29 | 2000-10-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-10-29 | 2004-04-29 | 2004-10-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-10-29 | 2008-04-29 | 2008-10-29 | $7700.00 | Window Closed / Lapsed |