Removable heat sink assembly for a chip package

Claim 1

In electronic apparatus wherein there is at least one chip package mounted on a circuit card, having circuit connections on one package face connected into the circuitry of said card and having an essentially parallel second package face, separated from said first package face by a height dimension, in contact with a heat sink, the improvement comprising: a plurality of post type fastener members each said fastener member having a body with first and second end regions defined by first and second shoulders respectively, said shoulders being separated along the length of said body by a dimension slightly less than said height dimension, each said post type fastener having said first end region extending to said first shoulder, into a separate hole in said heat sink and having said second end region extending to said second shoulder into a separate hole in said circuit card, each said post type fastener member providing spring means on said first end operable to apply force to said heat sink in the direction of said circuit card and each said post type fastener member on said second end having expansion and retention construction features operable to retain said post type fastener member in a hole in said circuit card with said second shoulder in contact with said circuit card.