US5612513A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Article and method of manufacturing an enclosed electrical circuit using an encapsulant
Assignee: Round Rock Research LLC
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Filing: 1995-09-19
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Granted: 1997-03-18
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Expires: 2015-09-19
Abstract
Abstract An enclosed electrical circuit and method for manufacturing the electrical circuit are provided. Initially a flexible substrate is formed with a plurality of electrical circuits. By way of example, each circuit can contain a conductive trace, a battery and a die, all in electrical communication. During the manufacturing process, a barrier is placed on the substrate and a curable encapsulant is poured into a cavity formed by the barrier and the substrate to encapsulate each circuit. The barrier can be formed as a compartmentalized dam having a separate cavity for each circuit, as a perimeter dam having a single cavity, or as a spacer sheet having a separate cavity for each circuit formed by a pattern of cut outs. Following the encapsulation step, the electrical circuits can be singulated into separate encapsulated circuits.
Inventors
- 👤 Mark E. Tuttle
- 👤 Rickie C. Lake
- 👤 Joe P. Mousseau
- 👤 Clay L. Cirino
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 03:58
CPC Classifications
H; H10; H10W; H10W90/00; H10W42/00; H10W70/00; H10W70/60; H10W70/611; H10W70/67; H10W70/688; H10W76/00; H10W76/40; H10W76/42; H10W76/47; H05; H05K; H05K1/00; H05K1/18; H05K1/189; H05K3/00; H05K3/22; H05K3/28; H05K3/284; H10W44/00; H10W44/20; H10W44/241; H10W44/248; H10W72/00; H10W72/01; H10W72/0198; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49146
Claims Analysis
Total Claims: 40
Claim 1
Independent Claim
51 words
A method for manufacturing an encapsulated electrical circuit comprising: forming a substrate; forming an image on a surface of the substrate viewable through the substrate; forming the circuit on the surface; forming a barrier on the substrate to define a cavity surrounding the circuit; and placing an encapsulant in the cavity.
Claim 2
Independent Claim
51 words
A method for manufacturing an encapsulated electrical circuit comprising: forming a substrate; forming an image on a surface of the substrate viewable through the substrate; forming the circuit on the surface; forming a barrier on the substrate to define a cavity surrounding the circuit; and placing an encapsulant in the cavity.
Claim 3
Dependent Claim
35 words
The method as claimed in claim 1 and further comprising: mounting a die on the surface in electrical communication with the circuit; and mounting a battery on the surface in electrical communication with the circuit.
Claim 4
Dependent Claim
24 words
The method claimed in claim 1 and wherein the substrate is substantially transparent and the image comprises an ink layer applied to the surface.
Claim 5
Dependent Claim
32 words
The method as claimed in claim 1 and wherein the encapsulant comprises an epoxy in a viscous state when placed in the cavity and further comprising the step of curing the epoxy.
Claim 6
Dependent Claim
25 words
The method as claimed in claim 1 and further comprising applying a releasing agent to the barrier to allow separation of the barrier and encapsulant.
Claim 7
Dependent Claim
23 words
The method as claimed in claim 1 and wherein the barrier comprises a spacer sheet having the cavity formed as a cut out.
Claim 8
Dependent Claim
16 words
The method as claimed in claim 1 further comprising covering the encapsulant with a flexible cover.
Claim 9
Independent Claim
88 words
A method for manufacturing an electrical circuit comprising: forming a substrate; forming a plurality of conductive traces on the substrate; mounting electrical components on the substrate in electrical communication with the conductive traces to form a plurality of separate circuits; placing a spacer sheet on the substrate comprising a plurality of separate cavities for the separate circuits; depositing a curable compound into the cavities to encapsulate each of the separate circuits; curing the compound; and singulating the substrate and spacer sheet to form a plurality separate encapsulated circuits.
Claim 10
Independent Claim
88 words
A method for manufacturing an electrical circuit comprising: forming a substrate; forming a plurality of conductive traces on the substrate; mounting electrical components on the substrate in electrical communication with the conductive traces to form a plurality of separate circuits; placing a spacer sheet on the substrate comprising a plurality of separate cavities for the separate circuits; depositing a curable compound into the cavities to encapsulate each of the separate circuits; curing the compound; and singulating the substrate and spacer sheet to form a plurality separate encapsulated circuits.
Claim 11
Dependent Claim
34 words
The method as claimed in claim 8 and wherein the mounting step comprises: mounting a die on the substrate for each separate circuit; and mounting a battery on the substrate for each separate circuit.
Claim 12
Dependent Claim
17 words
The method as claimed in claim 8 and further comprising covering the encapsulant with a flexible cover.
Claim 13
Dependent Claim
24 words
The method as claimed in claim 8 wherein the singulating step comprises a method selected from the group consisting of cutting, shearing and routering.
Claim 14
Dependent Claim
17 words
The method as claimed in claim 8 and wherein the conductive traces are formed by screen printing.
Claim 15
Dependent Claim
33 words
The method as claimed in claim 8 and further comprising forming the substrate of a substantially transparent material and forming an image on a surface of the substrate wherein the circuits are formed.
Claim 16
Dependent Claim
33 words
The method as claimed in claim 8 and further comprising forming the substrate of a transparent material and forming a reverse image on a surface of the substrate wherein the circuits are formed.
Claim 17
Dependent Claim
20 words
The method as claimed in claim 8 and further comprising forming a portion of the conductive trace as an antenna.
Claim 18
Dependent Claim
23 words
The method as claimed in claim 8 and further comprising forming an antenna on the substrate in electrical communication with the conductive trace.
Claim 19
Dependent Claim
35 words
An encapsulated circuit comprising: a transparent flexible substrate; an image formed on a surface of the substrate; an electrical circuit formed on the surface; and an encapsulating layer covering the surface and the electrical circuit.
Claim 20
Dependent Claim
35 words
An encapsulated circuit comprising: a transparent flexible substrate; an image formed on a surface of the substrate; an electrical circuit formed on the surface; and an encapsulating layer covering the surface and the electrical circuit.
Claim 21
Dependent Claim
16 words
The encapsulated circuit as claimed in claim 17 and wherein the image comprises an ink layer.
Claim 22
Dependent Claim
45 words
The encapsulated circuit as claimed in claim 17 and wherein the electrical circuit comprises: a conductive trace formed on the substrate; a die mounted on the substrate in electrical communication with the trace; a battery mounted on the substrate in electrical communication with the trace.
Claim 23
Dependent Claim
21 words
The encapsulated circuit as claimed in claim 19 wherein a positive terminal and a negative terminal of the battery are co-planar.
Claim 24
Dependent Claim
16 words
The encapsulated circuit as claimed in claim 17 wherein the encapsulating layer comprises a curable epoxy.
Claim 25
Dependent Claim
16 words
The encapsulated circuit as claimed in claim 17 wherein the encapsulating layer comprises an opaque material.
Claim 26
Dependent Claim
18 words
The encapsulated circuit as claimed in claim 17 and wherein the circuit comprises a die and a battery.
Claim 27
Dependent Claim
22 words
The encapsulated circuit as claimed in claim 23 wherein the die and battery are mounted to the substrate using a conductive adhesive.
Claim 28
Dependent Claim
18 words
The encapsulated circuit as claimed in claim 17 and further comprising a flexible cover formed on the encapsulant.
Claim 29
Dependent Claim
59 words
An encapsulated circuit comprising: a transparent flexible substrate; an electrical circuit formed on the substrate; an ink layer applied to the substrate between the substrate and the electrical circuit to provide an image visible through the substrate; and an encapsulating layer covering the substrate and the electrical circuit with the electrical circuit encapsulated between the substrate and encapsulating layer.
Claim 30
Dependent Claim
59 words
An encapsulated circuit comprising: a transparent flexible substrate; an electrical circuit formed on the substrate; an ink layer applied to the substrate between the substrate and the electrical circuit to provide an image visible through the substrate; and an encapsulating layer covering the substrate and the electrical circuit with the electrical circuit encapsulated between the substrate and encapsulating layer.
Claim 31
Dependent Claim
49 words
The encapsulated circuit as claimed in claim 26 and wherein the electrical circuit comprises: a conductive trace formed on the substrate; a die mounted on the substrate in electrical communication with the trace; a battery having a positive terminal and a negative terminal in electrical communication with the trace.
Claim 32
Dependent Claim
24 words
The encapsulated circuit as claimed in claim 26 and wherein the die and the battery are mounted on the substrate using a conductive adhesive.
Claim 33
Independent Claim
61 words
A method for manufacturing an encapsulated electrical circuit comprising: forming a substrate; forming a plurality of circuits on the substrate; placing a barrier on the substrate to define a single cavity surrounding the circuits; forming an encapsulant in the cavity to encapsulate the circuits; separating the barrier from the encapsulant; and separating the encapsulated circuit from a remainder of the circuits.
Claim 34
Independent Claim
61 words
A method for manufacturing an encapsulated electrical circuit comprising: forming a substrate; forming a plurality of circuits on the substrate; placing a barrier on the substrate to define a single cavity surrounding the circuits; forming an encapsulant in the cavity to encapsulate the circuits; separating the barrier from the encapsulant; and separating the encapsulated circuit from a remainder of the circuits.
Claim 35
Dependent Claim
25 words
The method as claimed in claim 29 and further comprising applying a releasing agent to the barrier to facilitate separating the barrier from the substrate.
Claim 36
Dependent Claim
20 words
The method as claimed in claim 29 and wherein each circuit includes a battery, a semiconductor die and an antenna.
Claim 37
Independent Claim
65 words
A method for manufacturing an encapsulated electrical circuit comprising: forming a substrate; forming a plurality of circuits on the substrate; providing a compartmental dam comprising an opening for each of the circuits; placing the dam on the substrate; forming an encapsulant in the cavities to encapsulate the circuits; separating the dam from the substrate; and separating the encapsulated circuit from a remainder of the circuits.
Claim 38
Independent Claim
65 words
A method for manufacturing an encapsulated electrical circuit comprising: forming a substrate; forming a plurality of circuits on the substrate; providing a compartmental dam comprising an opening for each of the circuits; placing the dam on the substrate; forming an encapsulant in the cavities to encapsulate the circuits; separating the dam from the substrate; and separating the encapsulated circuit from a remainder of the circuits.
Claim 39
Dependent Claim
25 words
The method as claimed in claim 32 and further comprising applying a releasing agent to the dam to facilitate separating the dam from the substrate.
Claim 40
Dependent Claim
20 words
The method as claimed in claim 32 and wherein each circuit includes a battery, a semiconductor die and an antenna.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-03-17 | 2000-09-16 | 2001-03-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-03-17 | 2004-09-16 | 2005-03-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-03-17 | 2008-09-16 | 2009-03-18 | $7700.00 | Window Closed / Lapsed |