Anisotropic, electrically conductive adhesive film

Claim 2

An anisotropic, electrically conductive adhesive film comprising an electrically insulating adhesive, electrically conductive particles dispersed in the insulating adhesive, and transparent spherical glass particles dispersed in the insulating adhesive wherein the particle size distribution of the glass particles, defined by a cumulative volume ratio of the maximum particle size of the glass particles found in a cumulative volume that represent 75% of the particles by volume to the maximum particle size of the glass particles found in a cumulative volume that represent 25% of the particles by volume, is 1 to 2.

Claim 3

An anisotropic, electrically conductive adhesive film according to claim 1, wherein the glass particles have an average particle size of less than about 1 μm.

Claim 4

An anisotropic, electrically conductive adhesive film according to claim 2, wherein the glass particles have an average particle size of about 0.1 to 1 μm.

Claim 5

An anisotropic, electrically conductive adhesive film according to claim 1, wherein the glass particles have a refractive index of about 1.4 to 1.6.

Claim 6

An anisotropic, electrically conductive adhesive film according to claim 1, wherein the glass particles comprise about 10 to 40% by volume, based on the entire volume of the adhesive film.

Claim 7

An anisotropic, electrically conductive adhesive film according to claim 5, wherein the glass particles comprise about 10 to 30% by volume, based on the entire volume of the adhesive film.

Claim 8

An anisotropic, electrically conductive adhesive film according to claim 1, wherein the conductive particles comprise about 0.5 to 20% by volume, based on the entire volume of the adhesive film.

Claim 9

An anisotropic, electrically conductive adhesive film according to claim 7, wherein the conductive particles comprise about 1 to 5% by volume, based on the entire volume of the adhesive film.

Claim 10

An anisotropic, electrically conductive adhesive film according to claim 7, wherein the conductive particles are nickel particles.

Claim 11

An anisotropic, electrically conductive adhesive film according to claim 1, wherein the insulating adhesive is formed from a material selected from the group consisting of acrylate polymers, ethylene-acrylate copolymers, ethylene-acrylic acid copolymers, ethylene-vinyl acetate copolymers, polyethylene, ethylene-propylene copolymers, acrylonitrile-butadiene copolymers, styrene-butadiene block copolymers, styrene-butadiene-styrene block copolymers, carboxylated styrene-ethylene-butadiene-styrene block copolymers, epoxidized styrene-ethylene-butadiene-styrene block copolymers, styrene-isoprene block copolymers, polybutadiene, ethylene-styrene-butylene block copolymers, polyvinyl butyral, polyvinyl formal, phenoxy resins, polyesters, polyurethanes, polyamides, polyvinyl acetal, polyvinyl ethers, polysulfones, nitrile-butadiene rubber, styrene-butadiene rubber, chloroprene rubbers, cyanate ester polymers, epoxy resins, silicone resins, phenol resins, photocurable resins, anaerobic resins, and blends of any of the foregoing.

Claim 12

An anisotropic, electrically conductive adhesive film according to claim 1 wherein the refractive indices of the insulating adhesive and the glass particles are matched.

Claim 13

An electronic assembly comprising an electronic component bonded to a circuit substrate by an anisotropic, electrically conductive adhesive film, wherein the adhesive film comprises an electrically insulating adhesive, electrically conductive particles dispersed in the insulating adhesive, and transparent spherical glass particles dispersed in the insulating adhesive, wherein the particle size distribution of the glass particles, defined by a cumulative volume ratio of the maximum particle size of the glass particles found in a cumulative volume that represent 75% of the particles by volume to the maximum particle size of the glass particles found in a cumulative volume that represent 25% of the particles by volume, is 1 to 2.

Claim 14

An electronic assembly comprising an electronic component bonded to a circuit substrate by an anisotropic, electrically conductive adhesive film, wherein the adhesive film comprises an electrically insulating adhesive, electrically conductive particles dispersed in the insulating adhesive, and transparent spherical glass particles dispersed in the insulating adhesive, wherein the particle size distribution of the glass particles, defined by a cumulative volume ratio of the maximum particle size of the glass particles found in a cumulative volume that represent 75% of the particles by volume to the maximum particle size of the glass particles found in a cumulative volume that represent 25% of the particles by volume, is 1 to 2.

Claim 15

An electronic assembly according to claim 12 wherein the electronic component is an integrated circuit chip.