US5723369A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of flip chip assembly
Assignee: Bell Semiconductor LLC
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Filing: 1996-03-14
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Granted: 1998-03-03
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Expires: 2016-03-14
Abstract
Abstract To assemble a flip chip in a package, the back of the flip chip is coated with a heat conductive material and a heat conductive substrate is attached to the heat conductive material. Solder bumps are attached to the front of the flip chip and to a package substrate to mount the flip chip on the package, leaving a space between the flip chip and the package substrate. The space between the flip chip and the package substrate is under filled with a heat conductive media, and the flip chip is encapsulated against the package substrate with a peripheral mold such that at least a portion of the conductive substrate remains exposed. A final package is formed by electrical connectors attached to the package substrate.
Inventors
- 👤 Ivor G. Barber
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 18:23
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W90/00; H10W90/701; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W70/654; H10W70/655; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/20; H10W72/251; H10W72/252; H10W72/851; H10W72/874; H10W72/877; H10W74/15; H10W90/721; H10W90/724; H10W90/731; H10W90/734; H10W90/736
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
123 words
A method of assembling a flip chip in a package comprising: coating the back of the flip chip with a heat conductive adhesive material, attaching a heat conductive substrate to the heat conductive material, mounting the flip chip to a package substrate using solder bumps attached between the front of the flip chip and the package substrate, there being a space left between the flip chip and the package substrate, under filling the space between the flip chip and the package substrate with a heat conductive media, encapsulating the flip chip against the package substrate with a peripheral mold such that at least a portion of the conductive substrate remains exposed, and attaching electrical connectors to the package substrate, to form the package.
Claim 2
Independent Claim
123 words
A method of assembling a flip chip in a package comprising: coating the back of the flip chip with a heat conductive adhesive material, attaching a heat conductive substrate to the heat conductive material, mounting the flip chip to a package substrate using solder bumps attached between the front of the flip chip and the package substrate, there being a space left between the flip chip and the package substrate, under filling the space between the flip chip and the package substrate with a heat conductive media, encapsulating the flip chip against the package substrate with a peripheral mold such that at least a portion of the conductive substrate remains exposed, and attaching electrical connectors to the package substrate, to form the package.
Claim 3
Dependent Claim
12 words
The method of claim 1 wherein the heat conductive material comprises epoxy.
Claim 4
Dependent Claim
12 words
The method of claim 1 wherein the heat conductive substrate comprises copper.
Claim 5
Dependent Claim
12 words
The method of claim 1 wherein the heat conductive media comprises epoxy.
Claim 6
Dependent Claim
11 words
The method of claim 1 wherein the peripheral mold comprises epoxy.
Claim 7
Dependent Claim
12 words
The method of claim 1 wherein the electrical connectors comprise solder balls.
Claim 8
Independent Claim
123 words
A method of assembling a flip chip in a package comprising: coating a heat conductive substrate with a heat conductive material, attaching the heat conductive adhesive material to the back of the flip chip, mounting the flip chip to a package substrate using solder bumps attached between the front of the flip chip and the package substrate, there being a space left between the flip chip and the package substrate, under filling the space between the flip chip and the package substrate with a heat conductive media, encapsulating the flip chip against the package substrate with a peripheral mold such that at least a portion of the conductive substrate remains exposed, and attaching electrical connectors to the package substrate, to form the package.
Claim 9
Independent Claim
123 words
A method of assembling a flip chip in a package comprising: coating a heat conductive substrate with a heat conductive material, attaching the heat conductive adhesive material to the back of the flip chip, mounting the flip chip to a package substrate using solder bumps attached between the front of the flip chip and the package substrate, there being a space left between the flip chip and the package substrate, under filling the space between the flip chip and the package substrate with a heat conductive media, encapsulating the flip chip against the package substrate with a peripheral mold such that at least a portion of the conductive substrate remains exposed, and attaching electrical connectors to the package substrate, to form the package.
Claim 10
Dependent Claim
12 words
The method of claim 7 wherein the heat conductive material comprises epoxy.
Claim 11
Dependent Claim
24 words
The method of claim 7 wherein the heat conductive substrate comprises a material selected from the group consisting of copper, copper/tungsten, aluminum, and ceramic.
Claim 12
Dependent Claim
12 words
The method of claim 7 wherein the heat conductive media comprises epoxy.
Claim 13
Dependent Claim
11 words
The method of claim 7 wherein the peripheral mold comprises epoxy.
Claim 14
Dependent Claim
12 words
The method of claim 7 wherein the electrical connectors comprise solder balls.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-03-02 | 2001-09-01 | 2002-03-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-03-02 | 2005-09-01 | 2006-03-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-03-02 | 2009-09-01 | 2010-03-03 | $7700.00 | Window Closed / Lapsed |