US5847366A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus and method for controlling the temperature of an integrated circuit under test
Assignee: Micron Technology Inc
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Filing: 1996-06-18
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Granted: 1998-12-08
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Expires: 2016-06-18
Abstract
Abstract The present invention is an apparatus and method for controlling the temperature of a heat generating device. The invention is particularly adaptable to controlling the temperature of an integrated circuit under test. In one embodiment the invention involves the use of a bellows having a heat slug disposed at one end that is adapted to engage a surface of the heat generating device. The bellows is compliant and includes a cavity containing a heat transfer medium. The bellows cavity is in fluid communication with a heat transfer medium reservoir. Heat is transferred from the heat generating device by engaging the heat slug with a surface of the heat generating device and applying a force to the bellows. The compliant nature of the bellows provides the temperature control apparatus with a self-planarizing feature that maximizes the contact surface area between the heat slug and heat generating device.
Inventors
- 👤 David R. Grunfeld
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 00:51
CPC Classifications
G; G01; G01R; G01R31/00; G01R31/28; G01R31/2851; G01R31/2855; G01R31/2872; G01R31/2874; G01R31/2875; G01K; G01K1/00; G01K1/14; G01K1/143; H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/772; Y; Y10; Y10S; Y10S438/00; Y10S438/909
Claims Analysis
Total Claims: 35
Claim 1
Independent Claim
138 words
An apparatus for cooling the surface of a heat generating device comprising: a bellows defining a cavity; a heat slug disposed at an end of said bellows, said heat slug having a first surface for making contact with said surface of said heat generating device; a reservoir for containing a heat transfer medium; a first conduit for permitting the flow of said heat transfer medium from said reservoir to said bellows cavity, expansion of said bellows causing at least a portion of said heat transfer medium to flow from said reservoir to said bellows cavity; and a second conduit for permitting the flow of said heat transfer medium from said bellows cavity to said reservoir, compression of said bellows causing at least a portion of said heat transfer medium to flow from said bellows cavity to said reservoir.
Claim 2
Independent Claim
138 words
An apparatus for cooling the surface of a heat generating device comprising: a bellows defining a cavity; a heat slug disposed at an end of said bellows, said heat slug having a first surface for making contact with said surface of said heat generating device; a reservoir for containing a heat transfer medium; a first conduit for permitting the flow of said heat transfer medium from said reservoir to said bellows cavity, expansion of said bellows causing at least a portion of said heat transfer medium to flow from said reservoir to said bellows cavity; and a second conduit for permitting the flow of said heat transfer medium from said bellows cavity to said reservoir, compression of said bellows causing at least a portion of said heat transfer medium to flow from said bellows cavity to said reservoir.
Claim 3
Dependent Claim
35 words
The apparatus of claim 1 wherein said first conduit includes a first tubing containing a first check valve that only permits a flow of said heat transfer medium from said reservoir to said bellows cavity.
Claim 4
Dependent Claim
35 words
The apparatus of claim 1 wherein said second conduit includes a second tubing containing a second check valve that only permits a flow of said heat transfer medium from said bellows cavity to said reservoir.
Claim 5
Dependent Claim
18 words
The apparatus of claim 1 wherein said heat transfer medium is in fluid contact with said heat slug.
Claim 6
Dependent Claim
14 words
The apparatus of claim 1 wherein said bellows is attached to a pick-up chuck.
Claim 7
Dependent Claim
17 words
The apparatus of claim 1 wherein said bellows and said reservoir are attached to a pick-up chuck.
Claim 8
Dependent Claim
173 words
A cooling system for transferring heat from a first surface of a semiconductor device comprising: a bellows defining a cavity, said bellows having an outlet opening discharging a heat transfer medium from said cavity when said bellows is compressed, said bellows further comprising an inlet opening receiving said heat transfer medium when said bellows is expanded; a heat slug disposed at an end of said bellows, said heat slug having a planar surface for making contact with said first surface of said semiconductor device; a heat transfer medium reservoir; a first conduit for transporting said heat transfer medium from said reservoir to said bellows inlet opening; second conduit for transporting said heat transfer medium from said bellows outlet opening to said reservoir; a first valve disposed within said first conduit that permits only the flow of said heat transfer medium from said reservoir to said bellows cavity; and a second valve disposed within said second conduit that permits only the flow of said heat transfer medium from said bellows cavity to said reservoir.
Claim 9
Dependent Claim
173 words
A cooling system for transferring heat from a first surface of a semiconductor device comprising: a bellows defining a cavity, said bellows having an outlet opening discharging a heat transfer medium from said cavity when said bellows is compressed, said bellows further comprising an inlet opening receiving said heat transfer medium when said bellows is expanded; a heat slug disposed at an end of said bellows, said heat slug having a planar surface for making contact with said first surface of said semiconductor device; a heat transfer medium reservoir; a first conduit for transporting said heat transfer medium from said reservoir to said bellows inlet opening; second conduit for transporting said heat transfer medium from said bellows outlet opening to said reservoir; a first valve disposed within said first conduit that permits only the flow of said heat transfer medium from said reservoir to said bellows cavity; and a second valve disposed within said second conduit that permits only the flow of said heat transfer medium from said bellows cavity to said reservoir.
Claim 10
Dependent Claim
15 words
The cooling system of claim 7 wherein said first and second valves comprise check valves.
Claim 11
Dependent Claim
16 words
The cooling system of claim 7 wherein said first and second conduits comprise stainless steel tubing.
Claim 12
Dependent Claim
19 words
The cooling system of claim 7 wherein said heat transfer medium is in fluid contact with said heat slug.
Claim 13
Dependent Claim
14 words
The cooling system of claim 7 wherein said heat transfer medium comprises a liquid.
Claim 14
Dependent Claim
15 words
The cooling system of claim 7 wherein said bellows is attached to a pick-up chuck.
Claim 15
Dependent Claim
18 words
The cooling system of claim 7 wherein said bellows and said reservoir are attached to a pick-up chuck.
Claim 16
Independent Claim
131 words
A method for transferring heat from the surface of a heat generating device, said method comprising the steps of: applying a first force to a bellows having a planar surface disposed at one end such that said planar surface makes intimate contact with said surface of said heat generating device and wherein said bellows is compressed such that at least a portion of a heat transfer medium residing in said bellows is forced out of said bellows into a heat transfer medium reservoir; and applying a second force to said bellows such that said planar surface is removed from said surface of said heat generating device and wherein said bellows expands such that at least a portion of said heat transfer medium residing in said reservoir is drawn into said bellows.
Claim 17
Independent Claim
131 words
A method for transferring heat from the surface of a heat generating device, said method comprising the steps of: applying a first force to a bellows having a planar surface disposed at one end such that said planar surface makes intimate contact with said surface of said heat generating device and wherein said bellows is compressed such that at least a portion of a heat transfer medium residing in said bellows is forced out of said bellows into a heat transfer medium reservoir; and applying a second force to said bellows such that said planar surface is removed from said surface of said heat generating device and wherein said bellows expands such that at least a portion of said heat transfer medium residing in said reservoir is drawn into said bellows.
Claim 18
Dependent Claim
14 words
The method of claim 14 wherein said bellows is attached to a pick-up chuck.
Claim 19
Dependent Claim
17 words
The method of claim 14 wherein said bellows and said reservoir are attached to a pick-up chuck.
Claim 20
Dependent Claim
15 words
The method of claim 14 wherein said first pressure is applied by said pick-up chuck.
Claim 21
Dependent Claim
15 words
The method of claim 16 wherein said first pressure is applied by said pick-up chuck.
Claim 22
Independent Claim
110 words
A method for transferring heat from the backside of a semiconductor die, said method comprising the steps of: applying a first force to a bellows having a heat slug disposed at one end such that said heat slug makes intimate contact with said backside of said die and wherein said bellows is compressed such that at least a portion of a heat transfer medium residing in said bellows is forced out of said bellows; and applying a second force to said bellows such that said heat slug is removed from said backside of said die and wherein said bellows expands causing said heat transfer medium to flow into said bellows.
Claim 23
Independent Claim
110 words
A method for transferring heat from the backside of a semiconductor die, said method comprising the steps of: applying a first force to a bellows having a heat slug disposed at one end such that said heat slug makes intimate contact with said backside of said die and wherein said bellows is compressed such that at least a portion of a heat transfer medium residing in said bellows is forced out of said bellows; and applying a second force to said bellows such that said heat slug is removed from said backside of said die and wherein said bellows expands causing said heat transfer medium to flow into said bellows.
Claim 24
Dependent Claim
14 words
The method of claim 19 wherein said bellows is attached to a pick-up chuck.
Claim 25
Dependent Claim
17 words
The method of claim 19 wherein said bellows and said reservoir are attached to a pick-up chuck.
Claim 26
Dependent Claim
15 words
The method of claim 20 wherein said first pressure is applied by said pick-up chuck.
Claim 27
Dependent Claim
15 words
The method of claim 21 wherein said first pressure is applied by said pick-up chuck.
Claim 28
Independent Claim
113 words
A method for transferring heat from a semiconductor die, said method comprising the steps of: applying a first force to a bellows having a first heat slug disposed at one end such that said heat slug makes intimate contact with a second heat slug that is coupled to said die and wherein said bellows is compressed such that at least a portion of a heat transfer medium residing in said bellows is forced out of said bellows; and applying a second force to said bellows such that said first heat slug is removed from said second heat slug and wherein said bellows expands causing said heat transfer medium to flow into said bellows.
Claim 29
Independent Claim
113 words
A method for transferring heat from a semiconductor die, said method comprising the steps of: applying a first force to a bellows having a first heat slug disposed at one end such that said heat slug makes intimate contact with a second heat slug that is coupled to said die and wherein said bellows is compressed such that at least a portion of a heat transfer medium residing in said bellows is forced out of said bellows; and applying a second force to said bellows such that said first heat slug is removed from said second heat slug and wherein said bellows expands causing said heat transfer medium to flow into said bellows.
Claim 30
Dependent Claim
14 words
The method of claim 24 wherein said bellows is attached to a pick-up chuck.
Claim 31
Dependent Claim
17 words
The method of claim 24 wherein said bellows and said reservoir are attached to a pick-up chuck.
Claim 32
Dependent Claim
15 words
The method of claim 25 wherein said first pressure is applied by said pick-up chuck.
Claim 33
Dependent Claim
15 words
The method of claim 26 wherein said first pressure is applied by said pick-up chuck.
Claim 34
Independent Claim
101 words
An apparatus for cooling a surface of a heat generating device comprising: a pickup chuck; a bellows on said pickup chuck, said bellows defining a cavity; a heat slug disposed at an end of said bellows, said heat slug having a first surface for making contact with said surface of said heat generating device; a reservoir for containing a heat transfer medium; a first conduit for permitting the flow of said heat transfer medium from said reservoir to said bellows cavity; and a second conduit for permitting the flow of said heat transfer medium from said bellows cavity to said reservoir.
Claim 35
Independent Claim
101 words
An apparatus for cooling a surface of a heat generating device comprising: a pickup chuck; a bellows on said pickup chuck, said bellows defining a cavity; a heat slug disposed at an end of said bellows, said heat slug having a first surface for making contact with said surface of said heat generating device; a reservoir for containing a heat transfer medium; a first conduit for permitting the flow of said heat transfer medium from said reservoir to said bellows cavity; and a second conduit for permitting the flow of said heat transfer medium from said bellows cavity to said reservoir.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 2001-12-07 | 2002-06-08 | 2002-12-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-12-07 | 2006-06-08 | 2006-12-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-12-07 | 2010-06-08 | 2010-12-08 | $7700.00 | Window Closed / Lapsed |