US6075712A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Flip-chip having electrical contact pads on the backside of the chip
Assignee: Intel Corp
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Filing: 1999-01-08
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Granted: 2000-06-13
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Expires: 2019-01-08
Abstract
Abstract An integrated circuit device. The integrated circuit device includes a semiconductor substrate having a first surface and a second surface opposite the first surface. Circuit elements are formed within the first surface. A plurality of bump contacts are located on the first surface and connected to the circuit elements. Bond pads that are also connected to circuit elements are located within or on the second surface.
Inventors
- 👤 John F. McMahon
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 10:26
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/01; H10W20/021; H10W20/023; H10W20/0234; H10W20/0242; H10W20/20; H10W20/211; H10W20/212; H10W20/2125; H10W99/00; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/20; H10W72/29; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5525; H10W72/59; H10W72/851; H10W72/874; H10W72/879; H10W72/90; H10W72/931; H10W72/934; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
101 words
An integrated circuit device comprising: a semiconductor substrate having a first surface and a second surface opposite said first surface; circuit elements disposed within said first surface; a conductor region over said first surface having a top-side surface; a first plurality of electrical contact pads disposed on said top-side surface and connected to said circuit elements through said conductor region; a second plurality of electrical contact pads disposed within said second surface and connected to said circuit elements; and conductor power traces for power input, at least one of said second plurality of electrical contact pads connected to said power traces.
Claim 2
Dependent Claim
101 words
An integrated circuit device comprising: a semiconductor substrate having a first surface and a second surface opposite said first surface; circuit elements disposed within said first surface; a conductor region over said first surface having a top-side surface; a first plurality of electrical contact pads disposed on said top-side surface and connected to said circuit elements through said conductor region; a second plurality of electrical contact pads disposed within said second surface and connected to said circuit elements; and conductor power traces for power input, at least one of said second plurality of electrical contact pads connected to said power traces.
Claim 3
Dependent Claim
23 words
The integrated circuit device of claim 1 wherein said second plurality of electrical contact pads are adaptable for establishing a wire bond connection.
Claim 4
Dependent Claim
25 words
The integrated circuit device of claim 1 wherein said second plurality of electrical contact pads bond pads are adaptable for establishing a TAB bond connection.
Claim 5
Dependent Claim
40 words
The integrated circuit device of claim 1 wherein said conductor region further comprises conductor lines electrically connecting said circuit elements, at least one of said second plurality of electrical contact pads coupled to at least one of said conductor lines.
Claim 6
Dependent Claim
62 words
The integrated circuit device of claim 1 wherein said conductor region further comprises a first layer and a second layer of conductor lines electrically connecting said circuit elements, said first layer of conductor lines located adjacent to said circuit elements, at least one of said second plurality of electrical contact pads coupled to at least one of said first layer conductor lines.
Claim 7
Dependent Claim
27 words
The integrated circuit device of claim 1 wherein said second plurality of electrical contact pads are disposed within recesses in said second surface of said semiconductor substrate.
Claim 8
Dependent Claim
23 words
The integrated circuit device of claim 6 wherein said second plurality of electrical contact pads comprise a metal layer deposited within said recesses.
Claim 9
Dependent Claim
17 words
The integrated circuit device of claim 7 further comprising an insulation layer disposed over said metal layer.
Claim 10
Dependent Claim
20 words
The integrated circuit device of claim 1 further comprising solder bumps connected to said first plurality of electrical contact pads.
Claim 11
Dependent Claim
33 words
The integrated circuit device of claim 1 further comprising a memory device located on said integrated circuit device and electrically coupled to at least one of said second plurality of electrical contact pads.
Claim 12
Dependent Claim
96 words
An integrated circuit device comprising: a semiconductor substrate having a first surface and a second surface opposite said first surface; at least one recess in said second surface; circuit elements disposed within said first surface; a conductor region above said first surface comprising conductor lines electrically connecting said circuit elements, said conductor region having a top-side surface; a first plurality of contact pads disposed on said top-side surface and connected to said circuit elements; and, a second plurality of contact pads disposed within said at least one recess and connected to contacts external to said substrate.
Claim 13
Dependent Claim
96 words
An integrated circuit device comprising: a semiconductor substrate having a first surface and a second surface opposite said first surface; at least one recess in said second surface; circuit elements disposed within said first surface; a conductor region above said first surface comprising conductor lines electrically connecting said circuit elements, said conductor region having a top-side surface; a first plurality of contact pads disposed on said top-side surface and connected to said circuit elements; and, a second plurality of contact pads disposed within said at least one recess and connected to contacts external to said substrate.
Claim 14
Dependent Claim
20 words
The integrated circuit device of claim 11 wherein said second contact pads comprise a metal layer disposed within said recess.
Claim 15
Dependent Claim
17 words
The integrated circuit device of claim 12 further comprising an insulation layer disposed over said metal layer.
Claim 16
Dependent Claim
20 words
The integrated circuit device of claim 11 wherein said second contact pads are adaptable for establishing a wire bond connection.
Claim 17
Dependent Claim
20 words
The integrated circuit device of claim 11 wherein said second contact pads are adaptable for establishing a TAB bond connection.
Claim 18
Independent Claim
127 words
An apparatus comprising: a semiconductor substrate having a first surface and a second surface opposite said first surface; circuit elements disposed within said first surface; a conductor region located over said first surface having a top-side surface; a first plurality of contact pads disposed on said top-side surface and connected to said circuit elements through said conductor region; a second plurality of contact pads disposed within said second surface and connected to said circuit elements; and, a printed circuit board having a first set of bond pads and a second set of bond pads, said first plurality of contact pads being electrically coupled to said first set of bond pads and said second plurality of contact pads being electrically coupled to said second set of bond pads.
Claim 19
Independent Claim
127 words
An apparatus comprising: a semiconductor substrate having a first surface and a second surface opposite said first surface; circuit elements disposed within said first surface; a conductor region located over said first surface having a top-side surface; a first plurality of contact pads disposed on said top-side surface and connected to said circuit elements through said conductor region; a second plurality of contact pads disposed within said second surface and connected to said circuit elements; and, a printed circuit board having a first set of bond pads and a second set of bond pads, said first plurality of contact pads being electrically coupled to said first set of bond pads and said second plurality of contact pads being electrically coupled to said second set of bond pads.
Claim 20
Dependent Claim
30 words
The apparatus of claim 16 wherein at least one of said second plurality of contact pads is electrically coupled to said second set of bond pads by a wire bond.
Claim 21
Dependent Claim
26 words
The apparatus of claim 16 wherein said second plurality of contact pads is electrically coupled to said second set of bond pads by a TAB bond.
Claim 22
Dependent Claim
24 words
The apparatus of claim 16 wherein said first plurality of contact pads is coupled to said first set of bond pads by solder connections.
Claim 23
Dependent Claim
25 words
The apparatus of claim 16 wherein said second plurality of electrical contact pads are disposed within recesses in said second surface of said semiconductor substrate.
Claim 24
Dependent Claim
20 words
The apparatus of claim 20 wherein said second plurality of contact pads comprise a metal layer deposited within said recesses.
Claim 25
Dependent Claim
15 words
The apparatus of claim 21 further comprising an insulation layer disposed over said metal layer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-06-13 | 2003-12-13 | 2004-06-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-06-13 | 2007-12-13 | 2008-06-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-06-13 | 2011-12-13 | 2012-06-13 | $7700.00 | Window Closed / Lapsed |