US6269999B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor chip mounting method utilizing ultrasonic vibrations
Assignee: Texas Instruments Inc
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Filing: 2000-08-03
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Granted: 2001-08-07
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Expires: 2020-08-03
Abstract
Abstract A semiconductor chip mounting method to prevent the occurrence of particles created while mounting the semiconductor chip onto a substrate using ultrasonic thermocompression bonding. The mounting method of the present invention utilizing ultrasonic vibrations involves the following steps: a semiconductor chip having conductive bumps on its main surface is held by its back via an elastic film using a suction tool having a suction hole, the semiconductor chip is positioned against a substrate provided with connection wires corresponding to said conductive bumps, and the semiconductor chip is mounted onto the substrate in such a manner that the conductive bumps connect to said connection wires, and ultrasonic vibrations are applied from the suction tool to the semiconductor chip via said film while said semiconductor chip is being pressed against said substrate in order to bond said conductive bumps with said connection wires.
Inventors
- 👤 Tomohiro Okazaki
- 👤 Kenji Masumoto
- 👤 Mutsumi Masumoto
- 👤 Katsumi Yamaguchi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 07:13
CPC Classifications
B; B23; B23K; B23K20/00; B23K20/10; H; H05; H05K; H05K13/00; H05K13/04; H05K13/046; H05K13/0465; H10; H10W; H10W72/00; H10W72/071; H10W72/0711; H10W72/07141; H10W72/07178; H10W72/072; H10W72/07202; H10W72/07204; H10W72/07231; H10W72/07232; H10W72/07233; H10W72/07236; H10W72/07251; H10W72/20; H10W72/251; H10W72/252
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
92 words
Semiconductor chip mounting method utilizing ultrasonic vibrations comprising the steps of: holding a semiconductor chip having conductive bumps serving as connecting terminals on its main surface by its back via an elastic film using a suction tool having a suction hole, positioning said semiconductor chip against a substrate provided with connection wires corresponding to said conductive bumps, applying ultrasonic vibrations from said suction tool to said semiconductor chip via said film while said semiconductor chip is being pressed against said substrate in order to bond said conductive bumps with said connection wires.
Claim 2
Dependent Claim
92 words
Semiconductor chip mounting method utilizing ultrasonic vibrations comprising the steps of: holding a semiconductor chip having conductive bumps serving as connecting terminals on its main surface by its back via an elastic film using a suction tool having a suction hole, positioning said semiconductor chip against a substrate provided with connection wires corresponding to said conductive bumps, applying ultrasonic vibrations from said suction tool to said semiconductor chip via said film while said semiconductor chip is being pressed against said substrate in order to bond said conductive bumps with said connection wires.
Claim 3
Dependent Claim
45 words
Semiconductor chip mounting method utilizing ultrasonic vibrations described in claim 1 further comprising creating a hole on said film at the position corresponding to the suction hole of said suction tool when holding said semiconductor chip by suction via said film using said suction tool.
Claim 4
Dependent Claim
110 words
Semiconductor chip mounting method utilizing ultrasonic vibrations comprising the steps of: positioning a semiconductor chip having conductive bumps serving as connecting terminals on its main surface against a substrate provided with connection wires corresponding to said conductive bumps, mounting said semiconductor chip onto said substrate in such a manner that said conductive bumps connect to said connection wires and applying ultrasonic vibrations to said semiconductor chip from a pressing member via an elastic film while said semiconductor chip is being pressed against said substrate from the back of said semiconductor chip via said elastic film using said pressing member in order to bond said conductive bumps with said connection wires.
Claim 5
Dependent Claim
110 words
Semiconductor chip mounting method utilizing ultrasonic vibrations comprising the steps of: positioning a semiconductor chip having conductive bumps serving as connecting terminals on its main surface against a substrate provided with connection wires corresponding to said conductive bumps, mounting said semiconductor chip onto said substrate in such a manner that said conductive bumps connect to said connection wires and applying ultrasonic vibrations to said semiconductor chip from a pressing member via an elastic film while said semiconductor chip is being pressed against said substrate from the back of said semiconductor chip via said elastic film using said pressing member in order to bond said conductive bumps with said connection wires.
Claim 6
Dependent Claim
53 words
Semiconductor chip mounting method utilizing ultrasonic vibrations described in claim 1 , in which said film is shaped like a long tape, and an unused area of said film is fed into the space between said suction tool and the back of said semiconductor chip every time a new semiconductor chip is mounted.
Claim 7
Dependent Claim
38 words
Semiconductor chip mounting method utilizing ultrasonic vibrations described in claim 1 , in which the step for bonding said conductive bumps with said connection wires is carried out while applying a fixed level of tension to said film.
Claim 8
Dependent Claim
34 words
Semiconductor chip mounting method utilizing ultrasonic vibrations described in claim 1 , in which the step for bonding said conductive bumps with said connection wires is carried out while applying heat to said substrate.
Claim 9
Dependent Claim
23 words
Semiconductor chip mounting method utilizing ultrasonic vibrations described in claim 1 , in which said film is a 10-50 μm thick resin film.
Claim 10
Dependent Claim
20 words
Semiconductor chip mounting method utilizing ultrasonic vibrations described in claim 7 in which said film is a film utilizing fluororesin.
Claim 11
Dependent Claim
24 words
Semiconductor chip mounting method utilizing ultrasonic vibrations described in claim 7 in which said film is a film utilizing straight chain type polyimide resin.
Claim 12
Dependent Claim
53 words
The semiconductor chip mounting method utilizing ultrasonic vibrations described in claim 3 in which said film is shaped like a long tape, and an unused area of said film is fed into the space between said suction tool and the back of said semiconductor chip every time a new semiconductor chip is mounted.
Claim 13
Dependent Claim
38 words
The semiconductor chip mounting method utilizing ultrasonic vibrations described in claim 10 in which the step for bonding said conductive bumps with said connection wires is carried out while applying a fixed level of tension to said film.
Claim 14
Dependent Claim
34 words
The semiconductor chip mounting method utilizing ultrasonic vibrations described in claim 11 in which the step for bonding said conductive bumps with said connection wires is carried out while applying heat to said substrate.
Claim 15
Dependent Claim
23 words
The semiconductor chip mounting method utilizing ultrasonic vibrations described in claim 12 in which said film is a 10-50 μm thick resin film.
Claim 16
Dependent Claim
21 words
The semiconductor chip mounting method utilizing ultrasonic vibrations described in claim 13 in which said film is a film utilizing fluororesin.
Claim 17
Dependent Claim
25 words
The semiconductor chip mounting method utilizing ultrasonic vibrations described in claim 13 in which said film is a film utilizing straight chain type polyimide resin.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-08-06 | 2005-02-05 | 2005-08-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-08-06 | 2009-02-05 | 2009-08-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-08-06 | 2013-02-05 | 2013-08-07 | $7700.00 | Window Closed / Lapsed |