US6352467B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated electrodeposition and chemical mechanical polishing tool
Assignee: Applied Materials Inc
•
Filing: 2000-06-08
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Granted: 2002-03-05
•
Expires: 2020-06-08
Abstract
Abstract A fabrication tool integrates one or more electrodeposition stations with a CMP apparatus. The tool may transport substrates from the electroplating stations to the CMP apparatus without an intervening cleaning step. In addition, the thickness of an electrodeposited layer may be measured at a metrology station prior to polishing utilizing an instrument which physically contacts the surface of the substrate, and the measured thickness may be used to adjust the polishing parameters. Furthermore, the fabrication tool may have a single interface in which a dry and clean wafer is returned to the interface.
Inventors
- 👤 Sasson Somekh
- 👤 Debabrata Ghosh
- 👤 Bret W. Adams
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 03:49
CPC Classifications
H; H10; H10P; H10P95/00; H10P72/00; H10P72/30; H10P72/33; H10P72/3306; H10P72/04; H10P72/0451; H10P72/0452; H10P72/0454; H10P72/0456; H10P72/0468; H10P72/0472; H10P72/06; H10P72/0604; H10P72/3308; H10P72/3312; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/056
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
38 words
A method of manufacturing a semiconductor device, comprising: electrodepositing a metal layer onto a substrate using an aqueous chemical solution; and chemically-mechanically polishing the metal layer; wherein the substrate is not dried between the electrodeposition and polishing steps.
Claim 2
Independent Claim
38 words
A method of manufacturing a semiconductor device, comprising: electrodepositing a metal layer onto a substrate using an aqueous chemical solution; and chemically-mechanically polishing the metal layer; wherein the substrate is not dried between the electrodeposition and polishing steps.
Claim 3
Dependent Claim
10 words
The method of claim 1 wherein the metal is copper.
Claim 4
Dependent Claim
48 words
The method of claim 1 further comprising extracting the substrate from a slot in a cassette, transporting the substrate to an electrodeposition station for electrodeposition, transporting the substrate to a chemical mechanical polishing apparatus for polishing, and returning the substrate to the slot in the cassette following polishing.
Claim 5
Dependent Claim
18 words
The method of claim 3 further comprising cleaning the substrate prior to returning the substrate to the cassette.
Claim 6
Dependent Claim
17 words
The method of claim 1 further comprising measuring the thickness of the metal layer prior to polishing.
Claim 7
Dependent Claim
16 words
The method of claim 5 further comprising using the measured thickness to modify a polishing parameter.
Claim 8
Dependent Claim
16 words
The method of claim 5 further comprising using the measured thickness to modify an electrodeposition parameter.
Claim 9
Dependent Claim
16 words
The method of claim 5 further comprising measuring the thickness of the metal layer after polishing.
Claim 10
Dependent Claim
14 words
The method of claim 1 further comprising rinsing the substrate between electrodeposition and polishing.
Claim 11
Dependent Claim
14 words
The method of claim 1 further comprising cleaning and drying the substrate following polishing.
Claim 12
Independent Claim
48 words
A method of manufacturing a semiconductor device, comprising: withdrawing a substrate from a cassette; electrodepositing a metal layer onto the substrate; chemically-mechanically polishing the metal layer; and returning the substrate to the cassette, wherein the substrate is not returned to the cassette between the electrodeposition and polishing steps.
Claim 13
Independent Claim
48 words
A method of manufacturing a semiconductor device, comprising: withdrawing a substrate from a cassette; electrodepositing a metal layer onto the substrate; chemically-mechanically polishing the metal layer; and returning the substrate to the cassette, wherein the substrate is not returned to the cassette between the electrodeposition and polishing steps.
Claim 14
Dependent Claim
18 words
The method of claim 11 further comprising cleaning the substrate prior to returning the substrate to the cassette.
Claim 15
Dependent Claim
20 words
The method of claim 11 further comprising cleaning and drying the substrate prior to returning the substrate to the cassette.
Claim 16
Dependent Claim
21 words
The method of claim 11 further comprising rinsing the substrate with a solution which includes a surfactant prior to to electrodeposition.
Claim 17
Dependent Claim
13 words
The method of claim 11 further comprising rinsing the substrate prior to polishing.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-03-04 | 2005-09-03 | 2006-03-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-03-04 | 2009-09-03 | 2010-03-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-03-04 | 2013-09-03 | 2014-03-05 | $7700.00 | Window Closed / Lapsed |