US6414850B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for decoupling ball grid array devices
Assignee: Cisco Technology Inc
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Filing: 2000-01-11
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Granted: 2002-07-02
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Expires: 2020-01-11
Abstract
Abstract A small circuit board, preferably having or providing capacitance is mounted on the surface of a main circuit board opposite the surface where a BGA or other integrated circuit is mounted, and within the footprint defined the integrated circuit package. Preferably the small circuit board is formed from multiple interleaved conductive and dielectric layers to provide inherent capacitance in the circuit board itself. Capacitance provided by the small circuit board can be configured by selecting the number and/or size and/or placement of the conductive layers. Discrete devices can be mounted on the small circuit board if desired.
Inventors
- 👤 Frederic M. Kozak
- 👤 Real Gislain Pomerleau
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 22:34
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0216; H05K1/023; H05K1/0231; H05K1/16; H05K1/162; H05K1/14; H05K1/141; H05K2201/00; H05K2201/10; H05K2201/10431; H05K2201/10507; H05K2201/10545; H05K2201/10613; H05K2201/10621; H05K2201/10734
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
184 words
Electronic apparatus comprising: a main circuit both having first and second major surfaces; at least a first ball grid array (BGA) integrated circuit package coupled to said first major surface of said main circuit board and defining a first footprint area on said first major surface and a second footprint area, substantially aligned with said first footprint area, on said second major surface, said BGA package having at least a first power supply pin; a decoupling board coupled to said second major surface of said main circuit board at least partially overlapping said second footprint area, said decoupling board having, as at least a portion of said board, at least a first plurality of conductive layers spaced apart by dielectric layers, said first plurality of conductive layers being electrically coupled together to define a first multilayer capacitor configured to accommodate an amount of decoupling capacitance, said decoupling board being solder-ball mounted to said second major surface of said main circuit board; and a first conductive pathway between said first multilayer capacitor and said first power supply pin, said conductive pathway having a first length.
Claim 2
Dependent Claim
184 words
Electronic apparatus comprising: a main circuit both having first and second major surfaces; at least a first ball grid array (BGA) integrated circuit package coupled to said first major surface of said main circuit board and defining a first footprint area on said first major surface and a second footprint area, substantially aligned with said first footprint area, on said second major surface, said BGA package having at least a first power supply pin; a decoupling board coupled to said second major surface of said main circuit board at least partially overlapping said second footprint area, said decoupling board having, as at least a portion of said board, at least a first plurality of conductive layers spaced apart by dielectric layers, said first plurality of conductive layers being electrically coupled together to define a first multilayer capacitor configured to accommodate an amount of decoupling capacitance, said decoupling board being solder-ball mounted to said second major surface of said main circuit board; and a first conductive pathway between said first multilayer capacitor and said first power supply pin, said conductive pathway having a first length.
Claim 3
Dependent Claim
38 words
Apparatus, as claimed in claim 1 , wherein said first power supply pin is spaced a first distance from a closest edge of said first footprint area and wherein said first length is less than said first distance.
Claim 4
Dependent Claim
82 words
Apparatus, as claimed in claim 1 ; wherein said decoupling board has, as at least a portion of said board a second plurality of conductive layers spaced apart by dielectric layers, said second plurality of conductive layers being electrically coupled together to define a second multilayer capacitor; and wherein said first power supply pin comprises a power pin; and further comprising a ground pin in said BGA package; and a second conductive pathway between said second multilayer capacitor and said ground pin.
Claim 5
Dependent Claim
18 words
Apparatus as claimed in claim 1 wherein said dielectric has a dielectric constant of at least about 4.
Claim 6
Dependent Claim
21 words
Apparatus, as claimed in claim 1 , further comprising at least a first discrete electronic component surface-mounted on said decoupler board.
Claim 7
Dependent Claim
20 words
Apparatus, as claimed in claim 1 , wherein said first conductive pathway comprises a via formed in said decoupling board.
Claim 8
Dependent Claim
22 words
Apparatus, as claimed in claim 1 , wherein said first conductive pathway comprises a first edge plating region of said decoupling board.
Claim 9
Independent Claim
172 words
A method for decoupling a power supply pin of a ball grid array (BGA) integrated circuit package comprising: providing a main circuit board having first and second major surfaces; coupling said BGA package to said first major surface of said main circuit board, defining a first footprint area on said first major surface and a second footprint area, substantially aligned with said first footprint area, on said second major surface; mounting a decoupling board to said second major surface of said main circuit board at least partially overlapping said second major surface, said decoupling board having, as at least a portion of said board, at least a first plurality of conductive layers spaced apart by dielectric layers said mounting including solder-ball mounting said decoupling board; electrically coupling said first plurality of conductive layers together to define a first multilayer capacitor configured to accommodate an amount of decoupling capacitance; and forming a first conductive pathway between said first multilayer capacitor and said first power supply pin, said conductive pathway having a first length.
Claim 10
Independent Claim
172 words
A method for decoupling a power supply pin of a ball grid array (BGA) integrated circuit package comprising: providing a main circuit board having first and second major surfaces; coupling said BGA package to said first major surface of said main circuit board, defining a first footprint area on said first major surface and a second footprint area, substantially aligned with said first footprint area, on said second major surface; mounting a decoupling board to said second major surface of said main circuit board at least partially overlapping said second major surface, said decoupling board having, as at least a portion of said board, at least a first plurality of conductive layers spaced apart by dielectric layers said mounting including solder-ball mounting said decoupling board; electrically coupling said first plurality of conductive layers together to define a first multilayer capacitor configured to accommodate an amount of decoupling capacitance; and forming a first conductive pathway between said first multilayer capacitor and said first power supply pin, said conductive pathway having a first length.
Claim 11
Dependent Claim
39 words
A method, as claimed in claim 8 , wherein said first power supply pin is spaced a first distance from a closest edge of said first footprint area and wherein said first length is less than said first distance.
Claim 12
Dependent Claim
86 words
A method, as claimed in claim 8 wherein said decoupling board has, as at least a portion of said board a second plurality of conductive layers spaced apart by dielectric layers, said second plurality of conductive layers being electrically coupled together to define a second multilayer capacitor, and wherein said first power supply pin comprises a power pin and wherein said BGA package also includes a ground pin, the method further comprising forming a second conductive pathway between said second multilayer capacitor and said ground pin.
Claim 13
Dependent Claim
19 words
A method as claimed in claim 8 wherein said dielectric has a dielectric constant of at least about 4.
Claim 14
Dependent Claim
22 words
A method, as claimed in claim 8 , further comprising surface-mounting at least a first discrete electronic component on said decoupling board.
Claim 15
Dependent Claim
23 words
A method, as claimed in claim 8 , wherein said forming said first conductive pathway comprises forming a via in said decoupling board.
Claim 16
Dependent Claim
30 words
A method, as claimed in claim 8 , wherein said step of forming said first conductive pathway comprises at least partially plating a first edge region of said decoupling board.
Claim 17
Dependent Claim
177 words
Apparatus for decoupling a power supply pin of a ball grid array (BGA) integrated circuit package comprising: a main circuit board having first and second major surfaces; means for coupling said BGA package to said first major surface of said main circuit board, defining a first footprint area on said first major surface and a second footprint area, substantially aligned with said first footprint area, on said second major surface; decoupling means configured to accommodate an amount of decoupling capacitance, mounted to said second major surface of said main circuit board at least partially overlapping said second major surface, said decoupling means having, as at least a portion of said decoupling means, at least a first plurality of conductive layers spaced apart by dielectric layers; solder-ball means for mounting said decoupling means to said second major surface; means for electrically coupling said first plurality of conductive layers together to define a first multilayer capacitor; and first conductive pathway means between said first multilayer capacitor and said first power supply pin, said conductive pathway having a first length.
Claim 18
Dependent Claim
177 words
Apparatus for decoupling a power supply pin of a ball grid array (BGA) integrated circuit package comprising: a main circuit board having first and second major surfaces; means for coupling said BGA package to said first major surface of said main circuit board, defining a first footprint area on said first major surface and a second footprint area, substantially aligned with said first footprint area, on said second major surface; decoupling means configured to accommodate an amount of decoupling capacitance, mounted to said second major surface of said main circuit board at least partially overlapping said second major surface, said decoupling means having, as at least a portion of said decoupling means, at least a first plurality of conductive layers spaced apart by dielectric layers; solder-ball means for mounting said decoupling means to said second major surface; means for electrically coupling said first plurality of conductive layers together to define a first multilayer capacitor; and first conductive pathway means between said first multilayer capacitor and said first power supply pin, said conductive pathway having a first length.
Claim 19
Dependent Claim
38 words
Apparatus, as claimed in claim 15 , wherein said first power supply pin is spaced a first distance from a closest edge of said first footprint area and wherein said first length is less than said first distance.
Claim 20
Dependent Claim
85 words
Apparatus, as claimed in claim 15 wherein said decoupling means has, as at least a portion of said decoupling means, a second plurality of conductive layers spaced apart by dielectric layers, said second plurality of conductive layers being electrically coupled together to define a second multilayer capacitor, and wherein said first power supply pin comprises a power pin and wherein said BGA package also includes a ground pin, the apparatus further comprising second conductive pathway means between said second multilayer capacitor and said ground pin.
Claim 21
Dependent Claim
18 words
Apparatus as claimed in claim 15 wherein said dielectric has a dielectric constant of at least about 4.
Claim 22
Dependent Claim
21 words
Apparatus as claimed in claim 15 , further comprising at least a first discrete electronic means surface-mounted on said decoupling means.
Claim 23
Dependent Claim
20 words
Apparatus as claimed in claim 15 , wherein said first conductive pathway means comprises via means in said decoupling means.
Claim 24
Dependent Claim
25 words
Apparatus as claimed in claim 15 , wherein said first conductive pathway means comprises plating means on a first edge region of said decoupling means.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-07-01 | 2005-12-31 | 2006-07-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-07-01 | 2009-12-31 | 2010-07-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-07-01 | 2013-12-31 | 2014-07-02 | $7700.00 | Window Closed / Lapsed |