Abstract A silicon nitride read-only memory that prevents the antenna effect is described. The structure of the silicon nitride read-only memory includes a word-line, an electron-trapping layer and a metal protection layer. The word line covers the substrate. The electron-trapping layer is positioned between the word line and the substrate. The metal protection line covers the substrate and electrically connects the word line to a grounding doped region in the substrate. Moreover, the resistance of the metal protection line is higher than that of the word line. The charges generated during the manufacturing process are conducted to the substrate through the metal protection line. The resistance of the metal protection line is also higher than that of the word line. The metal protection line can be burnt out by a high current after the completion of the manufacturing process to ensure a normal operation for the read-only memory.
A silicon nitride read-only memory (NROM) that prevents an antenna effect, comprising: a substrate having an isolation structure and a grounding doped region therein; a word line that covers the substrate; an electron-trapping layer, and wherein the electron-trapping layer is positioned between the word line and the substrate; a dielectric layer covering the word line, the grounding doped region and substrate; a metal interconnect on the dielectric layer, wherein the metal line is electrically connected to the word line; and a metal protection line on the dielectric layer and over the isolation structure and the metal protection line electrically connects the word line and the grounding doped region in the substrate, wherein a resistance of the protection line is higher than that of the word line and wherein the metal protection line has a thickness smaller than that of the metal interconnect.
Claim 2
Dependent Claim
142 words
A silicon nitride read-only memory (NROM) that prevents an antenna effect, comprising: a substrate having an isolation structure and a grounding doped region therein; a word line that covers the substrate; an electron-trapping layer, and wherein the electron-trapping layer is positioned between the word line and the substrate; a dielectric layer covering the word line, the grounding doped region and substrate; a metal interconnect on the dielectric layer, wherein the metal line is electrically connected to the word line; and a metal protection line on the dielectric layer and over the isolation structure and the metal protection line electrically connects the word line and the grounding doped region in the substrate, wherein a resistance of the protection line is higher than that of the word line and wherein the metal protection line has a thickness smaller than that of the metal interconnect.
Claim 3
Dependent Claim
19 words
The NROM of claim 1 , wherein the word line comprises a metal silicide layer and a polysilicon layer.
Claim 4
Dependent Claim
26 words
The NROM of claim 1 , wherein the resistance of the metal protection line is higher than that of the polysilicon layer of the word line.
Claim 5
Dependent Claim
21 words
The NROM of claim 1 , wherein the metal protection line is connected to the grounding doped region through a contact.
Claim 6
Dependent Claim
24 words
The NROM of claim 1 , wherein the electron-trapping layer is a silicon nitride layer of a silicon oxide/silicon nitride/silicon oxide (ONO) structure layer.