← Back to Patent Explorer
US7629666B2 Active / In Force US ⏱️ 1.6 years remaining

Method and structure for implanting bonded substrates for electrical conductivity

Assignee: Silicon Genesis Corp
•
Filing: 2008-06-12
•
Granted: 2009-12-08
•
Expires: 2028-06-12
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract A partially completed multi-layered substrate, e.g., silicon on silicon. The substrate has a thickness of material from a first substrate. The thickness of material comprises a first face region. The substrate has a second substrate having a second face region. Preferably, the first face region of the thickness of material is joined to the second face region of the second substrate. The substrate has an interface region formed between the first face region of the thickness of material and the second face region of the second substrate. A plurality of particles are implanted within a portion of the thickness of the material and a portion of the interface region to electrically couple a portion of the thickness of material to a portion of the second substrate.

Inventors

  • 👤 Francois J. Henley

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-08 07:00
CPC Classifications
H; H10; H10P; H10P30/00; H10P30/20; H10P30/21; H10P30/202; H10P30/204; H10P30/28

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 113 words
A partially completed multi-layered substrate comprising: a thickness of material from a first substrate, the thickness of material comprising a first face region; a second substrate having a second face region, the first face region of the thickness of material being joined to the second face region of the second substrate; an interface region formed between the first face region of the thickness of material and the second face region of the second substrate; and a plurality of particles implanted within a portion of the thickness of the material and a portion of the interface region to electrically couple a portion of the thickness of material to a portion of the second substrate.
Claim 2
Dependent Claim 113 words
A partially completed multi-layered substrate comprising: a thickness of material from a first substrate, the thickness of material comprising a first face region; a second substrate having a second face region, the first face region of the thickness of material being joined to the second face region of the second substrate; an interface region formed between the first face region of the thickness of material and the second face region of the second substrate; and a plurality of particles implanted within a portion of the thickness of the material and a portion of the interface region to electrically couple a portion of the thickness of material to a portion of the second substrate.
Claim 3
Dependent Claim 12 words
The substrate of claim 1 wherein the first substrate comprises silicon material.
Claim 4
Dependent Claim 12 words
The substrate of claim 1 wherein the second substrate comprises silicon material.
Claim 5
Dependent Claim 17 words
The substrate of claim 1 wherein the plurality of particles comprise at least 1018 particles/cm 3 .
Claim 6
Dependent Claim 30 words
The substrate of claim 1 wherein the plurality of particles in the portion of the thickness of material cause an amorphous characteristic in the portion of the thickness of material.
Claim 7
Dependent Claim 24 words
The substrate of claim 5 wherein the portion of the thickness of material can be converted from the amorphous characteristic to a crystalline characteristic.

References Cited (Backward Citations)

US20080041517A1 Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2012-12-07 2013-06-08 2013-12-08 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2016-12-07 2017-06-08 2017-12-08 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2020-12-07 2021-06-08 2021-12-08 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag