USH498H
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electronic component including soldered electrical leads
Assignee: AT&T Inc
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Filing: 1984-08-31
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Granted: 1988-07-05
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Expires: 2004-08-31
Abstract
Abstract Disclosed is an electronic component which includes soldered leads (30 and 31) for electrical connection to other components. The electronic component is typically a film or hybrid integrated circuit formed on an insulating substrate (10) which includes contact pads (20-23) on the periphery. Clip-on type leads (30 and 31) are soldered to these pads. The leads include a thin layer of nickel (36) formed at least in the jaw (32) of the clip-on lead to prevent the formation of brittle intermetallics by the interaction of solder components with the lead components.
Inventors
- 👤 Harry N. Keller
- 👤 Joseph M. Morabito
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 04:51
CPC Classifications
H; H01; H01R; H01R12/00; H01R12/50; H01R12/51; H01R12/55; H01R12/57; H01R4/00; H01R4/58; H01R4/02
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
101 words
An electronic component comprising: an insulating substrate; a plurality of circuit elements formed on the substrate; a plurality of contact pads formed at the periphery of said substrate and electrically connected to said circuit elements; a plurality of electrical leads comprising copper each clipped onto at least one corresponding contact pad and soldered thereto with a solder including tin, said leads comprising a layer consisting essentially of nickel on the surface of the lead with a thickness of 1-4 μm in at least some area of the portion clipped to said pad in order to prevent significant formation of copper-tin intermetallics.
Claim 2
Dependent Claim
101 words
An electronic component comprising: an insulating substrate; a plurality of circuit elements formed on the substrate; a plurality of contact pads formed at the periphery of said substrate and electrically connected to said circuit elements; a plurality of electrical leads comprising copper each clipped onto at least one corresponding contact pad and soldered thereto with a solder including tin, said leads comprising a layer consisting essentially of nickel on the surface of the lead with a thickness of 1-4 μm in at least some area of the portion clipped to said pad in order to prevent significant formation of copper-tin intermetallics.
Claim 3
Dependent Claim
12 words
The device according to claim 1 wherein the solder further comprises Pb.
Claim 4
Dependent Claim
23 words
The device according to claim 1 wherein the substrate comprises two major surfaces and the contact pads are formed on both major surfaces.
Claim 5
Dependent Claim
57 words
An electrical lead comprising copper for attachment to a contact pad formed on a substrate comprising a portion adapted for clipping onto the pad, a layer consisting essentially of nickel formed over at least some area of said portion with a thickness of 1-4 μm, and a layer of solder including tin formed over said nickel layer.
Claim 6
Dependent Claim
57 words
An electrical lead comprising copper for attachment to a contact pad formed on a substrate comprising a portion adapted for clipping onto the pad, a layer consisting essentially of nickel formed over at least some area of said portion with a thickness of 1-4 μm, and a layer of solder including tin formed over said nickel layer.
References Cited (Backward Citations)
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Cited
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Cited
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-07-05 | 1992-01-04 | 1992-07-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-07-05 | 1996-01-04 | 1996-07-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-07-05 | 2000-01-04 | 2000-07-05 | $7700.00 | Window Closed / Lapsed |