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EP0071255A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Portable card for information processing

Assignee: Siemens AG
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Filing: 1982-07-27
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Granted: —
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Expires: 2002-07-27
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Abstract

Abstract This card comprises a semiconductor chip (5) arranged in the card, and external connecting areas (3) which are connected to the contacting areas (17) of the semiconductor chip (5) by means of a conductor network (6). The semiconductor chip (5) takes the form of a micropack consisting of a plastic intermediate carrier (7) which is provided with a window (8), exhibiting a greater area than the semiconductor chip (5), and which is provided on one side with a metallic conductor network (6), the connecting fingers (18) of which, intended for contacting the contacting areas (17), project into the window (8), the contacting areas (17) of the semiconductor chip (5) being in contact with the ends of the connecting fingers (18) projecting into the window (8) for electrical contacting and for mechanical holding of the chip (5), arranged in the card (4) consisting of a card body (2) and at least one cover foil (25). The micropack is manufactured as a unit (1) which can be fitted into a window-like recess (21) in the card body (2) and the thickness of which approximately corresponds to the thickness of the card body (2) and on one surface of which the external connecting areas (3) are arranged. <IMAGE>

Inventors

  • 👤 Hans Dr. Rer.Nat. Ullrich
  • 👤 Detlev Ing.Grad. Schmitter
  • 👤 Volker Ing. Grad. Rohde

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-10-29 09:05
CPC Classifications
G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/07745; H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/699; H10W74/00; H10W74/10; H10W74/111; H10W74/121; H10W72/00; H10W72/701

Claims Analysis

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