Abstract a A multilayer wiring substrate comprising two groups of power supply wiring layers each containing a plurality of power supply wiring layers for supplying a plurality of different voltages, respectively, and a plurality of insulating layers. A plurality of first via-hole wirings connect each of the power supply wiring layers in -a first of the groups to a corresponding one of the power supply wiring layers in a second of the groups. On a bottom surface of the second group of wiring layers there are a plurality of terminals which are connected to the wiring layers by a plurality of second via-hole wirings. A signal wiring layer section containing a plurality of thin film signal wiring layers, a plurality of insulating layers and a plurality of third via-hole wirings connecting the signal wiring layers to each other is provided on the first group of power supply wiring layers. Finally, each of a plurality of internal wirings has one end exposed at the top surface of the signal wiring layer section and another end connected to the power supply wiring layers in the first group.
A multilayer wiring substrate comprising: a first power supply wiring layer group having a plurality of first power supply wiring layers for supplying a plurality of different voltages, respectively, and a plurality of first insulating layers for insulating the wiring layers from each other; a second power supply wiring layer groups having a plurality of second power supply wiring layers, each being in one-to-one correspondence to said plurality of first power supply wiring layers, a plurality of second insulating layers for insulating the second power supply wiring layers from each other; a plurality of first via-hole wirings for connecting each of said first power supply wiring layers and a corresponding one of said second power supply wiring layers; a plurality of terminals provided on the bottom surface of said second power supply wiring layer group; a plurality of second via-hole wirings for connecting said terminals to said plurality of power supply wiring layers; a signal wiring layer section having a plurality of thin film signal wiring layers, a plurality of third insulating layers for insulating the signal wiring layers from each other, and a plurality of third via-hole wirings for connecting said signal wiring layers to each other and provided on said first power supply wiring layer group; and a plurality of internal wirings whose one ends are exposed on the top surface of said signal wiring layer section and whose the other ends are connected to said plurality of first power supply wiring layers.
Claim 2
Dependent Claim
245 words
A multilayer wiring substrate comprising: a first power supply wiring layer group having a plurality of first power supply wiring layers for supplying a plurality of different voltages, respectively, and a plurality of first insulating layers for insulating the wiring layers from each other; a second power supply wiring layer groups having a plurality of second power supply wiring layers, each being in one-to-one correspondence to said plurality of first power supply wiring layers, a plurality of second insulating layers for insulating the second power supply wiring layers from each other; a plurality of first via-hole wirings for connecting each of said first power supply wiring layers and a corresponding one of said second power supply wiring layers; a plurality of terminals provided on the bottom surface of said second power supply wiring layer group; a plurality of second via-hole wirings for connecting said terminals to said plurality of power supply wiring layers; a signal wiring layer section having a plurality of thin film signal wiring layers, a plurality of third insulating layers for insulating the signal wiring layers from each other, and a plurality of third via-hole wirings for connecting said signal wiring layers to each other and provided on said first power supply wiring layer group; and a plurality of internal wirings whose one ends are exposed on the top surface of said signal wiring layer section and whose the other ends are connected to said plurality of first power supply wiring layers.
Claim 3
Dependent Claim
55 words
A multilayer wiring substrate as claimed in Claim 1, in which the number of said first via-hole wirings connecting one of said first power supply wiring layers to a corresponding one of said second power supply wiring layers is determined depending on a direct current resistance value required for the corresponding power supply wiring layer.
Claim 4
Dependent Claim
21 words
A multilayer wiring substrate as claimed in Claim 1, in which each of said third insulating layers is made of polyimide.
Claim 5
Dependent Claim
30 words
The multilayer wiring substrate as claimed in Claim 3, in which each of said third via hole wirings is made of a material including a mixture of gold and polyimide.
References Cited (Backward Citations)
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